Integrated circuit including clubfoot structure conductive patterns

Patent metadata

Field	Value
Publication number	US-2021013230-A1
Application number	US-202017034602-A
Country	US
Kind code	A1
Filing date	Sep 28, 2020
Priority date	May 21, 2018
Publication date	Jan 14, 2021
Grant date	—

Abstract

An integrated circuit includes a standard cell. The standard cell may include a plurality of gate lines and a plurality of first wirings. The plurality of first wirings may include a clubfoot structure conductive pattern that includes a first conductive pattern and a second conductive pattern spaced apart from each other. Each of the first conductive pattern and the second conductive pattern may include a first line pattern extending in a first direction and a second line pattern protruding from one end of the first line pattern in a direction perpendicular to the first direction. The plurality of gate lines may be spaced apart from each other by a first pitch in the first direction, and the plurality of second wirings may be spaced apart from each other by a second pitch in the first direction. The first pitch may be greater than the second pitch.

First claim

1 . An integrated circuit comprising:
a standard cell defined by a cell boundary, the standard cell including, a plurality of gate lines spaced apart from each other by a first pitch, and a clubfoot structure conductive pattern on a upper layer of the plurality of gate lines,
the clubfoot structure conductive pattern including a first conductive pattern and a second conductive pattern apart from each other,
each of the first conductive pattern and the second conductive pattern including a first line pattern and a second line pattern protruding from one end of the first line pattern.

2 . The integrated circuit of claim 1 , wherein a distance between the second line pattern of the first conductive pattern and the second line pattern of the second conductive pattern is equal to the first pitch.

3 . The integrated circuit of claim 1 , further comprising:
a plurality of wirings on a upper layer of the standard cell, wherein the plurality of wirings are spaced apart from each other by a second pitch, and the second pitch is less than the first pitch.

4 . The integrated circuit of claim 3 , wherein the plurality of gate lines, the plurality of wirings, the second line pattern of the first conductive pattern and the second line pattern of the second conductive pattern are extending in a same direction.

5 . The integrated circuit of claim 3 , wherein a ratio of the first pitch to the second pitch is about 3:2.

6 . The integrated circuit of claim 3 , wherein at least one wiring among the plurality of wirings is aligned with the cell boundary.

7 . The integrated circuit of claim 3 , wherein the plurality of wirings are spaced apart from the cell boundary.

8 . The integrated circuit of claim 1 , wherein the plurality of gate lines are spaced apart from each other by the first pitch in a first direction, and
a width of the standard cell in the first direction has a value of an even number multiple of the first pitch.

9 . The integrated circuit of claim 1 , wherein the plurality of gate lines are spaced apart from each other by the first pitch in a first direction, and
a width of the standard cell in the first direction has a value of an odd number multiple of the first pitch.

10 . The integrated circuit of claim 1 , wherein the first conductive pattern and the second conductive pattern are symmetrical to each other.

11 . An integrated circuit comprising:
a standard cell including, a first active region and a second active region respectively extending in a first direction, a plurality of gate lines respectively extending in a second direction, a plurality of power lines for supplying power to the standard cell, and a clubfoot structure conductive pattern including a first conductive pattern including a first line pattern extending in the first direction and a second line pattern extending in the second direction, wherein the clubfoot structure conductive pattern is electrically connected to at least one of the gate lines.

12 . The integrated circuit of claim 11 , wherein a plurality of fins are formed in each of the first active region and the second active region.

13 . The integrated circuit of claim 11 , wherein the clubfoot structure conductive pattern is arranged between the first active region and the second active region.

14 . The integrated circuit of claim 11 , wherein the standard cell further includes a first via configured to electrically connect the clubfoot structure conductive pattern to the at least one of the gate lines.

15 . The integrated circuit of claim 14 , further comprising:
a plurality of wirings respectively expending in the second direction, wherein the clubfoot structure conductive pattern and at least one of the plurality of wirings are electrically connected through a second via.

16 . The integrated circuit of claim 15 , wherein the first via and the second via overlap in a third direction perpendicular to the first direction and the second direction.

17 . The integrated circuit of claim 15 , wherein the first via is formed to contact one line pattern among the first line pattern of the first conductive pattern and the second line pattern of the first conductive pattern, and
the second via are formed to contact another line pattern among the first line pattern of the first conductive pattern and the second line pattern of the first conductive pattern.

18 . The integrated circuit of claim 11 , wherein the clubfoot structure conductive pattern further includes a second conductive pattern including a first line pattern extending in the first direction and a second line pattern extending in the second direction.

19 . The integrated circuit of claim 18 , wherein the first conductive pattern and the second conductive pattern symmetrical to each other.

20 . An integrated circuit comprising:
a first standard cell and a second standard cell that each include a plurality of gate lines, the plurality of gate lines being spaced apart from each other by a first pitch in a first direction and extending in a second direction perpendicular to the first direction, at least one of the first standard cell and the second standard cell including a clubfoot structure that includes a conductive pattern, the conductive pattern including a first line pattern extending in the first direction and a second line pattern protruding in a direction perpendicular to the first direction from one end of the first line pattern; and a plurality of wirings on an upper layer of the first standard cell and on an upper layer the second standard cell, the plurality of wiring being spaced apart from each other by a second pitch in the first direction, the plurality of wirings extending in the second direction, and the second pitch being less than the first pitch.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Do Jung-Ho
• Yu Ji-Su
• You Hyeon-Gyu
• Lee Seung-Young
• Lee Jae-Boong
• Jung Jong-Hoon

Classifications

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10D89/10 Primary

  Integrated device layouts · CPC title

• H10D84/987

  Three levels of metal · CPC title