Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

Patent metadata

Field	Value
Publication number	US-2021002520-A1
Application number	US-202017025188-A
Country	US
Kind code	A1
Filing date	Sep 18, 2020
Priority date	Sep 27, 2012
Publication date	Jan 7, 2021
Grant date	—

Abstract

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

First claim

1 . A method of making an article with improved structural integrity, comprising the steps of:
(a) providing a first substrate having a first and a second side; (b) preparing an adhesive composition by combining (i) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof; (ii) about 0.5% to about 5%, based on the total weight of the adhesive, of a plurality of microspheres; (c) applying the adhesive onto the first side of the first substrate; (d) providing a second substrate having a first and a second side; (e) contacting the first side of the second substrate directly on the adhesive to form the article; (f) applying heat or radiation to expand the expandable microspheres; and (g) drying the adhesive to form a bond adhering the first and the second substrates; wherein the article has substantially similar thermal insulation loss with up to about 26% decrease in substrate basis weight than an article without the microspheres.

2 . The method of claim 1 wherein the substrate is a fiberboard, corrugated board, SBS, kraft paper, coated paper, oriented polypropylene film.

3 . The method of claim 1 wherein the basis weight of the substrate ranges from 2 to 35 pounds per 1000 ft 2 .

4 . The method of claim 1 , wherein the boards and papers comprise a portion of recycled fiber.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Huang Tianjian
• Thompson Kristina
• Waski Daniel
• Meccia John

Classifications

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title

• D21H17/37

  Polymers of unsaturated acids or derivatives thereof, e.g. polyacrylates · CPC title

• B32B2317/12

  Paper, e.g. cardboard · CPC title

• B32B37/06

  characterised by the heating method · CPC title

• D21H17/57

  Polyureas; Polyurethanes · CPC title