Sensor module and pressure distribution sensor provided with the same

US2020378846A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020378846-A1
Application numberUS-201816634983-A
CountryUS
Kind codeA1
Filing dateAug 3, 2018
Priority dateAug 9, 2017
Publication dateDec 3, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor module includes a holding member formed of an elastic body, a pressure bearing face provided at the holding member and configured to bear pressure, an adjoining face provided at the holding member so as to adjoin the pressure bearing face and configured to undergo deformation in accordance with the pressure borne by the pressure bearing face, and an elongate piezoelectric substrate arranged on the adjoining face.

First claim

Opening claim text (preview).

1 . A sensor module, comprising: a holding member formed of an elastic body; a pressure bearing face provided at the holding member and configured to bear pressure; an adjoining face provided at the holding member so as to adjoin the pressure bearing face and configured to undergo deformation in accordance with the pressure borne by the pressure bearing face; and an elongate piezoelectric substrate arranged on the adjoining face. 2 . The sensor module of claim 1 , wherein, at the adjoining face, the piezoelectric substrate is provided so as to surround the holding member around a pressure bearing direction of the pressure. 3 . A sensor module, comprising: a holding member formed of an elastic body; a pressure bearing portion provided at the holding member and configured to bear pressure; an intersecting plane provided at the holding member so as to intersect a pressure bearing direction of the pressure and configured to undergo deformation in accordance with the pressure borne by the pressure bearing portion; and an elongate piezoelectric substrate arranged along an outer edge portion of the intersecting plane. 4 . The sensor module of claim 1 , wherein, when applied with a load, the holding member has a deformation per unit load in a range of from 0.01 mm to 1.0 mm. 5 . The sensor module of claim 1 , wherein: the piezoelectric substrate includes an elongate conductor, and an elongate piezoelectric material helically wound onto the conductor in one direction; and the piezoelectric material is formed from an organic piezoelectric material. 6 . The sensor module of claim 5 , wherein the piezoelectric material is an optically active helical chiral polymer (A). 7 . The sensor module of claim 6 , wherein the helical chiral polymer (A) is polylactic acid. 8 . The sensor module of claim 1 , wherein a string-shaped elastic member is connected to a leading end of the piezoelectric substrate, and the elastic member is disposed together with the piezoelectric substrate at the holding member. 9 . The sensor module of claim 1 , further comprising a protection member formed of an elastic body and provided at an outer peripheral portion of the holding member. 10 . A pressure distribution sensor, comprising a plurality of the sensor module of claim 1 arranged in a lattice pattern.

Assignees

Inventors

Classifications

  • Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes · CPC title

  • G01L1/16Primary

    using properties of piezoelectric devices · CPC title

  • using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

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What does patent US2020378846A1 cover?
A sensor module includes a holding member formed of an elastic body, a pressure bearing face provided at the holding member and configured to bear pressure, an adjoining face provided at the holding member so as to adjoin the pressure bearing face and configured to undergo deformation in accordance with the pressure borne by the pressure bearing face, and an elongate piezoelectric substrate arr…
Who is the assignee on this patent?
Mitsui Chemicals Inc
What technology area does this patent fall under?
Primary CPC classification G01L1/16. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Dec 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).