Powder for additive manufacturing, additively manufactured body, method for producing additively manufactured body, and method for producing metal sintered body

US2021069785A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021069785-A1
Application numberUS-202017016493-A
CountryUS
Kind codeA1
Filing dateSep 10, 2020
Priority dateSep 10, 2019
Publication dateMar 11, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A powder for additive manufacturing, which is a powder to be used in a three-dimensional additive manufacturing method, including a plurality of coated particles containing metal particles, and resin coating films that cover the metal particles and contain a caking additive, wherein 0.0001≤t/D50≤0.0010 in which t is an average thickness of the resin coating films and D50 is an average particle diameter of the metal particles.

First claim

Opening claim text (preview).

What is claimed is: 1 . A powder for additive manufacturing, which is a powder to be used in a three-dimensional additive manufacturing method, comprising a plurality of coated particles containing metal particles, and resin coating films that cover the metal particles and contain a caking additive, wherein 0.0001≤t/D50≤0.0010 in which t is an average thickness of the resin coating films and D50 is an average particle diameter of the metal particles. 2 . The powder for additive manufacturing according to claim 1 , wherein the average particle diameter D50 of the metal particles is 0.1 μm or more and 5.0 μm or less. 3 . The powder for additive manufacturing according to claim 1 , wherein the resin coating films have hydrophobicity. 4 . The powder for additive manufacturing according to claim 1 , wherein the resin coating films contain a surfactant. 5 . The powder for additive manufacturing according to claim 1 , wherein the caking additive has a glass transition temperature of room temperature or lower. 6 . An additively manufactured body, comprising the powder for additive manufacturing according to claim 1 . 7 . A method for producing an additively manufactured body, which is a method for producing an additively manufactured body by a three-dimensional additive manufacturing method, comprising: a powder layer formation step of forming a powder layer using a powder for additive manufacturing including a plurality of coated particles containing metal particles and resin coating films that cover the metal particles and contain a caking additive; and a caking additive dissolution step of dissolving the caking additive in the powder layer by supplying a solvent to a supply area of the powder layer so as to join the metal particles to one another in the supply area, thereby obtaining a binded body, wherein 0.0001≤t/D50≤0.0010 in which t is an average thickness of the resin coating films and D50 is an average particle diameter of the metal particles. 8 . A method for producing a metal sintered body, comprising: a degreasing step of subjecting an additively manufactured body produced by the method for producing an additively manufactured body according to claim 7 to a degreasing treatment, thereby obtaining a degreased body; and a firing step of firing the degreased body, thereby obtaining a metal sintered body.

Assignees

Inventors

Classifications

  • B22F1/052Primary

    characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • Metallic powder characterised by the size or surface area of the particles · CPC title

  • Metallic powder coated with organic material · CPC title

  • Products made by additive manufacturing · CPC title

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What does patent US2021069785A1 cover?
A powder for additive manufacturing, which is a powder to be used in a three-dimensional additive manufacturing method, including a plurality of coated particles containing metal particles, and resin coating films that cover the metal particles and contain a caking additive, wherein 0.0001≤t/D50≤0.0010 in which t is an average thickness of the resin coating films and D50 is an average particle …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B22F1/052. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).