Thermally conductive thin-film cured product, method for producing same, and thermally conductive member

Patent metadata

Field	Value
Publication number	US-2020354526-A1
Application number	US-201916962733-A
Country	US
Kind code	A1
Filing date	Jan 8, 2019
Priority date	Jan 17, 2018
Publication date	Nov 12, 2020
Grant date	—

Abstract

Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.1-1,000 ppm (mass), inclusive, with respect to component (a) in terms of the mass of the platinum group metal element; (e) a reaction regulator, as required; (f) 50-300 parts by mass, inclusive, of a silicone resin; and (g) 0.1-20 parts by mass, inclusive, of an adhesive component selected from (g-1) or (g-2).

First claim

1 . A heat-conductive thin film-like cured product obtained by curing a silicone composition comprising:
(a) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (b) 200 to 2,000 parts by weight of a heat-conductive filler, (c) an organohydrogenpolysiloxane having at least two directly silicon-bonded hydrogen atoms per molecule, in an amount such that the ratio (number of directly silicon-bonded hydrogen atoms in component (c))/(number of alkenyl groups in component (a)) is from 0.5 to 50.0, (d) a platinum group metal compound in an amount relative to component (a), expressed in terms of the amount of platinum group metal element, of from 0.1 to 1,000 ppm (weight), (e) a necessary amount of a reaction regulator, (f) 50 to 300 parts by weight of a silicone resin, and (g) 0.1 to 20 parts by weight of an adhesive ingredient selected from (g-1) and (g-2) below
(g-1) a compound of general formula (1) below

 (wherein n is an integer from 1 to 15)
(g-2) an organosilicon compound of from 1 to 100 silicon atoms which has at least one phenylene skeleton and at least one silicon-bonded hydrogen atom per molecule.

2 . The heat-conductive thin film-like cured product of claim 1 , wherein component (f) is a silicone resin containing R 1 3 SiO 1/2 units (wherein R 1 is a substituted or unsubstituted monovalent hydrocarbon group that has no aliphatic unsaturated bonds) and SiO 4/2 units in a molar ratio expressed as (R 1 3 SiO 1/2 units)/(SiO 4/2 units) of from 0.1 to 3.0.

3 . The heat-conductive thin film-like cured product of claim 1 , wherein the silicone composition further comprises 0.1 to 40 parts by weight of one or more surfactant selected from (h-1) and (h-2) below:
(h-1) an alkoxysilane compound of general formula (2) below
R 2 a R 3 b Si(OR 4 ) 4−a−b   (2)

(wherein each R 2 is independently an alkyl group of 6 to 15 carbon atoms, each R 3 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 8 carbon atoms, each R 4 is independently an alkyl group of 1 to 6 carbon atoms, the subscript “a” is an integer from 1 to 3, the subscript “b” is an integer from 0 to 2, and the sum a+b is an integer from 1 to 3),
(h-2) a dimethylpolysiloxane capped at one end of the molecular chain with a trialkoxy group and represented by general formula (3) below

(wherein each R 5 is independently an alkyl group of 1 to 6 carbon atoms, and the subscript “c” is an integer from 5 to 100).

4 . The heat-conductive thin film-like cured product of claim 1 , wherein component (b) is a heat-conductive filler selected from the group consisting of metals, oxides and nitrides.

5 . A method for producing the heat-conductive thin film-like cured product of claim 1 , which method comprises the step of forming into a thin film on a surface release-treated substrate and curing a silicone composition comprising:
(a) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (b) 200 to 2,000 parts by weight of a heat-conductive filler, (c) an organohydrogenpolysiloxane having at least two directly silicon-bonded hydrogen atoms per molecule, in an amount such that the ratio (number of directly silicon-bonded hydrogen atoms in component (c))/(number of alkenyl groups in component (a)) is from 0.5 to 50.0, (d) a platinum group metal compound in an amount relative to component (a), expressed in terms of the amount of platinum group metal element, of from 0.1 to 1,000 ppm (weight), (e) a necessary amount of a reaction regulator, (f) 50 to 300 parts by weight of a silicone resin, and (g) 0.1 to 20 parts by weight of an adhesive ingredient selected from (g-1) and (g-2) below
(g-1) a compound of general formula (1) below

 (wherein n is an integer from 1 to 15)
(g-2) an organosilicon compound of from 1 to 100 silicon atoms which has at least one phenylene skeleton and at least one silicon-bonded hydrogen atom per molecule.

6 . The production method of claim 5 , wherein a modified silicone containing a fluorinated substituent on the backbone is used as a treatment ingredient in the surface release treatment.

7 . A heat-conductive member comprising a substrate that has been surface release-treated for a silicone adhesive and a heat-conductive thin film-like cured product obtained by forming into a thin film on the surface release-treated substrate and curing a silicone composition comprising:
(a) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (b) 200 to 2,000 parts by weight of a heat-conductive filler, (c) an organohydrogenpolysiloxane having at least two directly silicon-bonded hydrogen atoms per molecule, in an amount such that the ratio (number of directly silicon-bonded hydrogen atoms in component (c))/(number of alkenyl groups in component (a)) is from 0.5 to 50.0, (d) a platinum group metal compound in an amount relative to component (a), expressed in terms of the amount of platinum group metal element, of from 0.1 to 1,000 ppm (weight), (e) a necessary amount of a reaction regulator, (f) 50 to 300 parts by weight of a silicone resin, and (g) 0.1 to 20 parts by weight of an adhesive ingredient selected from (g-1) and (g-2) below
(g-1) a compound of general formula (1) below

 (wherein n is an integer from 1 to 15)
(g-2) an organosilicon compound of from 1 to 100 silicon atoms which has at least one phenylene skeleton and at least one silicon-bonded hydrogen atom per molecule.

8 . The heat-conductive member of claim 7 , wherein a modified silicone containing a fluorinated substituent on the backbone is used as a treatment ingredient in the surface release treatment.

Assignees

• Shinetsu Chemical Co

Inventors

• Ito Takanori
• Endo Akihiro
• Tanaka Yuki

Classifications

• C09D183/04 Primary

  Polysiloxanes · CPC title

• C08G77/50 Primary

  by carbon linkages · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08G77/12

  containing silicon bound to hydrogen · CPC title