Logic circuitry

US2021053353A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021053353-A1
Application numberUS-201916965825-A
CountryUS
Kind codeA1
Filing dateApr 5, 2019
Priority dateDec 3, 2018
Publication dateFeb 25, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor circuit for a replaceable print apparatus component comprises an interface to transmit signals with respect to a print apparatus logic circuit, and further comprises, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell sensor that is nominally different than the other cells.

First claim

Opening claim text (preview).

What is claimed is: 1 . A sensor circuit for a replaceable print apparatus component comprising an interface to transmit signals with respect to a print apparatus logic circuit, further comprising, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell sensor that is nominally different than the other cells. 2 . (canceled) 3 . (canceled) 4 . The sensor circuit of claim 1 , further including a third cell array to stimulate one of the sensor cell arrays. 5 . The sensor circuit of claim 1 , at least four different cell classes of nominally different sensor cells. 6 . The sensor circuit of claim 1 , further including calibration logic configured to condition output signal transmission based on calibration parameters received through the interface. 7 . The sensor circuit of claim 6 wherein the calibration logic includes at least one of an offset circuit and an amplifier gain setting circuit. 8 . The sensor circuit of claim 6 wherein the calibration logic is configured to change a transmitted signal based on an offset parameter by an amount that is a function of the amplifier parameter. 9 . (canceled) 10 . The sensor circuit of claim 1 configured to select sensor cell arrays based on received class parameters, and cells of selected sensor cell arrays based on received sub-class parameters. 11 . The sensor circuit of claim 10 wherein different sensor cell arrays have the same amount of cells that are selectable by the same sub-class parameters. 12 . The sensor circuit of claim 10 wherein different sensor cell arrays are selectable by different class parameters. 13 . The sensor circuit of claim 10 further including at least four different cell classes selectable by said class parameters 14 . The sensor circuit of claim 10 further including multiplex logic to select any of said cell classes and/or cells based on received class and/or sub-class parameters, respectively. 15 . The sensor circuit of claim 1 , further including multiplex logic to select any of the cells. 16 . The sensor circuit of claim 1 , further including common calibration logic to calibrate a plurality of cell classes, wherein the calibration logic includes the offset circuit and/or the amplifier gain setting circuit wherein each circuit is to calibrate at least two sensor cell arrays. 17 . (canceled) 18 . The sensor circuit of claim 1 , having a length that is at least ten times greater than a width and/or thickness wherein each cell of each array is provided at a different location along the length. 19 . The sensor circuit of claim 1 , wherein a first sensor cell is configured to detect a pneumatic stimulus or pressurization applied to the replaceable component, wherein a first sensor cell array includes a plurality of first sensor cells, and wherein the pneumatic stimulus is associated with air pressure being applied to the replaceable print component by the print apparatus. 20 . (canceled) 21 . (canceled) 22 . The sensor circuit of claim 19 , wherein the or each first sensor cell is configured to detect a deformation of a reservoir wall and/or a pressure in a liquid reservoir. (Currently Amended) The sensor circuit of claim 19 , wherein the or each first sensor cell comprises a strain sensing component, such as a strain sensing resistor and/or strain gauge. 24 . The sensor circuit of claim 1 , further including: at least one second sensor cell to sense an absence or presence of liquid at the respective cell; and a second sensor cell array of said second sensor cells configured to measure a print liquid level in a print liquid reservoir to which the sensor circuit can be mounted. 25 . (canceled) 26 . The sensor circuit of claim 24 , wherein the second sensor cell array comprises a temperature sensor cell array and calibration logic comprises a heater or heater array so that upon activating at least one associated heater a different output of the temperature sensor cell can be associated with being covered or not by print liquid. 27 . The sensor circuit of claim 24 , wherein the temperature sensor cell and heater each comprise a nominally different resistor. 28 . The sensor circuit of claim 1 , further including at least one single cell sensor nominally and/or physically different than the sensor cell arrays, the at least one respective single cell sensor including a resistor, wherein cells of a second sensor cell array include serpentine-shaped resistors. 29 . (canceled) 30 . The sensor circuit of claim 28 , wherein the resistor comprises a wire that is part of thin film circuitry, and configured to detect cracks in the thin film circuitry 31 . The sensor circuit of claim 1 , further including at least one single cell sensor nominally different than the sensor cell arrays, the at least one single cell sensor including a diode, wherein the diode is configured to return a signal that corresponds to an absolute temperature characteristic of the sensor circuit. 32 - 43 . (canceled)

Assignees

Inventors

Classifications

  • on a serial bus, e.g. I2C bus, SPI bus (on daisy chain buses G06F13/4247) · CPC title

  • Key transport or distribution, i.e. key establishment techniques where one party creates or otherwise obtains a secret value, and securely transfers it to the other(s) (network architectures or network communication protocols for key distribution in a packet data network H04L63/062) · CPC title

  • Modules · CPC title

  • Register structure · CPC title

  • Protecting access to data via a platform, e.g. using keys or access control rules · CPC title

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What does patent US2021053353A1 cover?
A sensor circuit for a replaceable print apparatus component comprises an interface to transmit signals with respect to a print apparatus logic circuit, and further comprises, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell …
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B41J2/17566. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Feb 25 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).