Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells
US-2024380401-A1 · Nov 14, 2024 · US
US2021083175A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021083175-A1 |
| Application number | US-201816629895-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 31, 2018 |
| Priority date | Sep 4, 2017 |
| Publication date | Mar 18, 2021 |
| Grant date | — |
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A spin-orbit-torque magnetization rotational element includes: a ferromagnetic metal layer, a magnetization direction of the ferromagnetic metal layer being configured to change; a spin-orbit torque wiring which extends in the first direction intersecting a lamination direction of the ferromagnetic metal layer and is joined to the ferromagnetic metal layer; and two via wires, each of which extends in a direction intersecting the spin-orbit torque wiring from a surface of the spin-orbit torque wiring opposite to a side with the ferromagnetic metal layer and is connected to a semiconductor circuit, wherein a via-to-via distance between the two via wires in the first direction is shorter than a width of the ferromagnetic metal layer in the first direction.
Opening claim text (preview).
1 . A spin-orbit-torque magnetization rotational element, comprising: a ferromagnetic metal layer, a magnetization direction of the ferromagnetic metal layer being configured to change; a spin-orbit torque wiring which extends in a first direction intersecting a lamination direction of the ferromagnetic metal layer and is joined to the ferromagnetic metal layer; and two via wires, each of which extends in a direction intersecting the spin-orbit torque wiring from a surface of the spin-orbit torque wiring opposite to a side with the ferromagnetic metal layer and is connected to a semiconductor circuit, wherein a via-to-via distance between the two via wires in the first direction is shorter than a width of the ferromagnetic metal layer in the first direction. 2 . The spin-orbit-torque magnetization rotational element according to claim 1 , wherein the spin-orbit torque wiring has a laminated structure in a lamination direction thereof, and a resistance value of a first layer of the spin-orbit torque wiring provided on the ferromagnetic metal layer side is lower than a resistance value of a second layer of the spin-orbit torque wiring provided on the via wires side. 3 . The spin-orbit-torque magnetization rotational element according to claim 1 , further comprising: a planarizing layer between the via wires and the spin-orbit torque wiring. 4 . The spin-orbit-torque magnetization rotational element according to claim 3 , wherein the planarizing layer is made of a nitride containing Ti or Ta. 5 . The spin-orbit-torque magnetization rotational element according to claim 1 , wherein, in a lamination surface for the ferromagnetic metal layer to be laminated thereon, a Vickers hardness difference between the two via wires and an interlayer insulating part configured to insulate between the two via wires is 3 GPa or less. 6 . The spin-orbit-torque magnetization rotational element according to claim 1 , further comprising: a non-magnetic layer and a magnetization fixed layer, a magnetization direction of the magnetization fixed layer being configured to be fixed to the ferromagnetic metal layer provided on a surface of the ferromagnetic metal layer opposite to a side with the spin-orbit torque wiring. 7 . The spin-orbit-torque magnetization rotational element according to claim 6 , wherein an area of the ferromagnetic metal layer when viewed in a plan view from a vertical direction is larger than an area of the magnetization fixed layer when viewed in a plan view from the vertical direction. 8 . (canceled) 9 . The spin-orbit-torque magnetization rotational element according to claim 2 , wherein, in a lamination surface for the ferromagnetic metal layer to be laminated thereon, a Vickers hardness difference between the two via wires and an interlayer insulating part configured to insulate between the two via wires is 3 GPa or less. 10 . The spin-orbit-torque magnetization rotational element according to claim 3 , wherein, in a lamination surface for the ferromagnetic metal layer to be laminated thereon, a Vickers hardness difference between the two via wires and an interlayer insulating part configured to insulate between the two via wires is 3 GPa or less. 11 . The spin-orbit-torque magnetization rotational element according to claim 4 , wherein, in a lamination surface for the ferromagnetic metal layer to be laminated thereon, a Vickers hardness difference between the two via wires and an interlayer insulating part configured to insulate between the two via wires is 3 GPa or less. 12 . The spin-orbit-torque magnetization rotational element according to claim 4 , further comprising: a non-magnetic layer and a magnetization fixed layer, a magnetization direction of the magnetization fixed layer being configured to be fixed to the ferromagnetic metal layer provided on a surface of the ferromagnetic metal layer opposite to a side with the spin-orbit torque wiring. 13 . The spin-orbit-torque magnetization rotational element according to claim 5 , further comprising: a non-magnetic layer and a magnetization fixed layer, a magnetization direction of the magnetization fixed layer being configured to be fixed to the ferromagnetic metal layer provided on a surface of the ferromagnetic metal layer opposite to a side with the spin-orbit torque wiring. 14 . A magnetic memory comprising: a plurality of the spin-orbit-torque magnetization rotational elements according to claim 13 . 15 . The spin-orbit-torque magnetization rotational element according to claim 2 , further comprising: a planarizing layer between the via wires and the spin-orbit torque wiring. 16 . The spin-orbit-torque magnetization rotational element according to claim 15 , wherein the planarizing layer is made of a nitride containing Ti or Ta. 17 . The spin-orbit-torque magnetization rotational element according to claim 2 , further comprising: a non-magnetic layer and a magnetization fixed layer, a magnetization direction of the magnetization fixed layer being configured to be fixed to the ferromagnetic metal layer provided on a surface of the ferromagnetic metal layer opposite to a side with the spin-orbit torque wiring. 18 . The spin-orbit-torque magnetization rotational element according to claim 17 , wherein an area of the ferromagnetic metal layer when viewed in a plan view from a vertical direction is larger than an area of the magnetization fixed layer when viewed in a plan view from the vertical direction. 19 . A magnetic memory comprising: a plurality of the spin-orbit-torque magnetization rotational elements according to claim 17 . 20 . The spin-orbit-torque magnetization rotational element according to claim 3 , further comprising: a non-magnetic layer and a magnetization fixed layer, a magnetization direction of the magnetization fixed layer being configured to be fixed to the ferromagnetic metal layer provided on a surface of the ferromagnetic metal layer opposite to a side with the spin-orbit torque wiring. 21 . A magnetic memory comprising: a plurality of the spin-orbit-torque magnetization rotational elements according to claim 20 .
Devices controlled by magnetic fields · CPC title
details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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