Packing material, method for producing packing material, reading device, stored-article management system, disconnection detection device, unsealing detection label, and unsealing detection system

Patent metadata

Field	Value
Publication number	US-2020293849-A1
Application number	US-201816652898-A
Country	US
Kind code	A1
Filing date	Sep 27, 2018
Priority date	Oct 4, 2017
Publication date	Sep 17, 2020
Grant date	—

Abstract

A package in an aspect of the present invention includes: a package body having a receiving cavity for receiving a cavity item; a sheet for sealing the receiving cavity; a conducting wire formed on the sheet so as to pass above the sealed opening portion of the receiving cavity; and a wireless communication device formed on the sheet so as to be connected to the conducting wire. The wireless communication device transmits a signal including information which differs between before and after the conducting wire together with the sheet is cut as a result of opening the receiving cavity. The information transmitted from the wireless communication device is read by a reader. The package and the reader are used for a cavity item management system.

First claim

1 - 32 . (canceled)

33 . A package, comprising:
a package body including a receiving cavity for receiving a cavity item; a sheet sealing said receiving cavity; a conducting wire formed on said sheet so as to pass above an opening portion of said receiving cavity, said opening portion being sealed; and a wireless communication device formed on said sheet so as to be connected to said conducting wire, wherein said wireless communication device transmits a signal including information which differs between before and after said conducting wire together with said sheet is cut as a result of opening said receiving cavity.

34 . The package according to claim 33 ,
wherein said package body has a plurality of said receiving cavities; wherein said conducting wire is formed on said sheet so as to correspond to each of said plurality of said receiving cavities; and wherein at least one said wireless communication device is formed on said sheet.

35 . The package according to claim 33 ,
wherein said package body has a plurality of said receiving cavities; and wherein said conducting wires and said wireless communication devices are each formed on said sheet so as to correspond to each of said plurality of said receiving cavities.

36 . The package according to claim 33 ,
wherein said wireless communication device has a memorizing method; wherein said memorizing method has at least one memory element; wherein said conducting wire is connected to said memory element; wherein said information is read out of said memory element in such a manner that said information differs between before and after said conducting wire is cut; and wherein said conducting wire comprises a bit line connected to at least one said memory element.

37 . The package according to claim 33 ,
wherein said wireless communication device has a memorizing method; wherein said memorizing method has a memory array formed by arranging a plurality of memory elements; wherein said conducting wire is connected to at least one of said plurality of memory elements; and wherein said information is read out of said memory array in such a manner that said information differs between before and after said conducting wire is cut.

38 . The package according to claim 37 ,
wherein said memory array comprises:
a plurality of first wires;
at least one second wire intersecting said plurality of first wires; and
said plurality of memory elements which are each provided so as to correspond to each of the intersections between said plurality of first wires and said at least one second wire and which each have: a first electrode and a second electrode which are spaced from each other; a third electrode connected to one of said at least one second wire; and an insulating layer electrically insulating said first electrode and said second electrode from said third electrode;
wherein one of said first electrode and said second electrode is connected to one of said plurality of first wires;
wherein at least one of said plurality of memory elements has a semiconductor layer in a region between said first electrode and said second electrode; wherein said plurality of memory elements are composed of memory elements of two different kinds having different inter-electrode electrical characteristics of the first electrode and the second electrode; and wherein information recorded in said memory array is determined by an arrangement obtained by any combination of said memory elements of two kinds.

39 . The package according to claim 38 ,
wherein, of said memory elements of two kinds, the memory element(s) of one kind has/have said semiconductor layer, and the memory element(s) of the other kind does/do not have said semiconductor layer; and wherein said memory element(s) of one kind and said memory element(s) of the other kind each record information which differs between each other according to whether said memory elements of two kinds each have the semiconductor layer.

40 . The package according to claim 38 , wherein said semiconductor layer contains one or more selected from the group consisting of carbon nanotubes, graphene, and fullerene.

41 . The package according to claim 38 , wherein said semiconductor layer contains a carbon nanotube composite in which a conjugated polymer is adhered to at least a part of the surface of a carbon nanotube.

42 . The package according to claim 33 ,
wherein said wireless communication device has a modulation circuit; wherein said conducting wire is connected to said modulation circuit; and wherein said signal including information is modulated by said modulation circuit in such a manner that said information differs between before and after said conducting wire is cut.

43 . The package according to claim 42 ,
wherein said modulation circuit comprises:
a switch circuit; and
a plurality of resistance elements connected to said switch circuit;
wherein said conducting wire is connected to at least one of said plurality of resistance elements.

44 . The package according to claim 43 ,
wherein said switch circuit comprises a transistor having a semiconductor layer; and wherein said semiconductor layer contains a carbon nanotube composite in which a conjugated polymer is adhered to at least a part of the surface of a carbon nanotube.

45 . A method of producing a package including: a package body having at least one receiving cavity for receiving a cavity item; and a sheet sealing said at least one receiving cavity; said method comprising:
a functional portion formation step wherein a conductive wire and at least one wireless communication device are formed on a substrate constituting said sheet, wherein said conducting wire passes above an opening portion of said receiving cavity, said opening portion being sealed, and wherein said wireless communication device is connected to said conducting wire and transmits a signal including information which differs between before and after said conducting wire together with said sheet is cut as a result of opening said receiving cavity; and an adhering step wherein said sheet is adhered to said package body in such a manner that said receiving cavity of said package body is sealed by the adhered sheet, wherein said package body has said cavity item received in said receiving cavity, and wherein said sheet has at least one said conducting wire and said at least one wireless communication device formed on said substrate, wherein said wireless communication device has a memory array including, on said substrate, a plurality of first wires, at least one second wire intersecting said plurality of first wires, and a plurality of memory elements which are each provided to correspond to each of the intersections between said plurality of first wires and said at least one second wire; wherein said plurality of memory elements each have: a first electrode and a second electrode which are spaced from each other; a third electrode connected to one of said at least one second wire; and an insulating layer electrically insulating said first electrode and said second electrode from said third electrode; wherein, in said functional portion formation step, a coating layer is formed, by a coating method, in a region between said first electrode and said second electrode in at least one of said plurality of memory elements, and said memory arrays having recorded information which differs between/among said plurality of said receiving cavities are each produced for each of said plurality of said wireless communication devices; and wherein said coating method is one selected from the group cons

Assignees

• Toray Industries

Inventors

• Wakita Junji
• Murase Seiichiro

Classifications

• G06K19/0723 Primary

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