Multilayer ceramic electronic device and component mounting substrate

Patent metadata

Field	Value
Publication number	US-2021035743-A1
Application number	US-202016945260-A
Country	US
Kind code	A1
Filing date	Jul 31, 2020
Priority date	Jul 31, 2019
Publication date	Feb 4, 2021
Grant date	—

Abstract

A multilayer ceramic electronic device includes a ceramic main body and a pair of external electrodes respectively covering a pair of end surfaces of the ceramic main body, wherein the ceramic main body includes a laminated body including a plurality of internal electrodes laminated vertically therein, and a pair of side margin parts respectively covering a pair of side surfaces of the laminated body, and wherein a distance between a bottom surface of the ceramic main body and the bottommost internal electrode is greater than a distance between the top surface of the ceramic main body and the topmost internal electrode.

First claim

What is claimed is:

1 . A multilayer ceramic electronic device, comprising:
a ceramic main body having a first main surface facing a first direction, a second main surface facing a direction opposite to the first direction, a pair of side surfaces respectively facing a second direction that is perpendicular to the first direction and a direction opposite to the second direction, and a pair of end surfaces respectively facing a third direction that is perpendicular to the first and second directions and a direction opposite to the third direction; and a pair of external electrodes respectively covering the pair of end surfaces, the pair of external electrodes respectively extending from the end surfaces to the second main surface, wherein the ceramic main body includes:
a laminated body having a first cover part forming the first main surface, a second cover part forming the second main surface, and a plurality of internal electrodes laminated in the first direction, disposed between the first cover part and the second cover part; and
a pair of side margin parts respectively covering a pair of side surfaces of the laminated body that respectively face the second direction and the direction opposite to the second direction, the pair of side margin parts forming the pair of side surfaces of the ceramic main body, and
wherein a distance, along the first direction, between the second main surface and the internal electrode that is the closest to the second main surface among the plurality of the internal electrodes is greater than a distance, along the first direction, between the first main surface and the internal electrode that is the closest to the first main surface among the plurality of the internal electrodes.

2 . The multilayer ceramic electronic device according to claim 1 ,
wherein in the ceramic main body, each of ridge parts that connect the second main surface to the pair of the side surfaces and the pair of the end surfaces of the ceramic main body is chamfered, and wherein said distance, along the first direction, between the second main surface and the internal electrode that is the closest to the second main surface among the plurality of the internal electrodes is equal to or greater than 2.5 times as large as a dimension, along the first direction, of chamfered parts of the ridge parts.

3 . A multilayer ceramic electronic device, comprising:
a ceramic main body having a first main surface facing a first direction, a second main surface facing a direction opposite to the first direction, a pair of side surfaces respectively facing a second direction that is perpendicular to the first direction and a direction opposite to the second direction, and a pair of end surfaces respectively facing a third direction that is perpendicular to the first and second directions and a direction opposite to the third direction, the ceramic main body including a laminated body and a pair of side margin parts; and a pair of external electrodes respectively covering the pair of end surfaces, the pair of external electrodes respectively extending from the end surfaces to the second main surface, wherein the laminated body of the ceramic main body includes:
a first cover part forming the first main surface;
a second cover part forming the second main surface;
a plurality of first internal electrodes; and
a plurality of second internal electrodes,
wherein the plurality of first internal electrodes are laminated in the first direction, disposed between the first cover part and the second cover part, and in a plan view as seen from the direction opposite to the first direction, each of overlap areas between the plurality of first internal electrodes has a same shape and same dimensions, wherein the plurality of second internal electrodes are laminated in the first direction, disposed between the plurality of first internal electrodes and the second cover part, and in said plan view, along at least one of the second and third directions, each of overlap areas between the plurality of second internal electrodes is positioned inside said overlap areas between the plurality of first electrodes, and wherein said pair of side margin parts of the laminated body respectively cover a pair of side surfaces of the laminated body that respectively face the second direction and the direction opposite to the second direction, the pair of side margin parts forming the pair of side surfaces of the ceramic main body.

4 . The multilayer ceramic electronic device according to claim 3 ,
wherein lateral edges, along the second direction, of the plurality of first internal electrodes are positioned on the pair of side surfaces of the laminated body, and wherein lateral edges, along the second direction, of the plurality of second internal electrodes are positioned on inner sides of the pair of side surfaces of the laminated body.

5 . The multilayer ceramic electronic device according to claim 4 , wherein in said plan view, a dimension of the overlap areas between the plurality of second internal electrodes along the third direction is smaller than a dimension of the overlap areas between the plurality of first electrodes along the third direction.

6 . The multilayer ceramic electronic device according to claim 4 , wherein the pair of external electrodes respectively extend from the pair of end surfaces to the pair of side surfaces of the ceramic main body.

7 . The multilayer ceramic electronic device according to claim 3 ,
wherein lateral edges, along the second direction, of the plurality of first internal electrodes and lateral edges, along the second direction, of the plurality of second internal electrodes are both positioned on the pair of side surfaces of the laminated body, and wherein in said plan view, a dimension of the overlap areas between the plurality of second internal electrodes along the third direction is smaller than a dimension of the overlap areas between the plurality of first electrodes along the third direction.

8 . The multilayer ceramic electronic device according to claim 7 , wherein the pair of external electrodes do not extend from the end surfaces to the pair of side surfaces.

9 . The multilayer ceramic electronic device according to claim 3 , wherein a distance, along the first direction, between the second main surface and the first internal electrode that is the closest to the second main surface among the plurality of the first internal electrodes is greater than a distance, along the first direction, between the first main surface and the first internal electrode that is the closest to the first main surface among the plurality of the first internal electrodes.

10 . A component mount substrate, comprising:
the multilayer ceramic electronic device as set forth in claim 1 ; a circuit substrate having a mounting surface that faces the second main surface of the multilayer ceramic electronic device and a pair of electrodes pads on the mounting surface; and solders that comment the pair of the external electrodes of the multilayer ceramic electronic device to the pair of electrode pads, respectively.

11 . A component mount substrate, comprising:
the multilayer ceramic electronic device as set forth in claim 3 ; a circuit substrate having a mounting surface that faces the second main surface of the multilayer ceramic electronic device and a pair of electrodes pads on the mounting surface; and solders that comment the pair of the external electrodes of the multilayer ceramic electronic device to the pair of electrode pads, respectively.

Assignees

• Taiyo Yuden Kk

Inventors

• Nakamura Tomoaki
• Tahara Mikio
• Suga Yasutomo
• Fukuoka Tetsuhiko

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H05K3/3431

  Leadless components · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title