Substrate for electric element and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-2020403123-A1
Application number	US-201916977776-A
Country	US
Kind code	A1
Filing date	Mar 5, 2019
Priority date	Mar 6, 2018
Publication date	Dec 24, 2020
Grant date	—

Abstract

Various embodiments comprise: a substrate; a plurality of unit electric elements arranged on the substrate at regular intervals; and at least one conductive path electrically connected to each of the plurality of unit electric elements nearby and having an energized inspection area formed at an end thereof. It is possible to determine whether each of the plurality of unit electric elements is electrically good or defective by using an energized inspection area of the conductive path. Other various embodiments may be possible.

First claim

1 . A substrate comprising:
a base substrate layer; a plurality of unit electric elements arranged on the base substrate layer at a predetermined interval; and one or more conductive paths electrically connected to the plurality of unit electric elements around the plurality of unit electric elements, respectively, and each of which has a current flow inspection area at an end thereof, wherein the electrical qualities of the plurality of unit electric elements are determined by using the current flow inspection areas of the conductive paths.

2 . The substrate of claim 1 , wherein each of the plurality of unit electric elements has a micro LED having an area of a range of 10000 μm 2 or less.

3 . The substrate of claim 1 , further comprising:
a resin layer disposed between the base substrate layer and the plurality of unit electric elements; and one or more feeding pads disposed in the plurality of unit electric elements, respectively, wherein the feeding pads are electrically connected to the one or more conductive paths.

4 . The substrate of claim 3 , further comprising:
one or more sub-electric paths branched from the conductive paths and extending to the feeding pads corresponding to the plurality of unit electric elements.

5 . The substrate of claim 3 , wherein the resin layer between the plurality of unit electric elements and the base substrate layer are removed, and
wherein the plurality of unit electric elements are floated in an anchor and tether structure through the one or more sub-electric path.

6 . The substrate of claim 1 , wherein the base substrate layer comprises a carrier substrate, to which a micro LED is transferred.

7 . The substrate of claim 6 , wherein the plurality of unit electric elements are disposed in rows and/or columns at a predetermined interval, and
wherein the one or more conductive paths are disposed to extend along the rows and/or columns around the unit electric elements.

8 . The substrate of claim 1 , wherein each of the unit electric elements comprises a micro LED.

9 . A method for manufacturing a carrier substrate, the method comprising:
forming a plurality of light emitting layers in a base substrate layer; forming one or more conductive paths such that the conductive paths are electrically connected in common to the plurality of light emitting layers around the light emitting layers; transferring the conductive paths and the light emitting layers to the carrier substrate; dividing the light emitting layers transferred to the carrier substrate into a plurality of unit micro LEDs; and performing a current flow inspection for determining the qualities of the divided micro LEDs through the one or more conductive paths.

10 . The method of claim 9 , further comprising:
transferring the conductive paths and the light emitting layers to the carrier substrate by using a resin layer.

11 . The method of claim 10 , further comprising:
removing at least a portion of the resin layer, wherein the divided micro LEDs are floated from the carrier substrate by the removed resin layer and the one or more conductive paths.

12 . The method of claim 11 , wherein the removing of the resin layer comprises:
removing a portion of the resin layer, which overlaps at least a portion of the conductive path, through a masking process.

13 . The method of claim 12 , further comprising:
forming one or more sub-electric paths branched from the conductive paths and extending to the feeding pads corresponding to the plurality of divided micro LEDs, wherein the plurality of micro LEDs are floated in an anchor and tether structure through the one or more sub-electric path.

14 . The method of claim 9 , wherein the plurality of divided micro LEDs are disposed along rows and/or columns on the carrier substrate at a predetermined interval, and
wherein the one or more conductive paths are disposed to extend along the rows and/or columns around the micro LEDs.

15 . The method of claim 10 , wherein each of the micro LEDs has one or more feeding pad, and
wherein the one or more conductive paths are formed together with the feeding pads are formed.

16 . A carrier substrate comprising:
a base substrate layer; a plurality of micro LEDs arranged on the base substrate layer at a predetermined interval; and one or more conductive paths electrically connected to the plurality of micro LEDs around the plurality of micro LEDs, respectively, and each of which has a current flow inspection area at an end thereof, wherein the electrical qualities of the plurality of micro LEDs are determined by using the current flow inspection areas of the conductive paths.

17 . The carrier substrate of claim 16 , wherein each of the plurality of micro LEDs have an area of a range of 10000 μm2 or less.

18 . The carrier substrate of claim 16 , further comprising:
a resin layer disposed between the base substrate layer and the plurality of micro LEDs; and one or more feeding pads disposed in the plurality of micro LEDs, respectively, wherein the feeding pads are electrically connected to the one or more conductive paths.

19 . The carrier substrate of claim 18 , further comprising:
one or more sub-electric paths branched from the conductive paths and extending to the feeding pads corresponding to the plurality of micro LEDs.

20 . The carrier substrate of claim 19 , wherein the resin layer between the plurality of micro LEDs and the base substrate layer are removed, and
wherein the plurality of micro LEDs are floated in an anchor and tether structure through the one or more sub-electric path.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jang Kyungwoon
• Lee Changjoon
• Hwang Daesuck

Classifications

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10H29/24

  comprising multiple light-emitting semiconductor devices · CPC title

• H10H20/017

  Etching · CPC title

• H10H29/30

  Active-matrix LED displays · CPC title

• H10H20/019

  Removal of at least a part of a substrate on which semiconductor layers have been formed · CPC title