Methods and Apparatuses for Clearing Particles from a Surface of an Electronic Device Using Skewed Waveforms to Eject Debris by way of Electromagnetic Propulsion

Patent metadata

Field	Value
Publication number	US-2020398317-A1
Application number	US-201916444346-A
Country	US
Kind code	A1
Filing date	Jun 18, 2019
Priority date	Jun 18, 2019
Publication date	Dec 24, 2020
Grant date	—

Abstract

In examples, systems and methods for using skewed waveforms to eject debris using electromagnetic propulsion are disclosed. The systems and methods include a first electronic device having a surface. The systems and methods also include a signal generator configured to generate a skewed signal configured to cause a movement of particles on the surface of the first electronic device. Additionally, the systems and methods include an antenna coupled to the signal generator, where the antenna is configured to receive the skewed signal from the signal generator and radiate the skewed signal as electromagnetic energy proximate to the surface of the first electronic device.

First claim

1 .- 8 . (canceled)

9 . A method for clearing particles from a surface of an electronic device, the method comprising:
generating a skewed signal configured to cause a movement in the particles, wherein the skewed signal is generated by a superposition of sinusoids; feeding the skewed signal to an antenna; and radiating, from the antenna, the skewed signal in a direction of the surface such that the skewed signal moves the particles from the surface.

10 . The method of claim 9 , wherein said generating the skewed signal is based on a size of the particles.

11 . The method of claim 9 , wherein said radiating is based on a radiation pattern of the antenna that minimizes energy radiated into the surface.

12 . The method of claim 9 , further comprising using a laser to loosen the particles on the surface.

13 . The method of claim 9 , further comprising using a laser to ionize the particles on the surface.

14 . The method of claim 9 , further comprising selectively operating a laser in one of two modes, wherein a first mode comprises loosening the particles on the surface and a second mode comprises ionizing the particles on the surface.

15 . The method of claim 9 , further comprising using a collection unit to electrostatically trap the particles.

16 . The method of claim 9 , wherein said radiating is performed in the direction of the surface that is approximately parallel to a plane of the surface.

17 . A method for clearing particles from a surface of an electronic device, the method comprising:
determining a size of the particles; generating a skewed signal configured to cause a movement in the particles based, at least in part, on the determined size; feeding the skewed signal to an antenna; and radiating, from the antenna, the skewed signal in a direction of the surface.

18 . The method of claim 17 , further comprising selectively operating a laser in one of two modes, wherein a first mode comprises loosening the particles on the surface and a second mode comprises ionizing the particles on the surface.

19 . The method of claim 17 , further comprising using a collection unit to electrostatically trap the particles.

20 . The method of claim 17 , wherein said radiating is performed in the direction of the surface that is approximately parallel to a plane of the surface.

21 . The method of claim 17 , further comprising using a laser to loosen the particles on the surface.

22 . The method of claim 17 , further comprising using a laser to ionize the particles on the surface.

23 . A method for clearing particles from a surface of an electronic device, the method comprising:
using a laser to loosen the particles on the surface; generating a skewed signal configured to cause a movement in the particles; feeding the skewed signal to an antenna; and radiating, from the antenna, the skewed signal in a direction of the surface.

24 . The method of claim 23 , further comprising using the laser to ionize the particles on the surface.

25 . The method of claim 23 , further comprising selectively operating the laser in one of two modes, wherein a first mode comprises loosening the particles on the surface and a second mode comprises ionizing the particles on the surface.

26 . The method of claim 23 , further comprising using a collection unit to electrostatically trap the particles.

27 . The method of claim 23 , wherein said radiating is performed in the direction of the surface that is approximately parallel to a plane of the surface.

28 . The method of claim 23 , wherein the electronic device comprises a sensor or a solar panel, and wherein said radiating comprises radiating the skewed signal in the direction of the sensor or the solar panel.

Assignees

• Boeing Co

Inventors

• Shapoury Alireza

Classifications

• B03C3/88 Primary

  Cleaning-out collected particles · CPC title

• B03C3/017

  Combinations of electrostatic separation with other processes, not otherwise provided for · CPC title

• B08B2215/00

  Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area · CPC title

• B08B7/0042 Primary

  by laser · CPC title

• B08B7/0035 Primary

  by radiant energy, e.g. UV, laser, light beam or the like · CPC title