Integrated heat pump bundled module mounting manifold

US2021086587A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021086587-A1
Application numberUS-201916577613-A
CountryUS
Kind codeA1
Filing dateSep 20, 2019
Priority dateSep 20, 2019
Publication dateMar 25, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A vehicle HVAC system including a heat pump system. The heat pumps system including a refrigerant module mounting manifold, the manifold including a first plate and a second plate. The first plate and the second plate are configured to couple together such that together they define a plurality of channels for directing the flow of refrigerant through the heat pump system. One or more auxiliary modules are fluidly coupled to the refrigerant module mounting manifold.

First claim

Opening claim text (preview).

What is claimed is: 1 . A refrigerant manifold comprising: a first plate; and a second plate coupled with the first plate to define a plurality of channels for directing the flow of refrigerant through the manifold. 2 . The refrigerant manifold of claim 1 , further comprising a manifold module integrally formed with one of the first plate and the second plate. 3 . The refrigerant manifold of claim 2 , wherein the manifold module comprises a liquid-gas separator valve. 4 . The refrigerant manifold of claim 2 , wherein the manifold module comprises an expansion valve integrally formed therewith, and wherein the manifold is configured to couple to an expansion valve motor for controlling operation of the expansion valve. 5 . The refrigerant manifold of claim 2 , wherein the manifold module comprises a valve integrally formed with the manifold and configured to direct the flow of refrigerant through the manifold. 6 . The refrigerant manifold of claim 1 , wherein one of the first plate and the second plate defines a plug and the other of the first plate and the second plate defines a socket configured to couple to the plug such that the socket and the plug together define a channel for directing the flow of refrigerant. 7 . The refrigerant manifold of claim 1 , wherein the first plate and the second plate are coupled together such that they form a seal for preventing a leakage of refrigerant from the plurality of channels. 8 . The refrigerant manifold of claim 1 , further comprising a gasket positioned between the first plate and the second plate to prevent a leakage of refrigerant from the manifold. 9 . The refrigerant manifold of claim 1 , wherein the refrigerant manifold is operably coupled to an HVAC system of a vehicle. 10 . A heat pump system comprising: a manifold for directing refrigerant flow through the system, the manifold comprising: a first plate; a second plate coupled to the first plate wherein the first plate and the second plate together define a plurality of channels configured to direct the flow of refrigerant through the system; and a manifold module integrally formed with one of the first plate and the second plate; and an auxiliary module fluidly coupled to the manifold. 11 . The heat pump system of claim 10 , wherein the auxiliary module comprises an accumulator. 12 . The heat pump system of claim 11 , wherein the accumulator comprises an accumulator case, an accumulator cartridge, and an accumulator cap, wherein the accumulator case is integrally formed with one of the first plate and the second plate and is configured to couple to the accumulator cartridge and the accumulator cap. 13 . The heat pump system of claim 11 , wherein each of the first plate and the second plate comprise a portion of an accumulator case integrally formed therewith, the accumulator case configured to couple to an accumulator cartridge and an accumulator cap. 14 . The heat pump system of claim 10 , wherein the auxiliary module comprises a heat exchanger, a muffler, a liquid-gas separator valve, an expansion valve, an accumulator, a compressor, a check valve, a stop valve, a three-way valve, a four-way valve, or a combination thereof. 15 . The heat pump system of claim 10 , wherein the heat pump system is operably connected to an HVAC system of a vehicle. 16 . A vehicle comprising: a heat pump system comprising: a refrigerant manifold comprising a first plate and a second plate wherein the first plate and the second plate coupled together such that together they define a plurality of channels for directing the flow of refrigerant through the heat pump system; and an auxiliary module fluidly coupled to the refrigerant manifold. 17 . The vehicle of claim 16 , wherein the refrigerant manifold further comprises a manifold module integrally formed with the refrigerant manifold. 18 . The vehicle of claim 17 , wherein the manifold module comprises an expansion valve. 19 . The vehicle of claim 18 , wherein the refrigerant manifold is coupled to an expansion valve motor for controlling the flow of refrigerant through the expansion valve. 20 . The vehicle of claim 16 , wherein the refrigerant manifold further comprises an accumulator casing integrally formed therewith.

Assignees

Inventors

Classifications

  • characterised by constructional features, e.g. housings, mountings, conversion systems (B60H1/3227, B60H1/3233 take precedence) · CPC title

  • Noise reduction · CPC title

  • of the compression type · CPC title

  • of liquid ducts, e.g. for coolant liquids or refrigerants · CPC title

  • using compression (B60H1/3233 takes precedence) · CPC title

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Frequently asked questions

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What does patent US2021086587A1 cover?
A vehicle HVAC system including a heat pump system. The heat pumps system including a refrigerant module mounting manifold, the manifold including a first plate and a second plate. The first plate and the second plate are configured to couple together such that together they define a plurality of channels for directing the flow of refrigerant through the heat pump system. One or more auxiliary …
Who is the assignee on this patent?
Ford Global Tech Llc
What technology area does this patent fall under?
Primary CPC classification B60H1/00571. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 25 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).