Structurally reinforced sensor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2021003526-A1
Application number	US-201916503235-A
Country	US
Kind code	A1
Filing date	Jul 3, 2019
Priority date	Jul 3, 2019
Publication date	Jan 7, 2021
Grant date	—

Abstract

Sensors and methods for manufacturing sensors are provided. An exemplary method for manufacturing a sensor includes forming an electrode lead pattern over an insulator base substrate. Further, the method includes forming a structural backing layer over the electrode lead pattern and insulator base substrate. Also, the method includes performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.

First claim

What is claimed is:

1 . A method for manufacturing a sensor, the method comprising:
forming an electrode lead pattern over an insulator base substrate; forming a structural backing layer over the electrode lead pattern and insulator base substrate; and performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.

2 . The method of claim 1 , further comprising forming an upper insulator over the insulator base substrate and adjacent the electrode lead pattern before forming the structural backing layer over the electrode lead pattern and insulator base substrate.

3 . The method of claim 1 , further comprising forming an upper insulator over the structural backing and the insulator base substrate after performing the cutting process to cut through the structural backing layer to form the structural backing over the electrode lead pattern.

4 . The method of claim 1 , further comprising forming an underlying layer of titanium or chromium over the electrode lead pattern and insulator base substrate, wherein forming the structural backing layer over the electrode lead pattern and insulator base substrate comprises forming the structural backing layer over the underlying layer of titanium or chromium.

5 . The method of claim 1 further comprising forming an upper insulator over the insulator base substrate, wherein the insulator base substrate is polyimide, wherein the electrode lead pattern is formed from gold and/or titanium, wherein the structural backing layer is polyimide, and wherein the upper insulator is polyimide.

6 . The method of claim 1 wherein performing the cutting process to cut through the structural backing layer to form the structural backing over the electrode lead pattern comprises simultaneously cutting through the structural backing layer and the insulator base substrate.

7 . The method of claim 1 wherein:
forming the electrode lead pattern over the insulator base substrate comprises forming the electrode lead pattern with a first terminal lead, a second terminal lead, and intermediate leads located between the first terminal lead and the second terminal lead;
the electrode lead pattern has a width extending from the first terminal lead to the second terminal lead; and
performing the cutting process to cut through the structural backing layer to form the structural backing over the electrode lead pattern comprises covering the electrode lead pattern over the width continuously from the first terminal lead to the second terminal lead.

8 . The method of claim 1 wherein:
forming the electrode lead pattern over the insulator base substrate comprises forming the electrode lead pattern with a first terminal lead, a second terminal lead, and intermediate leads located between the first terminal lead and the second terminal lead;
the electrode lead pattern has a width extending from the first terminal lead to the second terminal lead; and
performing the cutting process to cut through the structural backing layer to form the structural backing over the electrode lead pattern comprises cutting the structural backing layer into distinct segments, wherein the structural backing layer does not cover the electrode lead pattern over the width continuously from the first terminal lead to the second terminal lead.

9 . The method of claim 1 further comprising forming the insulator base substrate over a wafer before forming the electrode lead pattern over the insulator base substrate.

10 . A method for manufacturing sensors, the method comprising:
forming an insulator base substrate over a wafer; forming a plurality of electrode lead patterns over the insulator base substrate; forming a structural backing layer over the plurality of electrode lead patterns and insulator base substrate; and performing a cutting process to cut through the structural backing layer to form a structural backing over each respective electrode lead pattern.

11 . The method of claim 10 , further comprising forming an upper insulator over the insulator base substrate and adjacent each respective electrode lead pattern before forming the structural backing layer over the plurality of electrode lead patterns and insulator base substrate.

12 . The method of claim 10 , further comprising forming an upper insulator over each respective structural backing and the insulator base substrate after performing the cutting process to cut through the structural backing layer to form each respective structural backing.

13 . The method of claim 10 , further comprising forming an underlying layer of titanium or chromium over the electrode lead pattern and insulator base substrate, wherein forming the structural backing layer over the plurality of electrode lead patterns and insulator base substrate comprises forming the structural backing layer over the underlying layer of titanium or chromium.

14 . The method of claim 10 further comprising forming an upper insulator over the insulator base substrate, wherein the insulator base substrate is polyimide, wherein the plurality of electrode lead patterns is formed from gold and/or titanium, wherein the structural backing layer is polyimide, and wherein the upper insulator is polyimide.

15 . The method of claim 10 wherein performing the cutting process to cut through the structural backing layer to form each respective structural backing comprises simultaneously cutting through the structural backing layer and the insulator base substrate.

16 . The method of claim 10 wherein:
forming the plurality of electrode lead patterns over the insulator base substrate comprises forming each electrode lead pattern with a first terminal lead, a second terminal lead, and intermediate leads located between the first terminal lead and the second terminal lead;
each electrode lead pattern has a width extending from the first terminal lead to the second terminal lead; and
performing the cutting process to cut through the structural backing layer to form each respective structural backing comprises covering each electrode lead pattern over the respective width continuously from the first terminal lead to the second terminal lead.

17 . The method of claim 10 wherein:
forming the plurality of electrode lead patterns over the insulator base substrate comprises forming each electrode lead pattern with a first terminal lead, a second terminal lead, and intermediate leads located between the first terminal lead and the second terminal lead;
each electrode lead pattern has a width extending from the first terminal lead to the second terminal lead; and
performing the cutting process to cut through the structural backing layer to form each respective structural backing comprises cutting the structural backing layer into distinct segments, wherein each structural backing layer does not cover the respective electrode lead pattern over the respective width continuously from the first terminal lead to the second terminal lead.

18 . A sensor comprising:
an insulator base substrate; an electrode lead pattern over the insulator base substrate; a structural backing layer over the electrode lead pattern and insulator base substrate.

19 . The sensor of claim 18 further comprising an upper insulator over the insulator base substrate, wherein the structural backing layer is located over the upper insulator.

20 . The sensor of claim 18 further comprising an upper insulator over the insulator base substrate, the elect

Assignees

• Medtronic Minimed Inc

Inventors

• Pai Christina
• Mcgee Brian P
• Askarinya Mohsen
• Coe Mary Ellen B
• Jones Cynthia J
• Chung Hsiu-Hsin
• Hobbs Nathan
• Nieto Jorge L
• Chakraborty Anirban

Classifications

• G01N27/3272 Primary

  Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels (optical biosensors G01N33/52) · CPC title