Slurry composition and method of manufacturing integrated circuit device by using the same

Patent metadata

Field	Value
Publication number	US-2020392375-A1
Application number	US-202016879283-A
Country	US
Kind code	A1
Filing date	May 20, 2020
Priority date	Jun 14, 2019
Publication date	Dec 17, 2020
Grant date	—

Abstract

A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.

First claim

1 . A slurry composition comprising:
a corrosion inhibitor comprising a carbon allotrope or a derivative thereof; and an oxidant.

2 . The slurry composition of claim 1 , wherein the corrosion inhibitor comprises a carbon allotrope derivative comprising a plurality of hydrophilic groups selected from the group consisting of a carboxyl group, a carbonyl group, an epoxy group, a hydroxyl group, a hydroperoxy group, a peroxy group, an isocyanate group, and a combination thereof

3 . The slurry composition of claim 1 , wherein the corrosion inhibitor comprises a carbon allotrope derivative selected from the group consisting of a graphene oxide, an oxidized 3-dimensional carbon structure, a fullerenol, and a combination thereof.

4 . The slurry composition of claim 1 , wherein the corrosion inhibitor is present in an amount of 1 ppm to 5000 ppm based on a total amount of the slurry composition.

5 . The slurry composition of claim 1 , wherein the corrosion inhibitor comprises graphene oxide having an average thickness selected from a range that is greater than 0 nm and equal to or less than 30 nm.

6 . The slurry composition of claim 1 , wherein the oxidant comprises a periodate.

7 . The slurry composition of claim 1 , wherein the slurry composition has a pH selected from a range of 7 to 11.

8 . The slurry composition of claim 1 , further comprising:
polishing particles.

9 . The slurry composition of claim 8 , wherein each of the polishing particles comprises a metal oxide.

10 . The slurry composition of claim 1 , further comprising:
at least one selected from the group consisting of a pH regulator, a polishing accelerator, a dispersion stabilizer, a surfactant, a defoamer, and a leveling agent.

11 . A slurry composition for chemical mechanical polishing (CMP) for polishing a metal-containing structure, the metal-containing structure comprises a first metal film and a second metal film, the first metal film comprising a first metal, and the second metal film comprising a second metal that is different from the first metal, the slurry composition comprising:
a corrosion inhibitor, which has a chemical structure capable of selectively attaching to a surface of one selected from the first metal film and the second metal film and thus inhibits corrosion of the selected metal film; and an oxidant, which has a chemical structure capable of oxidizing each of the first metal film and the second metal film, wherein the corrosion inhibitor comprises a carbon allotrope or a derivative thereof.

12 . The slurry composition of claim 11 , wherein the corrosion inhibitor comprises a carbon allotrope derivative selected from the group consisting of a graphene oxide, an oxidized 3-dimensional carbon structure, a fullerenol, and a combination thereof.

13 . The slurry composition of claim 11 , further comprising:
polishing particles, each comprising a metal oxide.

14 . The slurry composition of claim 11 , wherein the oxidant comprises a periodate, and
the corrosion inhibitor comprises graphene oxide.

15 . A slurry composition for polishing a plurality of metal films respectively comprising heterogeneous metals, the slurry composition comprising:
polishing particles, which are present in an amount that is greater than 0 wt % and less than 15 wt % based on a total weight of the slurry composition; a corrosion inhibitor, which comprises a carbon allotrope derivative comprising a plurality of hydrophilic groups containing an oxygen atom, and which is present in an amount of 1 ppm to 5000 ppm based on a total amount of the slurry composition; an oxidant, which is present in an amount of 0.1 wt % to 5 wt % based on the total weight of the slurry composition; and water.

16 . The slurry composition of claim 15 , wherein the plurality of hydrophilic groups are selected from the group consisting of a carboxyl group, a carbonyl group, an epoxy group, a hydroxyl group, a hydroperoxy group, a peroxy group, an isocyanate group, and a combination thereof.

17 . The slurry composition of claim 15 , wherein the carbon allotrope derivative is selected from the group consisting of a graphene oxide, an oxidized 3-dimensional carbon structure, a fullerenol, and a combination thereof.

18 . The slurry composition of claim 15 , wherein each of the polishing particles comprises a metal oxide.

19 . The slurry composition of claim 15 , wherein the slurry composition has a pH selected from a range of 7 to 11.

20 . The slurry composition of claim 15 , wherein each of the polishing particles comprises silica,
the oxidant comprises sodium periodate (NaIO 4 ), and the corrosion inhibitor comprises graphene oxide.

21 - 43 . (canceled)

Assignees

• Samsung Electronics Co Ltd
• Seoul Nat Univ R&Db Foundation

Inventors

• Kim Boyun
• Jeon Yeryung
• Yoon Boun
• Chung Taek Dong
• Lee Jae Gyeong
• Lee Jin-Young

Classifications

• H10P52/403

  of conductive or resistive materials · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10W20/062

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10W20/035

  combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers · CPC title