Capacitor and board having the same

US2020205291A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020205291-A1
Application numberUS-202016804381-A
CountryUS
Kind codeA1
Filing dateFeb 28, 2020
Priority dateJul 20, 2016
Publication dateJun 25, 2020
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 μm 2 , where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

First claim

Opening claim text (preview).

What is claimed is: 1 . A capacitor comprising: a body including a plurality of dielectric layers; first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first insulating region, disposed in each of the first internal electrodes, including a first connection electrode disposed therein; and a second insulating region, disposed in each of the second internal electrodes, including a second connection electrode disposed therein, wherein D 1 ×Td and D 2 ×Td are greater than 20 μm 2 and 60 μm 2 or less, where Td is a thickness of the dielectric layer, and D 1 and D 2 are widths of the first and second insulating regions, respectively. 2 . The capacitor of claim 1 , wherein the first and second insulating regions and the first and second connection electrodes are disposed at edges of the first and second internal electrodes. 3 . The capacitor of claim 1 , wherein the capacitor includes at least two first insulating regions each disposed in each of the first internal electrodes, at least two second insulating regions disposed in each of the second internal electrodes, at least two first connection electrodes disposed in the at least two first insulating regions and interconnecting the second internal electrodes, and at least two second connection electrodes disposed in the at least two second insulating regions and interconnecting the first internal electrodes. 4 . The capacitor of claim 1 , further comprising first and second external electrodes disposed on an external surface of the body, wherein the first external electrode is electrically connected to the first internal electrodes through the second connection electrode, and the second external electrode is electrically connected to the second internal electrodes through the first connection electrode. 5 . The capacitor of claim 1 , wherein a distance between the first and second connection electrodes is equal to or less than 85% of a length of the body. 6 . The capacitor of claim 1 , wherein at least portions of the first and second internal electrodes are exposed to a side surface of the body. 7 . A board having a capacitor, the board comprising: a circuit board having an upper surface on which first and second electrode pads are formed; and the capacitor of claim 1 , mounted on the first and second electrode pads of the circuit board. 8 . A capacitor comprising: a body including a plurality of dielectric layers; first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first insulating region, disposed in each of the first internal electrodes, including a first connection electrode disposed therein; and a second insulating region, disposed in each of the second internal electrodes, including a second connection electrode disposed therein; wherein D 1 ×Td and D 2 ×Td are greater than 20 μm 2 and 60 μm 2 or less, where Td is a thickness of the dielectric layer, and D 1 and D 2 are widths of the first and second insulating regions, respectively. 9 . The capacitor of claim 8 , wherein D 1 is a minimum distance between a first internal electrode and the first connection electrode, and D 2 is a minimum distance between a second internal electrode and the second connection electrode. 10 . The capacitor of claim 8 , wherein the first connection electrode interconnects the second internal electrodes and is insulated from the first internal electrodes by the first insulating region, and the second connection electrode interconnects the first internal electrodes and is insulated from the second internal electrodes by the second insulating region. 11 . The capacitor of claim 8 , wherein the first insulating region contacts an edge of the first internal electrodes, and the second insulating region contacts an edge of the second internal electrodes. 12 . The capacitor of claim 11 , wherein the first insulating region has a substantially semi-circular shape surrounding the first connection electrode, and the second insulating region has a substantially semi-circular shape surrounding the second connection electrode. 13 . The capacitor of claim 8 , wherein a distance between the first and second connection electrodes is greater than a sum of radii of the first and second connection electrodes, the widths D 1 and D 2 of the first and second insulating regions, and a 20 μm interval.

Assignees

Inventors

Classifications

  • Manufacturing or production processes characterised by the final manufactured product · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

  • H05K1/181Primary

    associated with surface mounted components · CPC title

  • Leadless components · CPC title

  • Non-printed capacitor · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2020205291A1 cover?
A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating regi…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jun 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).