Surface-treated steel sheet
US-2024044013-A1 · Feb 8, 2024 · US
US2020199762A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020199762-A1 |
| Application number | US-202016810350-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 5, 2020 |
| Priority date | Apr 4, 2014 |
| Publication date | Jun 25, 2020 |
| Grant date | — |
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A method for fabricating a substrate provided with a plurality of layers, includes: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer.
Opening claim text (preview).
What is claimed is: 1 . A method for fabricating a substrate provided with a plurality of layers, the method comprising: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer. 2 . The method as recited in claim 1 wherein the providing of the metal coating layer includes depositing the metal coating layer by a vacuum deposition process. 3 . The method as recited in claim 1 wherein the providing of the metal coating layer includes depositing the metal coating layer by an electro-deposition process. 4 . The method as recited in claim 1 wherein the providing of the metal coating layer occurs includes a magnetron cathode pulverization process. 5 . The method as recited in claim 1 wherein the providing of the anti-corrsion layer includes depositing the anti-corrosion layer by a vacuum deposition process. 6 . The method as recited in claim 1 wherein the providing of the anti-corrosion layer includes depositing the anti-corrosion layer by an electro-deposition process. 7 . The method as recited in claim 1 wherein the steel substrate with the oxide layer is provided without pickling the oxide layer. 8 . The method as recited in claim 1 wherein the oxide layer is in direct contact with the steel substrate. 9 . The method as recited in claim 1 further comprising depositing an aluminum-based coating on the steel substrate, the oxide layer being directly on the aluminum-based coating. 10 . The method as recited in claim 9 wherein the aluminum-based coating is deposited by hot dipping. 11 . The method as recited in claim 9 wherein the aluminum-based coating has a thickness of between 10 and 30 μm. 12 . The method as recited in claim 1 further comprising providing a further oxide layer directly on the anti-corrosion coating layer, a further metal coating layer directly on the further oxide layer; and a remainder being iron and impurities from a fabrication process; and a further anti-corrosion coating layer directly on the further metal coating layer. 13 . A method for preparation of a surface of a substrate comprising: providing a layer of metal oxides on a steel substrate without pickling the layer of metal oxides; and depositing a metal coating layer directly on the layer of metal oxides, the metal coating layer including at least 8% by weight nickel and at least 10% by weight chromium, a remainder being iron and impurities resulting from a fabrication process. 14 . The method as recited in claim 13 further comprising the step of depositing an anti-corrosion coating layer on the metal coating layer. 15 . The method as recited in claim 13 wherein the anti-corrosion coating layer is deposited directly on the metal coating layer.
Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) · CPC title
Sputtering · CPC title
on metallic substrates or on substrates of boron or silicon · CPC title
Reactive treatment · CPC title
Non-reactive treatment · CPC title
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