Composite material with adhesion promoter layer based on si, c and o

Patent metadata

Field	Value
Publication number	US-2020223152-A1
Application number	US-202016737946-A
Country	US
Kind code	A1
Filing date	Jan 9, 2020
Priority date	Jan 11, 2019
Publication date	Jul 16, 2020
Grant date	—

Abstract

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

First claim

What is claimed is:

1 . A composite material, comprising:
a substrate and a polymer layer which are interconnected by an adhesion promoter layer, wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound.

2 . The composite material according to claim 1 , wherein the substrate comprises a metal substrate or a polymer substrate.

3 . The composite material according to claim 1 , wherein the organosilicon compound comprises a siloxane, silane, or silicate.

4 . The composite material according to claim 3 , wherein the siloxane comprises hexamethyldisiloxane (HMDSO), and/or
wherein the silane comprises tetramethylsilane (TMS).

5 . The composite material according to claim 1 , wherein the unsaturated hydrocarbon comprises ethylene or acetylene.

6 . The composite material according to claim 1 , wherein the adhesion promoter layer is formed as a gradient layer, and
wherein in the gradient layer, a proportion of carbon increases toward the polymer layer and a proportion of Si decreases toward the polymer layer.

7 . The composite material according to claim 1 , wherein the polymer layer is obtainable by applying a polymer compound to the adhesion promoter layer and crosslinking it to form the polymer layer, and
wherein the adhesion promoter layer is covalently bonded to the polymer layer.

8 . The composite material according to claim 1 , wherein a surface of the adhesion promoter layer and/or the adhesion promoter layer as a whole comprises:
Si: 3 at. % to 25 at. %, in particular 4 at. % to 20 at. %, C: 50 at. % to 90 at. %, in particular 60 at. % to 85 at. %, O: 5 at. % to 25 at. %, in particular 10 at. % to 20 at. %.

9 . The composite material according to claim 1 , wherein the polymer layer comprises a polymer selected from fluorine rubber (FKM); ethylene propylene copolymers comprising ethylene propylene diene rubber (EPDM), polyacrylate rubber (ACM), or ethylene acrylate rubber (AEM); butadiene rubber comprising acrylonitrile butadiene rubber (NBR), hydrated acrylonitrile butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubbers, natural rubber (NR), chloroprene rubber (CR), or epichlorohydrin rubber (ECO); polyurethane; or epoxy polymers.

10 . The composite material according to claim 1 , wherein the substrate is not a fluoropolymer.

11 . The composite material according to claim 1 , wherein the substrate, the adhesion promoter layer, and the polymer layer are not connected using an additional binder.

12 . The composite material according to claim 1 , wherein the adhesion promoter layer has a thickness of 30 nm to 10 μm.

13 . A sealing article, comprising:
the composite material according to claim 1 .

14 . A method for producing the composite material according to claim 1 , comprising the steps of:
(a) providing the substrate; (b) coating the substrate with the adhesion promoter layer by plasma-enhanced chemical vapor deposition (PE-CVD); (c) applying a polymer compound to the adhesion promoter layer; and (d) crosslinking the polymer compound, wherein the adhesion promoter layer is covalently bonded to the polymer layer.

15 . The method according to claim 14 , wherein when the polymer compound is crosslinked in step (d), unsaturated carbon bonds at a surface of the adhesion promoter layer react with the polymer compound.

16 . A method for using an adhesion promotor layer, comprising:
using the adhesion promoter layer to connect a substrate to a polymer layer, wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) carried out with a mixture of precursor compounds containing at least one unsaturated hydrocarbon and at least one organosilicon compound.

17 . A method of using the composite material according to claim 1 , comprising:
providing the composite material as a sealing article, or using the composite material to produce a sealing article.

18 . The composite material according to claim 8 , wherein the surface of the adhesion promoter layer and/or the adhesion promoter layer as a whole comprises:
Si: 4 at. % to 20 at. %, C: 60 at. % to 85 at. %, O: 10 at. % to 20 at. %.

19 . The composite material according to claim 18 , wherein a sum of Si+C+O is >90%, and
wherein a remainder is H, N, and additional elements from the substrate.

20 . The composite material according to claim 8 , wherein a sum of Si+C+O is >90%, and
wherein a remainder is H, N, and additional elements from the substrate.

Assignees

• Freudenberg Carl Kg

Inventors

• Von Fragstein Friederike
• Marksteiner Albin
• Christopher Roman
• Rutz Stephan
• Hallstein Katharina
• Feller Kai
• Fetsch Yvonne
• Adler Matthias

Classifications

• Y10T428/31536

  Including interfacial reaction product of adjacent layers · CPC title

• Y10T428/31663

  As siloxane, silicone or silane · CPC title

• B32B27/283

  comprising polysiloxanes · CPC title

• Y10T428/265

  1 mil or less · CPC title

• C09K2323/053

  Organic silicon compound, e.g. organosilicon · CPC title