Printed wiring board

Patent metadata

Field	Value
Publication number	US-2020281069-A1
Application number	US-202016794605-A
Country	US
Kind code	A1
Filing date	Feb 19, 2020
Priority date	Feb 28, 2019
Publication date	Sep 3, 2020
Grant date	—

Abstract

A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.

First claim

What is claimed is:

1 . A printed wiring board comprising:
a wiring board body; a first connection part that has a higher heat conductivity than a heat conductivity of the wiring board body, and connects the wiring board body and a first element; and a second connection part that has a higher heat conductivity than the heat conductivity of the wiring board body, and connects the wiring board body and a second element, wherein the first connection part includes: (i) a heat-receiving front surface that is a first land formed on a front surface of the wiring board body; (ii) a heat-receiving back surface formed on a back surface of the wiring board body; (iii) a main-heat conducting part that is a through-hole into which a terminal of the first element is inserted, and which inter-connects the heat-receiving front surface and the heat-receiving back surface; and (iv) a sub-heat conducting part that inter-connects the heat-receiving front surface and the heat-receiving back surface, the second connection part includes a second land that is formed on one of the front and back surfaces of the wiring board body, and is not connected to any conductor pattern formed on an opposite one of the front and back surfaces of the wiring board body, and the heat-receiving front surface includes: (i) a shielded area that is hidden by the first element when the terminal of the first element is connected to the first connection part, and is connected to an end of the main-heat conducting part; and (ii) an exposed area that is exposed when the first element is connected to the first connection part, and is connected to an end of the sub-heat conducting part.

2 . The printed wiring board according to claim 1 , wherein
when the first element is connected to the first connection part, a distance between the main-heat conducting part and an outer edge of the heat-receiving front surface in a predetermined direction is longer than a distance between the terminal of the first element and an outer edge of the first element in the predetermined direction, and the predetermined direction is a direction in which, on the front surface of the wiring board body, the distance between the main-heat conducting part and the outer edge of the heat-receiving front surface is greatest.

3 . The printed wiring board according to claim 1 , wherein
the first connection part further includes an inner heat conducting part that is formed in an interior of the wiring board body and inter-connects the main-heat conducting part and the sub-heat conducting part.

4 . The printed wiring board according to claim 1 comprising a plurality of the first connection parts, wherein
numbers of the sub-heat conducting parts included in the plurality of the first connection parts are equal.

5 . The printed wiring board according to claim 1 comprising a plurality of the first connection parts, wherein
lengths of the outer edges of a plurality of the heat-receiving front surfaces included in the plurality of the first connection parts are equal.

6 . The printed wiring board according to claim 1 comprising a plurality of the first connection parts, wherein
areas of the plurality of the first connection parts are equal.

7 . The printed wiring board according to claim 1 comprising a plurality of the first connection parts, wherein
shapes of the plurality of the first connection parts are identical.

Assignees

• Denso Ten Ltd

Inventors

• Katada Nobuhisa
• Hosogi Kotaro
• Watanabe Yasuyuki
• Tanaka Toshiyuki

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2201/09609

  Via grid, i.e. two-dimensional array of vias or holes in a single plane · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title