Molded product, metal-clad laminate, printed wiring board, and methods for their production

Patent metadata

Field	Value
Publication number	US-2020198310-A1
Application number	US-202016808502-A
Country	US
Kind code	A1
Filing date	Mar 4, 2020
Priority date	Oct 31, 2017
Publication date	Jun 25, 2020
Grant date	—

Abstract

To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.

First claim

What is claimed is:

1 . A method for producing a molded product, characterized by heat-molding a material which contains a tetrafluoroethylene type polymer and in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, in an atmosphere having an oxygen concentration of less than 10,000 ppm, to produce a molded product in which the content of said components other than the tetrafluoroethylene type polymer is at most 0.9 mass % and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

2 . The production method according to claim 1 , wherein the heat-molding is conducted in an atmosphere having an oxygen concentration of at most 1,000 ppm.

3 . The production method according to claim 1 , wherein the molded product has an extinction coefficient of from 1.2 to 2.0 at a wavelength of 355 nm, or an extinction coefficient of from 2.0 to 4.5 at a wavelength of 266 nm.

4 . The production method according to claim 1 , wherein the tetrafluoroethylene type polymer is a melt-moldable polymer, and the temperature for heating the tetrafluoroethylene type polymer is from (Tm−15) to (Tm+100°) C where Tm is the melting point of the tetrafluoroethylene type polymer.

5 . The production method according to claim 1 , wherein the tetrafluoroethylene type polymer has at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group and an isocyanate group.

6 . A method for producing a metal-clad laminate, characterized by thermocompression bonding a conductive metal foil and a molded product which contains a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm, to produce a metal-clad laminate having a conductive metal layer and a layer of the molded product.

7 . A method for producing a metal-clad laminate, characterized by applying, on the surface of a conductive metal foil, a liquid composition comprising a liquid medium and a material which contains a tetrafluoroethylene type polymer and in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and removing the liquid medium and, at the same time, heating in an atmosphere having an oxygen concentration of less than 10,000 ppm, to let the tetrafluoroethylene type polymer be fusion-bonded to the conductive metal foil, to produce a metal-clad laminate having a conductive metal layer and a layer of a molded product in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

8 . A molded product which contains a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

9 . The molded product according to claim 8 , wherein the molded product has an extinction coefficient of from 1.2 to 2.0 at a wavelength of 355 nm, or an extinction coefficient of from 2.0 to 4.5 at a wavelength of 266 nm.

10 . The molded product according to claim 8 , wherein the tetrafluoroethylene type polymer has at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group and an isocyanate group.

11 . The molded product according to claim 8 , wherein the tetrafluoroethylene type polymer is a melt-moldable polymer.

12 . The molded product according to claim 8 , wherein the molded product is a film.

13 . A metal-clad laminate having a conductive metal layer and a layer of a molded product which contains a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

14 . A printed wiring board having a conductive metal layer and a layer of a molded product which contains a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm, and having through holes in the thickness direction of the layers.

15 . A method for producing a printed wiring board, characterized by irradiating the metal-clad laminate as defined in claim 13 with UV-YAG laser to form through holes in the thickness direction of the metal-clad laminate.

Assignees

• Agc Inc

Inventors

• Kasai Wataru
• Hosoda Tomoya

Classifications

• Y10T428/24322

  Composite web or sheet · CPC title

• Y10T428/24273

  including aperture · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2255/205

  Metallic coating · CPC title