Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product
US-2019055344-A1 · Feb 21, 2019 · US
Resin molded body
US2021087667A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021087667-A1 |
| Application number | US-201916970372-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 28, 2019 |
| Priority date | Apr 23, 2018 |
| Publication date | Mar 25, 2021 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter of 20 μm or more and 100 μm or less. The intermediate layer has a thickness of 50 μm or more and 250 μm or less. The central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship of b≥2a, and the inorganic filler is contained in the intermediate layer in an amount of 40% to 65% as a volume ratio.
First claim
Opening claim text (preview).
1 . A resin molded body comprising: a resin structure; an intermediate layer comprising an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure; and a thermal sprayed ceramic coating provided on the intermediate layer, wherein the inorganic filler is amorphous in shape and has a central particle diameter of 20 μm or more and 100 μm or less, and wherein the intermediate layer has a thickness of 50 μm or more and 250 μm or less, and the central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship of b≥ 2 a , and the inorganic filler is contained in the intermediate layer in an amount of 40% to 65% as a volume ratio. 2 . The resin molded body according to claim 1 , wherein the organic resin binder in the intermediate layer is an epoxy resin. 3 . The resin molded body according to claim 2 , wherein the organic resin binder in the intermediate layer comprises at least one or more of a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a biphenyl type epoxy resin, or a naphthalene type epoxy resin. 4 . The resin molded body according to claim 1 , wherein the inorganic filler in the intermediate layer comprise at least one or more selected from a group consisting of alumina and a composite metal oxide containing an aluminum element. 5 . The resin molded body according to claim 4 , wherein the inorganic filler in the intermediate layer contains at least one or more selected from a group consisting of aluminum, a metal capable of forming an alloy with aluminum, and an aluminum alloy containing metal elements thereof.
Assignees
Inventors
Classifications
Unsaturated polyesters · CPC title
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
Improving the adhesiveness of the coatings per se, e.g. forming primers (adhesives in the form of films or foils characterised by the primer layers between the polymer carriers and the adhesives C09J7/50) · CPC title
esters · CPC title
with glass fibres · CPC title
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- What does patent US2021087667A1 cover?
- A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter of 20 μm or more and 100 μm or less. The interm…
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08J7/0423. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Mar 25 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).