Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate

Patent metadata

Field	Value
Publication number	US-2020381587-A1
Application number	US-202016996306-A
Country	US
Kind code	A1
Filing date	Aug 18, 2020
Priority date	Mar 15, 2016
Publication date	Dec 3, 2020
Grant date	—

Abstract

A glass wiring substrate includes a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.

First claim

1 . A glass wiring substrate, comprising:
a glass substrate; a first wiring portion on a first surface of the glass substrate, wherein the first wiring portion comprises a first material; a second wiring portion on a second surface of the glass substrate, wherein
the second wiring portion comprises a second material,
the second surface is opposite to the first surface, and
the first material of the first wiring portion is different from the second material of the second wiring portion;
a through-hole in a first region of the glass substrate, wherein
a second region of the glass substrate comprises the first wiring portion and the second wiring portion,
the first region is different from the second region of the glass substrate,
the second region comprises the first wiring portion and the second wiring portion,
the through-hole has a first diameter on a side of the first surface,
the through-hole has a second diameter on a side of the second surface, and
the second diameter is larger than the first diameter; and
a through-hole portion in the through-hole, wherein
a first end portion of the through-hole portion extends to the first wiring portion, and
a second end portion of the through-hole portion extends to the second wiring portion.

2 . The glass wiring substrate according to claim 1 , wherein
the through-hole portion comprises a third material, and the second material of the second wiring portion is same as the third material of the through-hole portion.

3 . The glass wiring substrate according to claim 1 , wherein the first material is aluminum and the second material is copper.

4 . A part-mounted glass wiring substrate, comprising:
a glass substrate; a first wiring portion on a first surface of the glass substrate, wherein the first wiring portion comprises a first material; a second wiring portion on a second surface of the glass substrate, wherein
the second wiring portion comprises a second material,
the second surface is opposite to the first surface, and
the first material of the first wiring portion is different from the second material of the second wiring portion;
a through-hole in a first region of the glass substrate, wherein
a second region of the glass substrate comprises the first wiring portion and the second wiring portion,
the first region is different from the second region of the glass substrate,
the second region comprises the first wiring portion and the second wiring portion,
the through-hole has a first diameter on a side of the first surface,
the through-hole has a second diameter on a side of the second surface, and
the second diameter is larger than the first diameter;
a through-hole portion in the through-hole, wherein
a first end portion of the through-hole portion extends to the first wiring portion, and
a second end portion of the through-hole portion extends to the second wiring portion; and
an electronic part on the first wiring portion.

5 . The part-mounted glass wiring substrate according to claim 4 , wherein
the electronic part includes
a plurality of light-emitting devices and
a driving semiconductor apparatus configured to drive the plurality of light-emitting devices,
the driving semiconductor apparatus is on a driving semiconductor device mounting portion, the driving semiconductor device mounting portion is on the first wiring portion, and the driving semiconductor apparatus is connected to the second wiring portion via the driving semiconductor device mounting portion and the through-hole portion, each of the plurality of light-emitting devices is on a respective light-emitting device mounting portion, the respective light-emitting device mounting portion of each of the plurality of light-emitting devices is on the first wiring portion, and each of the plurality of light-emitting devices is connected to the driving semiconductor apparatus via the first wiring portion.

6 . The part-mounted glass wiring substrate according to claim 5 , further comprising
a light-emitting device unit that constitutes a first pixel, wherein
a distance between a region associated with the first pixel and a region associated with a second pixel is L0,
the first pixel is adjacent to the second pixel,
the first diameter of the through-hole is φ1, and 0.1≤φ1/L0≤0.9.

7 . The part-mounted glass wiring substrate according to claim 4 , wherein
the through-hole portion comprises a third material, and the second material of the second wiring portion is same as the third material of the through-hole portion.

8 . A display apparatus substrate, comprising:
a glass substrate; a first wiring portion on a first surface of the glass substrate, wherein the first wiring portion comprises a first material; a second wiring portion on a second surface of the glass substrate, wherein
the second wiring portion comprises a second material,
the second surface is opposite to the first surface, and
the first material of the first wiring portion is different from the second material of the second wiring portion;
a through-hole in a first region of the glass substrate, wherein
a second region of the glass substrate comprises the first wiring portion and the second wiring portion,
the first region is different from the second region of the glass substrate,
the second region comprises the first wiring portion and the second wiring portion,
the through-hole has a first diameter on a side of the first surface,
the through-hole has a second diameter on a side of the second surface, and
the second diameter is larger than the first diameter;
a through-hole portion in the through-hole, wherein
a first end portion of the through-hole portion extends to the first wiring portion,
a second end portion of the through-hole portion extends to the second wiring portion; and
an electronic part on the first wiring portion, wherein
the electronic part includes
a plurality of light-emitting devices and
a driving semiconductor apparatus configured to drive the plurality of light-emitting devices,

the driving semiconductor apparatus is on a driving semiconductor device mounting portion,
the driving semiconductor device mounting portion is on the first wiring portion,
the driving semiconductor apparatus is connected to the second wiring portion via the driving semiconductor device mounting portion and the through-hole portion,
each of the plurality of light-emitting devices is on a corresponding light-emitting device mounting portion,
the corresponding light-emitting device mounting portion is on the first wiring portion, and
each of the plurality of light-emitting devices is connected to the driving semiconductor apparatus via the first wiring portion.

Assignees

• Sony Corp

Inventors

• Watanabe Toshihiko

Classifications

• H10W70/635

  Through-vias · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/692 Primary

  Ceramics or glasses · CPC title

• H10D86/00

  Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title