Antenna package having cavity structure

Patent metadata

Field	Value
Publication number	US-2020335877-A1
Application number	US-201816959103-A
Country	US
Kind code	A1
Filing date	Oct 18, 2018
Priority date	Oct 18, 2018
Publication date	Oct 22, 2020
Grant date	—

Abstract

An antenna package having a cavity structure is provided, wherein a cavity substrate having an accommodation portion formed therethrough is disposed on one surface of an antenna substrate having a signal processing element formed thereon, so as to prevent occurrence of deformation and breakage thereof in the process of mounting the antenna package. The provided antenna package having the cavity structure comprises: an antenna substrate, on the upper surface of which multiple radiation patches are formed and on the lower surface of which multiple signal processing elements are formed; and a cavity substrate which has an accommodation portion formed therethrough to receive the multiple signal processing elements and is disposed on the lower surface of the antenna substrate.

First claim

1 . An antenna package having a cavity structure comprising:
an antenna substrate which has a plurality of radiation patches formed on the upper surface thereof, and a plurality of signal processing elements formed on the lower surface thereof; and a cavity substrate which is formed with accommodation portions accommodating the plurality of signal processing elements, and disposed on the lower surface of the antenna substrate.

2 . The antenna package having the cavity structure of claim 1 ,
wherein the antenna substrate comprises: a plate-shaped ceramic substrate; and a plurality of first control signal transmission electrodes which are formed on the lower surface of the ceramic substrate, and disposed to be spaced apart from each other along the outer circumference of the ceramic substrate, and wherein the plurality of radiation patches are disposed in a matrix on the upper surface of the ceramic substrate, and wherein the plurality of signal processing elements are disposed in a matrix on the lower surface of the ceramic substrate.

3 . The antenna package having the cavity structure of claim 2 ,
wherein the antenna substrate further comprises: a first RF signal transmission pattern formed on the ceramic substrate, and wherein one end of the first RF signal transmission pattern is connected to an RF signal transmission electrode of the cavity substrate through a via hole.

4 . The antenna package having the cavity structure of claim 3 ,
wherein the antenna substrate further comprises: an RF signal distributor having an input terminal and a plurality of output terminals, and formed on the ceramic substrate, and wherein the input terminal is connected to the other end of the first RF signal transmission pattern, and the plurality of output terminals are connected to have one-to-one correspondence with the plurality of signal processing elements.

5 . The antenna package having the cavity structure of claim 4 ,
wherein the RF signal distributor is a 4-Way Wilkinson distributor.

6 . The antenna package having the cavity structure of claim 2 ,
wherein the antenna substrate further comprises: a first RF signal transmission pattern which is formed on the ceramic substrate; a first RF signal distributor which is formed on the ceramic substrate, and has an input terminal connected to one end of the first RF signal transmission pattern and a plurality of output terminals connected to some of the plurality of signal processing elements, and a second RF signal distributor which is formed on the ceramic substrate to be spaced apart from the first RF signal distributor, and has an input terminal connected to the other end of the first RF signal transmission pattern and a plurality of output terminals connected to the plurality of signal processing elements other than some of the plurality of signal processing elements.

7 . The antenna package having the cavity structure of claim 6 ,
wherein the first RF signal distributor and the second RF signal distributor are 2-Way Wilkinson distributors.

8 . The antenna package having the cavity structure of claim 1 ,
wherein the cavity substrate comprises: a cavity frame in which the accommodation portion is formed.

9 . The antenna package having the cavity structure of claim 8 ,
wherein the cavity frame has a rectangular frame shape in which one accommodation portion is formed.

10 . The antenna package having the cavity structure of claim 8 ,
wherein the cavity substrate further comprises: a second control signal transmission electrode which is formed on the lower surface of the cavity frame, and connected to the first control signal transmission electrode formed on the antenna substrate.

11 . The antenna package having the cavity structure of claim 10 , further comprising:
an RF signal transmission electrode which is formed on the lower surface of the cavity frame to be spaced apart from the second control signal transmission electrode, wherein the RF signal transmission electrode is connected to the first RF signal transmission pattern of the antenna substrate.

12 . The antenna package having the cavity structure of claim 8 ,
wherein the cavity frame has a lattice shape in which a plurality of accommodation portions are disposed in a matrix.

13 . The antenna package having the cavity structure of claim 12 ,
wherein the cavity substrate further comprises a second RF signal transmission pattern which is formed on the lower surface of the cavity frame, and wherein one end of the second RF signal transmission pattern is connected to an RF signal transmission electrode, and the other end of the second RF signal transmission pattern is formed to extend toward the center of the cavity frame.

14 . The antenna package having the cavity structure of claim 13 ,
wherein the other end of the second RF signal transmission pattern is connected to a first RF signal transmission pattern of the antenna substrate through a via hole.

15 . The antenna package having the cavity structure of claim 1 ,
wherein the cavity substrate is made of the same ceramic material as the antenna substrate.

16 . The antenna package having the cavity structure of claim 1 ,
wherein the cavity substrate is made of a material different from that of the antenna substrate.

Assignees

• Amotech Co Ltd

Inventors

• Park Hyun Joo
• Baek Hyung Il
• Ryu Kyung Hyun
• Lee Se Ho
• Seo Yun Sik
• Go Gwang Lyong
• Do Han Ju

Classifications

• H01Q21/065 Primary

  Patch antenna array · CPC title

• H01Q21/0087

  Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00) · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/20

  Resilient mountings · CPC title