Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
US2020312805A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020312805-A1 |
| Application number | US-201816083218-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 21, 2018 |
| Priority date | May 16, 2018 |
| Publication date | Oct 1, 2020 |
| Grant date | — |
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The present disclosure relates to an anisotropic conductive film (ACF) with controllable distribution state of conductive substance and a manufacturing method thereof. The ACF includes: a porous template, a plurality of conductive tubes, and an insulation glue layer. A plurality of through holes are configured on the porous template and to penetrate the porous template along a thickness direction of the porous template. Each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template. As such, the distribution state of the conductive tube may be controlled by controlling the density of the through holes within the porous template during the preparation process, and the distribution state of the conductive substances in the ACF may be precisely controlled.
Opening claim text (preview).
What is claimed is: 1 . An anisotropic conductive film (ACF) with a controllable distribution state of conductive substance, comprising: a porous template, a plurality of conductive tubes, and an insulation glue layer; wherein a plurality of through holes are configured on the porous template and are configured to penetrate the porous template along a thickness direction of the porous template, each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template. 2 . The ACF according to claim 1 , wherein the insulation glue layer covers two opposite sides of the through holes porous template, and the insulation glue layer completely covers the conductive tubes. 3 . The ACF according to claim 2 ; wherein the through holes are formed on the porous template in an array, and each of the conductive tubes respectively corresponds to one through hole. 4 . The ACF according to claim 1 , wherein the porous template is made of SiO 2 or porous anodized aluminum. 5 . The ACF according to claim 1 , wherein the insulation glue layer is an epoxy resin or an acrylic adhesive. 6 . The ACF according to claim 1 , wherein the conductive tube is carbon nanotube (CNT). 7 . The ACF according to claim 6 , wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template. 8 . The ACF according to claim 2 , wherein the conductive tube is CNT. 9 . The ACF according to claim 8 ; wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template. 10 . The ACF according to claim 3 , wherein the conductive tube is CNT. 11 . The ACF according to claim 10 , wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template. 12 . A manufacturing method of an ACF with a controllable distribution state of conductive substance, wherein the ACF comprises: a porous template, a plurality of conductive tubes, and an insulation glue layer; wherein a plurality of through holes are configured on the porous template and are configured to penetrate the porous template along a thickness direction of the porous template, each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template; the manufacturing method comprises: providing the porous template configured with the plurality through holes; forming a conductive tube array, wherein each of the conductive tubes in the conductive tube array is respectively configured within one through hole of the porous template, and two ends of each of conductive tubes protrude from the through holes; coating an insulation glue layer on two sides of the porous template covering the two ends of the conductive tube. 13 . The manufacturing method according to claim 12 , wherein the conductive tube is methane or acetylene, and is obtained by conducting a chemical vapor deposition (CVD). 14 . The manufacturing method according to claim 12 , wherein the insulation glue layer covers two opposite sides of the through holes porous template, and the insulation glue layer completely covers the conductive tubes. 15 . The manufacturing method according to claim 14 , wherein the through holes are formed on the porous template in an array, and each of the conductive tubes respectively corresponds to one through hole. 16 . The manufacturing method according to claim 12 , wherein the porous template is made of SiO2 or porous anodized aluminum. 17 . The manufacturing method according to claim 12 , wherein the insulation glue layer is an epoxy resin or an acrylic adhesive. 18 . The manufacturing method according to claim 12 , wherein the conductive tube is CNT. 19 . The manufacturing method according to claim 18 , wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template. 20 . The manufacturing method according to claim 15 , wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template.
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Forming coatings · CPC title
comprising polymers · CPC title
not comprising solid metals or solid metalloids, e.g. ceramics · CPC title
comprising metals or metalloids, e.g. solders · CPC title
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