Switch and method of manufacturing switch

Patent metadata

Field	Value
Publication number	US-2020258697-A1
Application number	US-202016778049-A
Country	US
Kind code	A1
Filing date	Jan 31, 2020
Priority date	Feb 12, 2019
Publication date	Aug 13, 2020
Grant date	—

Abstract

A switch includes a housing, a switching mechanism housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and an electronic component that is disposed in the housing and electrically connects the terminals to each other. The switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation.

First claim

What is claimed is:

1 . A switch, comprising:
a housing; a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts; and an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein the switching mechanism includes
a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and
a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation;
the first exposed part includes a first electrode mounting part on which the first electrode is placed, a first soldering part on which solder is placed, and a first peripheral part disposed along an edge of the first soldering part; the second exposed part includes a second electrode mounting part on which the second electrode is placed, a second soldering part on which solder is placed, and a second peripheral part disposed along an edge of the second soldering part; and each of the first peripheral part and the second peripheral part has a U-shape.

2 . The switch as claimed in claim 1 , wherein the first peripheral part includes a curved part.

3 . The switch as claimed in claim 1 , wherein the first peripheral part includes a corner.

4 . The switch as claimed in claim 1 , wherein the first exposed part and the second exposed part are arranged symmetrically with respect to the electronic component.

5 . The switch as claimed in claim 1 , wherein the first exposed part of the first metal plate and a remaining part of the first metal plate are formed of different materials.

6 . The switch as claimed in claim 1 , wherein the second exposed part of the second metal plate and a remaining part of the second metal plate are formed of different materials.

7 . The switch as claimed in claim 1 , wherein the first exposed part of the first metal plate and a remaining part of the first metal plate are formed monolithically with a same material.

8 . The switch as claimed in claim 1 , wherein the second exposed part of the second metal plate and a remaining part of the second metal plate are formed monolithically with a same material.

9 . The switch as claimed in claim 1 , wherein the electronic component is a resistor.

10 . The switch as claimed in claim 1 , wherein
the housing includes a case and a holding part that holds the first metal plate and the second metal plate; and the holding part is formed of a material with a heat distortion temperature lower than a reflow temperature.

11 . A method of manufacturing a switch that includes
a housing, a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, the method comprising: soldering a first electrode of the electronic component by laser irradiation to a first metal plate connected to a first contact that is one of the common contact and the two switching contacts; and soldering a second electrode of the electronic component by laser irradiation to a second metal plate connected to a second contact that is another one of the common contact and the two switching contacts.

12 . A switch, comprising:
a housing; a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts; and an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein the switching mechanism includes
a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and
a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation;
the first exposed part includes a first electrode mounting part on which the first electrode is placed; the second exposed part includes a second electrode mounting part on which the second electrode is placed; the first exposed part further includes a first protruding part that protrudes from the first electrode mounting part in a direction away from the second electrode mounting part; the second exposed part further includes a second protruding part that protrudes from the second electrode mounting part in a direction away from the first electrode mounting part; the first metal plate further includes a first connecting part that connects the first exposed part to a remaining part of the first metal plate, the first connecting part being disposed closer to the second exposed part than the first protruding part; and the second metal plate further includes a second connecting part that connects the second exposed part to a remaining part of the second metal plate, the second connecting part being disposed closer to the first exposed part than the second protruding part.

Assignees

• Alps Alpine Co Ltd

Inventors

• Umezu Takahiro
• Tanaka Takaki
• Natsuizaka Keiko

Classifications

• H01H1/365

  Bridging contacts · CPC title

• H01H2229/048

  Insertion moulding · CPC title

• H01H2229/04

  Solder problems · CPC title

• H01H11/06

  Fixing of contacts to carrier {; Fixing of contacts to insulating carrier} · CPC title

• H01H13/12

  Movable parts; Contacts mounted thereon · CPC title