3d printing of catalytic formulation for selective metal deposition

US2020331196A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020331196-A1
Application numberUS-202016916188-A
CountryUS
Kind codeA1
Filing dateJun 30, 2020
Priority dateDec 31, 2017
Publication dateOct 22, 2020
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Described herein is a method of additive manufacturing of a three-dimensional object having an agent which promotes electroless metal deposition dispersed therein in a configured pattern. The method utilizes modeling material formulation(s) which comprise and/or are capable of generating such an agent. Further described is a method of manufacturing a three-dimensional object having an electrically-conductive material dispersed in a configured pattern. The method utilizes an object having an agent which promotes electroless metal deposition dispersed therein in a configured pattern and manufactured by the aforementioned method, and proceeds by contacting the three-dimensional object with an electroless deposition solution so as to effect the electroless deposition onto the configured pattern. Further described are kits for use in additive manufacturing as described herein; as well as three-dimensional objects which may be manufactured as described herein.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of additive manufacturing of a three-dimensional object having an agent which promotes electroless metal deposition dispersed in and/or on at least a portion thereof, the method comprising sequentially forming a plurality of layers in a configured pattern corresponding to the shape of the object, thereby forming the object, wherein said agent is dispersed in and/or on said portion of the object in a secondary configured pattern, wherein the formation of at least a few of said layers comprises: dispensing a first modeling material formulation which comprises a first curable material; and dispensing a second modeling material formulation which comprises a second curable material and said agent which promotes electroless metal deposition, wherein dispensing said first and said second modeling material formulations is according to said secondary configured pattern. 2 . The method of claim 1 , wherein said second modeling material formulation comprises a support material formulation, the method further comprising removing a portion of said support material formulation. 3 . The method of claim 2 , further comprising treating said support material formulation with an oxidant to form said agent which promotes electroless metal deposition. 4 . The method of claim 1 , wherein said secondary configured pattern is on an external surface of the object and/or on an internal surface of the object. 5 . The method of claim 1 , wherein said agent is a catalyst of electroless metal deposition. 6 . The method of claim 1 , wherein said catalyst comprises silver particles and/or palladium particles. 7 . A method of manufacturing of a three-dimensional object comprising an electrically conductive material dispersed in and/or at least a portion of the object in a secondary configured pattern, the method comprising: forming, by additive manufacturing according to the method of claim 1 , a three-dimensional object having an agent which promotes electroless metal deposition dispersed in and/or on at least a portion thereof in said secondary configured pattern; and contacting said three-dimensional object having an agent which promotes electroless metal deposition dispersed in and/or on at least a portion thereof in said secondary configured pattern with an electroless deposition solution capable of forming an electrically-conductive layer in the presence of said agent, to thereby form the electrically-conductive material in and/or on the surface of the object according to said secondary configured pattern. 8 . The method of claim 7 , further comprising activating said agent in said secondary configured pattern prior to said contacting with an electroless deposition solution, to thereby form an activated catalyst of electroless metal deposition dispersed in the object in said secondary configured pattern. 9 . The method of claim 8 , wherein said activating is effected by contacting said agent with an activating substance comprising Pd(II) and/or silver particles. 10 . The method of claim 9 , wherein said activating substance comprises PdCl 2 and HCl. 11 . The method of claim 8 , wherein said activating substance comprises a catalyst of electroless metal deposition, and said agent binds to said catalyst, to thereby form said activated catalyst bound to said agent. 12 . The method of claim 7 , further comprising treating said object having an agent which promotes electroless metal deposition dispersed in and/or on at least a portion thereof in said secondary configured pattern with a chemical etchant solution prior to said contacting with an electroless deposition solution. 13 . The method of claim 12 , wherein said etchant comprises a permanganate. 14 . The method of claim 13 , further comprising contacting said object with a bleaching composition subsequent to said treating with said etchant. 15 . The method of claim 7 , wherein said electroless deposition solution comprises a metal ion and a reducing agent. 16 . The method of claim 15 , wherein said metal is selected from the group consisting of copper, nickel, silver and gold. 17 . A three-dimensional object having an agent which promotes electroless metal deposition dispersed in and/or on at least a portion thereof in a configured pattern, manufactured according to the method of claim 1 . 18 . The method of claim 1 , wherein said additive manufacturing is inkjet 3D printing. 19 . The method of claim 1 , wherein said second modeling material formulation further comprises an electroless deposition promoter. 20 . The method of claim 19 , wherein said electroless deposition promoter is a (meth)acrylic acid or an oligomer thereof. 21 . The method of claim 5 , wherein a concentration of said agent in said second modeling material formulation is in a range of from 1 to 10 weight percent.

Assignees

Inventors

Classifications

  • C23C18/405Primary

    Formaldehyde · CPC title

  • B29C64/112Primary

    using individual droplets, e.g. from jetting heads · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Activating {or accelerating or sensitising with palladium or other noble metal} · CPC title

  • B29C64/106Primary

    using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2020331196A1 cover?
Described herein is a method of additive manufacturing of a three-dimensional object having an agent which promotes electroless metal deposition dispersed therein in a configured pattern. The method utilizes modeling material formulation(s) which comprise and/or are capable of generating such an agent. Further described is a method of manufacturing a three-dimensional object having an electrica…
Who is the assignee on this patent?
Stratasys Ltd
What technology area does this patent fall under?
Primary CPC classification C23C18/405. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Oct 22 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).