Laminate for manufacturing flexible display, and flexible display manufacturing method using same

Patent metadata

Field	Value
Publication number	US-2021053328-A1
Application number	US-201916958295-A
Country	US
Kind code	A1
Filing date	Sep 11, 2019
Priority date	Sep 11, 2018
Publication date	Feb 25, 2021
Grant date	—

Abstract

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350° C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.

First claim

1 . A laminate comprising:
a carrier substrate; a debonding layer formed on the carrier substrate and comprising a polyimide having a negative value of coefficient of thermal expansion (CTE) at a temperature of 350° C. or higher; and a flexible substrate layer formed on the debonding layer.

2 . The laminate according to claim 1 , wherein the debonding layer has a first area having a surface opposite side of the carrier substrate, and the flexible substrate layer has a second area, wherein the second area is larger than the first area and completely covers the first area of the debonding layer.

3 . The laminate according to claim 1 , wherein the polyimide in the debonding layer comprises a polymerization and curing product of a diamine and a dianhydride, wherein the diamine is in excess of the equivalent ratio relative to the dianhydride.

4 . The laminate according to claim 1 , wherein the debonding layer comprises a polymerization and curing product of a dianhydride comprising biphenyl tetracarboxylic dianhydride (BPDA) and a diamine comprising phenylenediamine (PDA).

5 . The laminate according to claim 4 , wherein the dianhydride further comprises pyromellitic dianhydride (PMDA), and the diamine further comprises 2,2′-bis(trifluoromethyl)benzidine (TFMB).

6 . The laminate according to claim 5 , wherein the combination of dianhydride and diamine is selected from BPDA-PDA, BPDA-PMDA-PDA and BPDA-PDA-TFMB.

7 . The laminate according to claim 6 , wherein the combination of dianhydride and diamine is BPDA-PDA-TFMB and the amount of TFMB is at least 5 mol % of the total diamine.

8 . The laminate according to claim 6 , wherein the combination of dianhydride and diamine is BPDA-PMDA-PDA and the amount of PMDA is at least 5 mol % of the total dianhydride.

9 . The laminate according to claim 1 , wherein the debonding layer has a thickness of 50 nm or more and 1 μm or less.

10 . The laminate according to claim 1 , wherein the flexible substrate layer includes a polyimide having a positive value of CTE at a temperature of at least 350° C.

11 . A process for manufacturing a flexible display, comprising the steps of:
forming a device on the flexible substrate layer included in the laminate according to claim 1 ; and peeling the flexible substrate layer on which the device is formed from the debonding layer.

12 . The process for manufacturing a flexible display according to claim 11 , wherein
the debonding layer has a first area, the flexible substrate layer is formed to have a second area larger than the first area and completely covering the first area of the debonding layer, and the device is formed on a surface of the flexible substrate layer that is an opposite side of the debonding layer in a region where the debonding layer and the flexible substrate layer overlap.

13 . The process for manufacturing a flexible display according to claim 12 , wherein the step of peeling the flexible substrate layer comprises cutting in a direction perpendicular to the carrier substrate at each of inner edges of the region where the debonding layer and the flexible substrate layer overlap and separating the flexible substrate layer from the debonding layer such that the debonding layer and cross sections of the flexible substrate layer are exposed.

14 . The process for manufacturing a flexible display according to claim 11 , wherein a peeling strength for peeling off the flexible substrate layer from the debonding layer during the peeling is 0.05 N/cm or less.

15 . The process for manufacturing a flexible display according to claim 11 , wherein the peeling the flexible substrate layer on which the device is formed from the debonding layer included in the laminate does not comprises a process of causing a chemical or physical change in a surface between the debonding layer and the flexible substrate layer.

Assignees

• Lg Chemical Ltd

Inventors

• Park Jinyoung
• Lee Jinho
• Park Chae Won

Classifications

• B32B17/101

  having a predetermined coefficient of thermal expansion [CTE] · CPC title

• C08G73/1007

  from tetracarboxylic acids or derivatives and diamines · CPC title

• B32B2305/72

  Cured, e.g. vulcanised, cross-linked · CPC title

• C08G73/1039

  comprising halogen-containing substituents · CPC title

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title