Cutting platform and cutting equipment

Patent metadata

Field	Value
Publication number	US-2021001457-A1
Application number	US-202016908823-A
Country	US
Kind code	A1
Filing date	Jun 23, 2020
Priority date	Jul 3, 2019
Publication date	Jan 7, 2021
Grant date	—

Abstract

The present application relates to the field of cutting technology, specifically, to a cutting platform and cutting equipment. The cutting platform may include a first bonding surface, a second bonding surface, and a cutting groove. The second bonding surface is opposite to the first bonding surface, and is used for bonding with a piece to be cut. The cutting groove penetrates the first bonding surface and the second bonding surface, and corresponds to the cutting path of a cutting device, and the cutting groove includes a first groove wall surface and second groove wall surface opposite to each other. A distance between the first groove wall surface and the second groove wall surface increases in a direction from the second bonding surface to the first bonding surface. The solution of the present application can improve product quality and equipment production efficiency.

First claim

What is claimed is:

1 . A cutting platform, comprising:
a first bonding surface; a second bonding surface that is opposite to the first bonding surface and is used for bonding with a piece to be cut; a cutting groove that penetrates the first bonding surface and the second bonding surface and corresponds to a cutting path of a cutting device, and comprises a first groove wall surface and a second groove wall surface opposite to each other; wherein a distance between the first groove wall surface and the second groove wall surface increases in a direction from the second bonding surface to the first bonding surface.

2 . The cutting platform according to claim 1 , further comprising a vacuum hole that penetrates the first bonding surface and the second bonding surface that is provided on at least one side of the cutting groove.

3 . The cutting platform according to claim 2 , wherein the diameter of the vacuum hole does not change in a direction from the second bonding surface to the first bonding surface, and a minimum distance on the second bonding surface between the vacuum hole and the cutting groove is less than or equal to 10 mm.

4 . The cutting platform according to claim 1 , wherein at least one of the first groove wall surface and the second groove wall surface is an inclined plane, and the inclined plane is inclined in a direction close to the first bonding surface.

5 . The cutting platform according to claim 4 , wherein the first bonding surface is a horizontal bonding surface, and an angle between the inclined plane and the first bonding surface is 30° to 85°.

6 . The cutting platform of claim 1 , wherein at least one of the first groove wall surface and the second groove wall surface is a serrated surface.

7 . The cutting platform according to claim 1 , wherein:
at least one of the first groove wall surface and the second groove wall surface is a first profiled surface, the first profiled surface comprises a first vertical plane and an arc surface connected with each other, and the first vertical plane is connected to the second bonding surface, and the arc surface is connected to the first bonding surface; and in the vertical direction, a size of the first vertical plane is smaller than a size of the arc surface, and the arc surface protrudes in a direction close to the second bonding surface.

8 . The cutting platform according to claim 1 , wherein:
at least one of the first groove wall surface and the second groove wall surface is a second profiled surface, and the second profiled surface comprises a second vertical plane, a connecting horizontal plane and a third vertical plane which are connected in sequence, the second vertical plane is connected to the second bonding surface, and the third vertical plane is connected to the first bonding surface; and in the vertical direction, a size of the second vertical plane is smaller than a size of the third vertical plane.

9 . The cutting platform according to claim 1 , wherein a minimum distance between the first groove wall surface and the second groove wall surface is less than or equal to 10 mm.

10 . A cutting equipment, comprising:
a machine table; a cutting platform comprising:
a first bonding surface;
a second bonding surface that is opposite to the first bonding surface and is used for bonding with a piece to be cut;
a cutting groove that penetrates the first bonding surface and the second bonding surface and corresponds to a cutting path of a cutting device, and comprises a first groove wall surface and a second groove wall surface opposite to each other;
wherein a distance between the first groove wall surface and the second groove wall surface increases in a direction from the second bonding surface to the first bonding surface;
wherein the first bonding surface is bonded to the machine table, and the second bonding surface is used to bond to the piece to be cut; and a cutting device located on a side of the second bonding surface away from the first bonding surface, and configured to cut the piece to be cut along the cutting groove, such that the debris generated through cutting passes through the cutting groove and falls into the machine table.

Assignees

• Mianyang Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Wang Liangchao
• Wu Wen
• Zhou Jian
• Gong Zengchao
• Wang Yang
• Xia Yang

Classifications

• B25B11/005 Primary

  Vacuum work holders · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K26/702

  Auxiliary equipment · CPC title