Arrangement and Method for Joining at Least Two Joining Partners

Patent metadata

Field	Value
Publication number	US-2020294956-A1
Application number	US-202016806844-A
Country	US
Kind code	A1
Filing date	Mar 2, 2020
Priority date	Mar 12, 2019
Publication date	Sep 17, 2020
Grant date	—

Abstract

An arrangement for joining two joining members includes a first part having a support surface, a first carrier element configured to carry at least one foil, a transportation unit configured to arrange the first carrier element such that the foil is arranged above the support surface in a vertical direction, and a second part configured to exert pressure to a joining stack, when the joining stack is arranged on the support surface. The joining stack includes a first joining member arranged on the support surface, a second joining member, and an electrically conductive connection layer arranged between the joining members. When pressure is exerted to the joining stack, the foil is arranged between the second part and the joining stack and is pressed onto the joining stack and the joining stack is pressed onto the first part, compressing the connection layer and forming a substance-to-substance bond between the joining members.

First claim

What is claimed is:

1 . An arrangement for joining two joining members, comprising:
a first part comprising a support surface; a first carrier element configured to carry at least one foil; a transportation unit configured to arrange the first carrier element with the at least one foil arranged thereon in such a way that the at least one foil is arranged above the support surface of the first part in a vertical direction; and a second part configured to exert pressure to a joining stack, when the joining stack is arranged on the support surface, wherein the joining stack comprises a first joining member arranged on the support surface, a second joining member, and an electrically conductive connection layer arranged between the first joining member and the second joining member, wherein when pressure is exerted to the joining stack by the second part, the at least one foil is arranged between the second part and the joining stack and is pressed onto the joining stack and the joining stack is pressed onto the first part, thereby compressing the connection layer and forming a substance-to-substance bond between the first joining member and the second joining member.

2 . The arrangement of claim 1 , wherein when the at least one foil carried by the first carrier element is arranged above the support surface, and before pressure is exerted to the joining stack by the second part, a first foil of the at least one foil that is arranged closest to the joining stack is arranged at a first distance greater than zero from an uppermost surface of the joining stack.

3 . The arrangement of claim 1 , wherein the first carrier element comprises a frame with a projection, and wherein when the at least one foil is carried by the first carrier element an edge region of the at least one foil rests on the projection of the frame.

4 . The arrangement of claim 1 , wherein at least one of the first part and the second part comprises a heating element.

5 . The arrangement of claim 1 , further comprising a second carrier element configured to carry the joining stack before arranging the joining stack on the support surface of the first part.

6 . The arrangement of claim 5 , wherein when the at least one foil is arranged above the support surface of the first part, the first carrier element is arranged on the second carrier element.

7 . The arrangement of claim 1 , wherein when the at least one foil is arranged above the support surface of the first part, the first carrier element is partly arranged above an edge region of the first joining member in the vertical direction.

8 . The arrangement of claim 1 , wherein the first carrier element comprises fastening or holding means configured to hold the at least one foil in place, when the at least one foil is arranged on the first carrier element.

9 . The arrangement of claim 1 , wherein the at least one foil comprises a compensation foil configured to evenly distribute a pressure exerted by the second part over the joining stack.

10 . The arrangement of claim 9 , wherein the compensation foil comprises silicone heat-resistant rubbery or rubber material, or an elastomer that is resistant to heat at least up to temperatures between 150° C. and 250° C.

11 . The arrangement of claim 1 , wherein the at least one foil comprises a protective foil configured to prevent contaminants from contaminating the joining members.

12 . The arrangement of claim 11 , wherein the protective foil comprises an inert polymer or a polyimide.

13 . The arrangement of claim 1 , further comprising holding elements configured to be arranged on the first part, wherein when the first carrier element is arranged in a final resting position on the first part, the holding elements are configured to be arranged between the first carrier element and the first part.

14 . The arrangement of claim 13 , wherein the holding elements are configured to hold down the first joining member on the support surface in the vertical direction.

15 . The arrangement of claim 1 , further comprising a first robotic unit configured to pick up the at least one foil and assemble the at least one foil on the first carrier element.

16 . The arrangement of claim 15 , further comprising a second robotic unit configured to transfer the first carrier element with the at least one foil arranged thereon to a process chamber.

17 . The arrangement of claim 16 , further comprising a third robotic unit configured to transfer the joining stack to the process chamber.

18 . A method, comprising:
arranging a first joining member, an electrically conductive connection layer, and a second joining member on a support surface of a first part to form a joining stack, wherein the electrically conductive connection layer is arranged between the first joining member and the second joining member; arranging at least one foil on a first carrier element; using a transportation unit to arrange the first carrier element such that the at least one foil is arranged above the support surface of the first part in a vertical direction; and exerting pressure to the joining stack by a second part, wherein when the at least one foil is arranged above the support surface and pressure is exerted to the joining stack by the second part, the at least one foil is arranged between the second part and the joining stack and is pressed onto the joining stack, and the joining stack is pressed onto the first part, thereby compressing the connection layer and forming a substance-to-substance bond between the first joining member and the second joining member.

19 . The method of claim 18 , wherein forming the substance-to-substance bond between the first joining member and the second joining member is performed in a process chamber comprising one or more sub-chambers, and wherein either the joining stack and the first carrier element with the at least one foil are both assembled and transferred into a first sub-chamber, wherein a defined atmosphere is generated in the first sub-chamber and the joining stack and the foil stack are subsequently transferred to a second sub-chamber, and wherein the joining process is performed in the second sub-chamber.

20 . The method of claim 18 , wherein the joining stack is assembled and transferred into a first sub-chamber, wherein a defined atmosphere is generated in the first sub-chamber, wherein the first carrier element with the at least one foil is assembled in a third sub-chamber, wherein the joining stack and the first carrier element with the at least one foil arranged thereon are subsequently transferred to a second sub-chamber, and wherein the joining process is performed in the second sub-chamber.

Assignees

• Infineon Technologies Ag

Inventors

• Hartmann Steffen
• Speckels Roland

Classifications

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07125

  Means for controlling the bonding environment, e.g. valves or vacuum pumps · CPC title

• H10W72/07118

  Means for cleaning, e.g. brushes · CPC title

• H10W72/011

  Apparatus therefor · CPC title