Antenna module having plurality of printed circuit boards laminated therein, and electronic device comprising same
US-12148985-B2 · Nov 19, 2024 · US
US2020412022A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020412022-A1 |
| Application number | US-201916970177-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 14, 2019 |
| Priority date | Feb 14, 2018 |
| Publication date | Dec 31, 2020 |
| Grant date | — |
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According to various embodiments, an electronic device may comprise: a housing including a first plate, a second plate oriented in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate; and, as an antenna structure including at least one plane parallel to the second plate, wherein the antenna structure includes a first element disposed on the plane, a second element spaced apart from the first element on the plane when viewed from above the plane, and a third element spaced apart from the second element on the plane when viewed from above the plane, the second element being disposed between the first element and the third element, a wireless communication circuit electrically configured to transmit and receive a signal having a frequency range of 10 GHz-100 GHz, wherein the wireless communication circuit includes a first electrical path connected to the first element, a second electrical path connected to a first point on the second element, the first point being closer to the first element than to the third element, a third electrical path connected to a second point on the second element, the second point being closer to the third element than to the first element, and a fourth electrical path connected to the third element, and the wireless communication circuit is configured to provide a phase difference between a first signal from the first point and a second signal from the second point. Various other embodiments may also be possible.
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1 . An electronic device comprising: a housing including a first plate, a second plate oriented in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate; an antenna structure including at least one plane parallel to the first plate and including a first antenna element disposed on the plane; and a wireless communication circuit electrically configured to transmit and receive a signal having a frequency range of 10 GHz-100 GHz, wherein the wireless communication circuit includes a plurality of electrical paths electrically connected to a plurality of points spaced apart from each other on the first antenna element, respectively, and wherein the wireless communication circuit provides at least one phase difference between at least two signals from the plurality of points. 2 . The electronic device of claim 1 , wherein at least two of the plurality of points are symmetric with each other with respect to a center of the first antenna element. 3 . The electronic device of claim 2 , wherein the first antenna element is symmetric with respect to a line crossing a center of the first antenna element, and wherein the plurality of points comprise a first point disposed at one side of the first antenna element with respect to the line, and a second point disposed to be symmetric with the first point at another side with respect to the line. 4 . The electronic device of claim 3 , wherein the first antenna element comprises a third point disposed at 90-degree from the first point with respect to the center, and a fourth point disposed to be symmetric with the third point on the first antenna element, and wherein the third point and the fourth point are electrically connected to the wireless communication circuit. 5 . The electronic device of claim 1 , further comprising: a substrate in which a plurality of insulation layers are laminated, wherein the first antenna element is disposed on a first plane among the insulation layers of the substrate. 6 . The electronic device of claim 5 , wherein the wireless communication circuit is electrically connected to the first antenna element by using the electrical paths arranged to extend through the insulation layers of the substrate. 7 . The electronic device of claim 5 , wherein the electrical paths are electrically connected to at least two conductive pads correspondingly arranged on a second plane different from the first plane among the insulation layers of the substrate, and wherein the at least two conductive pads are located such that the pads can be capacitively coupled to the first antenna element. 8 . The electronic device of claim 5 , further comprising: a second antenna element disposed on a third plane among the insulation layers, spaced apart from the first antenna element, wherein at least two second conductive pads are arranged between the first antenna element and the second antenna element, and wherein the second antenna element is located such that second antenna element can be capacitively coupled to the at least two second conductive pads. 9 . The electronic device of claim 8 , wherein the wireless communication circuit transmits or receives a signal having a first frequency band through the first antenna element, and transmits or receives a signal having a second frequency band different from a signal having the first frequency band through the second antenna element. 10 . The electronic device of claim 1 , further comprising: a switching device configured to selectively switch the plurality of electrical paths. 11 . The electronic device of claim 1 , further comprising: at least one conductive pattern configured on a periphery of the first antenna element and electrically connected to the wireless communication circuit at least two points. 12 . The electronic device of claim 11 , wherein the at least one conductive pattern comprises a dipole antenna or a folded dipole antenna. 13 . The electronic device of claim 12 , wherein the at least one conductive pattern comprises a first conductive pattern and a second conductive pattern electrically connected to the wireless communication circuit. 14 . The electronic device of claim 1 , further comprising: a substrate including a first surface oriented toward the first plate and a second surface oriented toward the second plate, wherein the first antenna element is disposed on the second surface. 15 . The electronic device of claim 1 , wherein the first antenna element comprises a metal pattern formed on a substrate, a metal plate attached to the substrate, a flexible printed circuit board (FPCB), or a conductive paint applied to the substrate.
formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} · CPC title
Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title
with built-in antennas · CPC title
Patch antenna array · CPC title
Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces · CPC title
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