Electric heater for thermal energy storage
US-2024393013-A1 · Nov 28, 2024 · US
US2020217587A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020217587-A1 |
| Application number | US-201414227083-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 27, 2014 |
| Priority date | Mar 27, 2014 |
| Publication date | Jul 9, 2020 |
| Grant date | — |
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Heat exchange structure. A hydrophilic, thermally conductive porous medium includes nanostructures formed substantially uniformly throughout the porous medium providing a balance of capillary and viscous forces to self-regulate a liquid-vapor contact line. A suitable porous medium is copper. A method for making the structure is also disclosed.
Opening claim text (preview).
1 . Heat exchange structure comprising: a hydrophobic nonporous region adjacent to a hydrophilic porous media evaporator, the hydrophilic porous media evaporator being a thermally conductive porous medium including nanostructures, the nanostructures both in central portions of the porous medium as well as on surfaces of the porous medium configured to provide a balance of capillary and viscous forces to self-regulate a liquid-vapor contact line such that active throttling is not required and the porous medium remain hydrophilic in the presence of organic contaminates, and a hydrophobic cap layer directly over the thermally conductive porous medium. 2 . The structure of claim 1 wherein the porous medium is copper. 3 . The structure of claim 1 wherein the hydrophobic cap layer includes butadiene-styrene, silicone or teflon. 4 . Method for making a heat exchange structure comprising: anodizing a porous copper structure in an oxidizing alkaline medium at approximately 75° C., the oxidizing alkaline medium comprising sodium chlorite, sodium hydroxide, and sodium phosphate tribasic dodecahydrate and deionized water, whereby nanostructures are formed throughout the porous copper structure. 5 . The method of claim 4 wherein the solution is (75:1:5:100) weight percent. 6 . The method of claim 4 further including holding the copper porous medium at approximately 1.5 volts relative to a counter electrode in pulses of approximately 20 seconds duration with approximately 10 seconds between pulses to improve uniformity of nanostructure growth. 7 . The structure of claim 1 disposed on the surface of a finned tube. 8 . The structure of claim 1 disposed on the surface of a flat plate.
Thermal energy storage · CPC title
hydrophilic · CPC title
especially adapted for evaporator or condenser surfaces (F28F13/187 takes precedence) · CPC title
with plate-like or laminated conduits {(stacked plates having one or more openings therein to form tubular heat-exchange passages F28F3/086)} · CPC title
with tubular conduits {(F28D1/0246 takes precedence)} · CPC title
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