Solid state lamp for retrofit

US2020378564A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020378564-A1
Application numberUS-202016999766-A
CountryUS
Kind codeA1
Filing dateAug 21, 2020
Priority dateSep 21, 2015
Publication dateDec 3, 2020
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A HID solid state retrofit lamp includes a circumferential array of solid state light sources mounted on circuit boards, a heat sink located in the lamp's interior volume, and a fan positioned in the interior volume to force airflow across the heat sink. A capper assembly includes at least one aperture to vent the interior volume, and an intermediate circuit board within the capper assembly. The intermediate circuit board distributes electrical power to the circuit boards by tabs and contacts extending from the boards that are mechanically bonded together. An optical transmissive shield is positioned exterior to the circumferential array, and can include prismatic structures to direct light emitted from the LED sources in an off axis direction.

First claim

Opening claim text (preview).

1 . A high intensity discharge (HID) solid state retrofit lamp comprising: one or more circuit boards configured as a circumferential array defining an interior volume of the retrofit lamp, each circuit board having an interior surface, an exterior surface, a first edge, and a second edge; solid-state light sources mounted on the exterior surface of the one or more circuit boards; a heat sink located in the interior volume, the heat sink in thermal communication with the interior surface of the one or more circuit boards; an active cooling device fan positioned proximal to the interior volume configured to force airflow across the heat sink; a capper assembly located proximal to the first edge of the one or more circuit boards, the capper assembly including at least one aperture configured to vent the interior volume; and a top cap located proximal to the second edge of the one or more circuit boards, the top cap including at least one aperture configured to vent the interior volume. 2 . The lamp of claim 1 , the heat sink including internal fins extending into the interior volume. 3 . The lamp of claim 1 , including a dome assembly located distal from the second edge, the dome assembly including a secondary circuit board having solid-state light sources. 4 . The lamp of claim 1 , including an optical transmissive shield positioned proximal to the exterior surfaces of the one or more circuit boards. 5 . The lamp of claim 4 , the optical transmissive shield including prismatic structures extending laterally from the optical transmissive shield, the prismatic structures configured to direct light emitted from the solid state light sources in an off axis direction. 6 . The lamp of claim 1 , including a lamp base at an end of the capper assembly opposite the first edge. 7 . The lamp of claim 1 , including an intermediate circuit board and a light source driver electronics supply within the capper assembly. 8 . The lamp of claim 7 , the intermediate circuit board in electrical communication with the driver electronics supply, the intermediate circuit board configured to distribute electrical power to the one or more circuit boards. 9 . The lamp of claim 8 , the intermediate circuit board including: protruding tabs extending inwards from the intermediate circuit board; and electrical contacts extending from the first edge of the one or more circuit boards. 9 . The lamp of claim 9 , the protruding tabs and the electrical contacts mechanically bonded to form an electrical connection. 10 . The lamp of claim 1 , including a reflector between the circumferential array and the capper assembly. 11 . The lamp of claim 10 , the reflector having a reflective film coated on a first surface of the reflector. 12 . The lamp of claim 10 , the reflector formed from a diffuse material. 13 . The lamp of claim 1 , the one or more circuit boards being metal-clad printed circuit boards. 14 . The lamp of claim 1 , the one or more circuit boards being a flexible circuit board conformed to an external profile of the heat sink. 15 . The lamp of claim 1 , the SSL source being one of a light emitting diode, an organic light-emitting diode, polymer light-emitting diodes, a laser diode, and a laser. 16 . The lamp of claim 1 , the active cooling device being a fan.

Assignees

Inventors

Classifications

  • Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED] · CPC title

  • Arrangement or mounting of circuit elements integrated in the light source · CPC title

  • F21K9/232Primary

    specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb · CPC title

  • on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section · CPC title

  • the elements having apertures, ducts or channels, e.g. heat radiation holes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2020378564A1 cover?
A HID solid state retrofit lamp includes a circumferential array of solid state light sources mounted on circuit boards, a heat sink located in the lamp's interior volume, and a fan positioned in the interior volume to force airflow across the heat sink. A capper assembly includes at least one aperture to vent the interior volume, and an intermediate circuit board within the capper assembly. Th…
Who is the assignee on this patent?
Current Lighting Solutions Llc
What technology area does this patent fall under?
Primary CPC classification F21K9/232. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Dec 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).