Catalyst Ink for Three-Dimensional Conductive Constructs

Patent metadata

Field	Value
Publication number	US-2020399482-A1
Application number	US-202016823383-A
Country	US
Kind code	A1
Filing date	Mar 19, 2020
Priority date	Jun 20, 2019
Publication date	Dec 24, 2020
Grant date	—

Abstract

A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.

First claim

1 . An arbitrary three-dimensional construct prepared by
i. preparing a catalyst ink comprising a colloidal solution comprising a solvent and palladium nanoparticles; and ii. depositing the catalyst ink from step (i) onto a surface of a substrate using aerosol jet printing; iii. subjecting the substrate to electro-less plating to plate the palladium nanoparticles with copper; and iv. repeating steps ii and iii until the three-dimensional construct is formed.

2 . The construct of claim 1 further comprising sonicating the solvent in step i to disperse the palladium nanoparticles and to reduce aggregation of the palladium nanoparticles.

3 . The construct of claim 1 wherein the solvent is selected from toluene, dimethylformamide, tetrahydrofuran, xylenes, and combinations thereof.

4 . The construct of claim 1 wherein the catalyst ink further comprises a binder selected from poly-vinyl alcohol and carboxy-methyl cellulose or combinations thereof.

5 . The construct of claim 1 wherein the palladium nanoparticles have an average particle size of from about 15 to about 400 nm.

6 . The construct of claim 1 wherein the palladium nanoparticles are present in the catalyst ink in an amount of from 0.1 to 2.2 wt. %.

7 . The construct of claim 1 wherein the substrate is selected from glass, plastic, ceramic, or metal.

8 . The construct of claim 1 further comprising
v. applying a non-conductive layer prior to or after repeating steps ii and iii.

9 . The construct of claim 1 wherein the catalyst ink further comprises a binder selected from poly-vinyl alcohol and carboxy-methyl cellulose or combinations thereof.

10 . The construct of claim 8 wherein the palladium nanoparticles have an average particle size of from about 15 to about 400 nm.

11 . The construct of claim 8 which construct is microelectronic circuitry.

Assignees

• Science Appl Int Corp

Inventors

• Morris David
• Timler John
• Schipp Jason

Classifications

• C23C18/38 Primary

  Coating with copper · CPC title

• C09D11/03 Primary

  characterised by features other than the chemical nature of the binder · CPC title

• B22F1/0545

  Dispersions or suspensions of nanosized particles · CPC title

• B22F10/50

  Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up · CPC title

• B22F10/14

  by jetting of binder onto a bed of metal powder · CPC title