Silver-containing film and method for producing same
US-2024279816-A1 · Aug 22, 2024 · US
Metallic material and connection terminal
US2020235511A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020235511-A1 |
| Application number | US-201916695868-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 26, 2019 |
| Priority date | Jan 18, 2019 |
| Publication date | Jul 23, 2020 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
First claim
Opening claim text (preview).
What is claimed is: 1 . A metallic material comprising: a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio. 2 . The metallic material according to claim 1 , wherein at least part of the In contained in the surface layer is an Ag—In alloy. 3 . The metallic material according to claim 1 , wherein the surface layer includes an Ag portion containing Ag as a main constituent, and a high-concentration In portion containing higher-concentration In than the Ag portion, and the Ag portion and the high-concentration In portion are both exposed on the outermost surface. 4 . The metallic material according to claim 3 , wherein the Ag portion is made of soft silver. 5 . The metallic material according to claim 1 , wherein the content of the In contained in the surface layer is 5% or more to the Ag in atomic ratio. 6 . The metallic material according to claim 1 , the content of the In in the surface layer is 25% or less to the Ag in atomic ratio. 7 . The metallic material according to claim 1 , wherein a total amount of the In contained in the surface layer detected by an X-ray diffraction method is an Ag—In alloy. 8 . The metallic material according to claim 1 , wherein the base material is made of Cu or a Cu alloy, and includes, between the base material and the surface layer, an intermediate layer containing at least one kind selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. 9 . A connection terminal being made of the metallic material according to claim 1 , wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
Assignees
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Classifications
Fe-base component · CPC title
Cr-base component · CPC title
Next to Co-, Fe-, or Ni-base component · CPC title
Next to Co-, Cu-, or Ni-base component · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
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- What does patent US2020235511A1 cover?
- A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion elec…
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jul 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).