Camera module including heat dissipating structure and electronic device including the same

Patent metadata

Field	Value
Publication number	US-2020322467-A1
Application number	US-202016839534-A
Country	US
Kind code	A1
Filing date	Apr 3, 2020
Priority date	Apr 4, 2019
Publication date	Oct 8, 2020
Grant date	—

Abstract

An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing

First claim

What is claimed is:

1 . An electronic device comprising:
a housing including:
a frame structure configured to form a portion of a surface of the electronic device,
a plate structure surrounded by the frame structure, the plate structure including a first opening,
a metal portion containing a metallic material, and
a polymer portion containing a polymer material;
a support plate configured to face the plate structure, the support plate including a polymer area formed of a polymer material; a printed circuit board disposed between the plate structure and the support plate, the printed circuit board configured to make contact with part of the metal portion of the housing; a camera module disposed between a part of the polymer portion included in the plate structure and the polymer area included in the support plate, wherein the camera module includes a camera bracket disposed on the polymer area, a camera PCB disposed on the camera bracket, a light emitting unit, and a light receiving unit, the light emitting unit and light receiving unit disposed on the camera PCB; and a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing, wherein the heat dissipating structure includes a heat transfer member that is formed between the camera bracket and the polymer area and that extends between the printed circuit board and the support plate.

2 . The electronic device of claim 1 , wherein:
the first opening is formed on a periphery of the plate structure, and a peripheral portion and an inner wall of the first opening are formed by the polymer portion.

3 . The electronic device of claim 1 , further comprising a display module configured to form a surface of the electronic device,
wherein the frame structure of the housing includes a seating area that is included in the polymer portion and that extends toward an interior of the housing and has at least a portion configured to cover a portion of the first opening, wherein the display module is seated on the seating area, and wherein the seating area includes a second opening with which the light emitting unit and the light receiving unit are aligned.

4 . The electronic device of claim 3 , wherein:
the display module includes a first cover configured to form the surface of the electronic device, a plurality of layers stacked on the first cover and configured to face toward the plate structure, and a hole formed through the plurality of layers, the hole is formed to be at least partially aligned with the second opening, and the light emitting unit and the light receiving unit of the camera module are exposed on the surface of the electronic device through the first cover and are configured to transmit and receive light through the hole and the first cover.

5 . The electronic device of claim 1 , wherein the polymer portion includes an antenna pattern formed in a position adjacent to the camera module.

6 . The electronic device of claim 1 , wherein:
the printed circuit board includes a first surface configured to face toward the plate structure and a second surface opposite to the first surface, the first surface includes a first contact area configured to make contact with the metal portion included in the plate structure, the second surface includes a second contact area on which the heat transfer member is disposed, the printed circuit board includes a plurality of first vias configured to pass through the first contact area and the second contact area, and the heat transfer member is connected with the first vias.

7 . The electronic device of claim 6 , wherein the heat dissipating structure further includes:
a heat conductive tape disposed between the heat transfer member and the second contact area; and a first metal layer formed between the heat conductive tape and the second contact area.

8 . The electronic device of claim 6 , wherein the heat dissipating structure further includes a graphite sheet disposed between the heat transfer member and the camera bracket.

9 . The electronic device of claim 1 , wherein the heat transfer member of the heat dissipating structure is attached to the support plate by a heat conductive tape.

10 . The electronic device of claim 1 , wherein the camera bracket supports the camera PCB such that the camera PCB is spaced apart from the heat transfer member at a certain interval.

11 . The electronic device of claim 1 , wherein the camera bracket further includes a cushion member seated on at least a portion of the heat transfer member.

12 . The electronic device of claim 1 , further comprising:
a display module including a first cover configured to form a surface of the electronic device and a plurality of layer structures stacked in a direction toward the plate structure from the first cover; and a second camera module formed adjacent to the camera module, the second camera module including a second camera device, wherein the display module further includes a through-hole formed through the plurality of layer structures, and wherein the second camera device is aligned with the through-hole.

13 . The electronic device of claim 1 , wherein the camera bracket includes a third opening formed such that the camera PCB is viewed in a direction toward the support plate, and
wherein the heat transfer member is formed to cover the third opening.

14 . The electronic device of claim 1 , wherein:
the camera PCB includes a mounting area on which the light emitting unit and the light receiving unit are disposed and a peripheral area around the mounting area, the camera bracket supports the peripheral area of the camera PCB, and the camera PCB includes a plurality of vias formed in the mounting area.

15 . The electronic device of claim 1 , wherein:
the camera PCB further includes an extension extending between the printed circuit board and the metal portion of the housing and a connector formed on the extension and coupled to a corresponding connector formed on the printed circuit board, and the extension includes a heat transfer layer containing a thermal adhesive material.

16 . The electronic device of claim 15 , wherein the camera PCB is formed of a flexible PCB.

17 . The electronic device of claim 15 , wherein:
the printed circuit board includes a first surface configured to face toward the plate structure and a second surface opposite to the first surface, the extension extends to the second surface of the printed circuit board, and the extension further includes a third metal layer configured to make contact with the metal portion of the housing.

18 . The electronic device of claim 17 , wherein:
the printed circuit board further includes a ground layer in which a ground area is formed and a ground via extending from the ground layer to the second surface of the printed circuit board, the extension further includes a graphite sheet attached to the third metal layer by a heat conductive tape, and the graphite sheet is connected to the ground via.

19 . The electronic device of claim 1 , further comprising a display module configured to cover the plate structure,
wherein the plate structure includes a first surface configured to face the display module and a second surface on which the printed circuit board is disposed.

20 . The electronic device of claim 1 , wherein:
the heat dissipating structure includes a first metal layer formed on the camera PCB and a second metal layer for

Assignees

• Samsung Electronics Co Ltd

Inventors

• Huh Jaeyoung
• Park Kyungwan
• Kang Seunghoon
• Kim Boram
• Kim Youngjin
• Moon Sunghoon
• Moon Hongki
• Park Yoonsun
• Yun Hajoong
• Lim Jonghoon

Classifications

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• G03B30/00

  Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles · CPC title

• G03B2217/002

  Details of arrangement of components in or on camera body · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• G03B17/55 Primary

  with provision for heating or cooling, e.g. in aircraft · CPC title