Imaging device

Patent metadata

Field	Value
Publication number	US-2021028210-A1
Application number	US-201917043373-A
Country	US
Kind code	A1
Filing date	Mar 20, 2019
Priority date	Apr 4, 2018
Publication date	Jan 28, 2021
Grant date	—

Abstract

An imaging device includes: a wiring substrate; an image sensor package mounted on the wiring substrate; a package frame attached to a light receiving surface side of the image sensor package; and a lens holder arranged to cover the package frame and holding a lens unit so that the lens unit faces the light receiving surface of the image sensor package. The package frame includes a material having a larger coefficient of linear expansion than a material of the lens holder, and includes a wall portion that extends in a direction perpendicular to the wiring substrate toward the wiring substrate. A gap is provided between the wall portion of the package frame and the image sensor package, and between an end of the wall portion of the package frame and the wiring substrate. The lens holder includes a wall portion facing the wall portion of the package frame. An end of the wall portion of the lens holder is fixed to the end of the wall portion of the package frame while being separated from the wiring substrate.

First claim

1 . An imaging device comprising:
a wiring substrate; an image sensor package mounted on the wiring substrate; a package frame attached to a light receiving surface side of the image sensor package; and a lens holder arranged to cover the package frame and holding a lens unit so that the lens unit faces the light receiving surface of the image sensor package, wherein the package frame includes a material having a larger coefficient of linear expansion than a material of the lens holder, and includes a wall portion that extends in a direction perpendicular to the wiring substrate toward the wiring substrate, a gap is provided between the wall portion of the package frame and the image sensor package, and between an end of the wall portion of the package frame and the wiring substrate, the lens holder includes a wall portion facing the wall portion of the package frame, and an end of the wall portion of the lens holder is fixed to the end of the wall portion of the package frame while being separated from the wiring substrate.

2 . The imaging device according to claim 1 , wherein
the material of the package frame and a length of the wall portion of the package frame extending in the direction perpendicular to the wiring substrate, and the material of the lens holder and a length of the wall portion of the lens holder extending in the direction perpendicular to the wiring substrate are selected, so that a distance between the light receiving surface of the image sensor package and the lens unit is kept constant regardless of an ambient temperature.

3 . The imaging device according to claim 1 , wherein
the material of the package frame and a length of the wall portion of the package frame extending in the direction perpendicular to the wiring substrate, and the material of the lens holder and a length of the wall portion of the lens holder extending in the direction perpendicular to the wiring substrate are set, so that a distance between the light receiving surface of the image sensor package and the lens unit changes with a predetermined sensitivity according to an ambient temperature.

4 . The imaging device according to claim 3 , wherein
the change in the distance between the light receiving surface of the image sensor package and the lens unit with the predetermined sensitivity according to the ambient temperature compensates for an influence of a characteristic change of the lens unit that occurs according to the ambient temperature.

5 . The imaging device according to claim 1 , wherein
the package frame includes a resin material.

6 . The imaging device according to claim 1 , wherein
the lens holder includes a metal material.

7 . The imaging device according to claim 1 , wherein
a lens included in the lens unit includes a glass material or a plastic material.

8 . The imaging device according to claim 1 , wherein
a cushion member is arranged between the end of the wall portion of the lens holder and the wiring substrate.

9 . The imaging device according to claim 8 , wherein
the cushion member includes a sponge material.

10 . The imaging device according to claim 1 , wherein
the end of the wall portion of the lens holder is fixed to a surface of a flange provided on the end of the wall portion of the package frame.

11 . The imaging device according to claim 1 , wherein
a side surface near the end of the wall portion of the lens holder is fixed to a side surface near the end of the wall portion of the package frame.

12 . The imaging device according to claim 1 , wherein
a side surface near the end of the wall portion of the lens holder is fixed to a side surface near the end of the wall portion of the package frame by a fixing member.

13 . The imaging device according to claim 1 , wherein
a side surface near the end of the wall portion of the lens holder is fixed to a side surface near the end of the wall portion of the package frame by fitting.

14 . The imaging device according to claim 1 , wherein
a step for setting a mounting position of the lens holder is provided near the end of the wall portion of the package frame.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Okamoto Hideo
• Murai Makoto

Classifications

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• G03B17/02

  Bodies · CPC title

• G03B30/00

  Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles · CPC title