Display substrate and method for making the same, display apparatus

Patent metadata

Field	Value
Publication number	US-2020176711-A1
Application number	US-201916615110-A
Country	US
Kind code	A1
Filing date	May 7, 2019
Priority date	May 9, 2018
Publication date	Jun 4, 2020
Grant date	—

Abstract

There is provided a display substrate, a manufacturing method thereof, and a display device, relating to the field of display technology. The display substrate includes: a base substrate; a self-luminescent layer disposed on a side of the base substrate; and an encapsulation film layer disposed on a side of the self-luminescent layer away from the base substrate. The display substrate has a gap, which penetrates through the self-luminescent layer and the encapsulation film layer, and separates the self-luminescent layer and the encapsulation film layer into at least two parts with a part corresponding to a to-be-perforated area of the display substrate and another part corresponds to a non-perforated area of the display substrate other than the to-be-perforated area. The edge of the encapsulation film layer adjacent to the gap covers the side surface of the edge of the self-luminescent layer adjacent to the gap.

First claim

1 . A display substrate, comprising:
a base substrate; and an encapsulation display layer, comprising a self-luminescent layer disposed on a side of the base substrate, and an encapsulation film layer disposed on a side of the self-luminescent layer away from the base substrate, wherein the display substrate has a gap, which penetrates through the self-luminescent layer and the encapsulation film layer, and separates the encapsulation display layer into at least two parts with a part corresponding to a to-be-perforated area of the display substrate and another part corresponding to a non-perforated area of the display substrate other than the to-be-perforated area; and an edge of the encapsulation film layer adjacent to the gap covers a side surface of the self-luminescent layer adjacent to and facing the gap.

2 . The display substrate according to claim 1 , wherein the encapsulation film layer comprises a first inorganic barrier layer, an organic barrier layer and a second inorganic barrier layer, which are sequentially disposed on the side of the self-luminescent layer away from the base substrate;
an edge of the first inorganic barrier layer adjacent to the gap covers the side surface of the self-luminescent layer adjacent to and facing the gap; and an edge of the second inorganic barrier layer adjacent to the gap covers a side surface of the organic barrier layer adjacent to and facing the gap.

3 . The display substrate according to claim 1 , wherein a width of a side of the gap adjacent to the base substrate is smaller than a width of a side of the gap away from the base substrate.

4 . The display substrate according to claim 3 , wherein a portion of a cross section of the gap adjacent to the base substrate is a trapezoidal shape, and a width of a side of the trapezoidal shape adjacent to the base substrate is smaller than a width of a side of the trapezoidal shape away from the base substrate; and
the cross section of the gap is a cross section obtained by cutting the gap along a width direction of the gap and a direction perpendicular to the base substrate.

5 . The display substrate according to claim 4 , wherein an angle between a side of the trapezoidal shape and a bottom side of the trapezoidal shape adjacent to the base substrate is 100° to 150°.

6 . The display substrate according to claim 1 , wherein an orthogonal projection of the gap on the base substrate extends along a peripheral contour of the to-be-perforated area.

7 . The display substrate according to claim 1 , further comprising:
a thin film transistor structure layer disposed between the base substrate and the self-luminescent layer, wherein a side of the gap adjacent to the base substrate exposes a surface of the thin film transistor structure layer.

8 . A display substrate, comprising:
a base substrate; a self-luminescent layer disposed on a side of the base substrate; and an encapsulation film layer disposed on a side of the self-luminescent layer away from the base substrate, wherein the display substrate has a hole, which at least penetrates through the encapsulation film layer and the self-luminescent layer, and an edge of the encapsulation film layer adjacent to the hole covers a side surface of the self-luminescent layer adjacent to and facing the hole.

9 . A manufacturing method of a display substrate, comprising:
providing a base substrate; forming a partition member on a side of the base substrate, wherein an orthogonal projection of the partition member on the base substrate extends along a peripheral contour of a to-be-perforated area of the display substrate, and a width of a side of the partition member adjacent to the base substrate is smaller than a width of a side of the partition member away from the base substrate; forming a self-luminescent layer on the side of the base substrate on which the partition member is formed, wherein the self-luminescent layer is separated by the partition member into at least two parts with a part being in the to-be-perforated area and another part being in a non-perforated area of the display substrate other than the to-be-perforated area; forming an encapsulation film layer on a side of the self-luminescent layer away from the base substrate; and removing the partition member and film material adhered to a surface of the partition member to form a gap penetrating through the self-luminescent layer and the encapsulation film layer.

10 . The manufacturing method according to claim 9 , wherein forming a partition member on a side of the base substrate comprises:
forming a negative photoresist layer on the base substrate; exposing an area of the negative photoresist layer where the partition member is to be formed; and developing the negative photoresist layer exposed to form the partition member.

11 . The manufacturing method according to claim 10 , wherein a cross section of the partition member is a trapezoidal shape, and the cross section of the partition member is a cross section obtained by cutting the partition member along a width direction of the partition member and a direction perpendicular to the base substrate.

12 . The manufacturing method according to claim 9 , wherein a difference between a width of a side of the partition member away from the base substrate and a width of a side of the partition member adjacent to the base substrate is greater than or equal to 0.5 μm.

13 . The manufacturing method according to claim 9 , wherein the partition member has a height of 1 μm to 10 μm.

14 . The manufacturing method according to claim 9 , wherein forming an encapsulation film layer on a side of the self-luminescent layer away from the base substrate comprises:
forming a first inorganic barrier layer on the side of the self-luminescent layer away from the base substrate, the first inorganic barrier layer covering a side surface of the self-luminescent layer adjacent to and facing the partition member; forming an organic barrier layer on a side of the first inorganic barrier layer away from the base substrate, the organic barrier layer being located in an area of the display substrate other than the area where the partition member is located; and forming a second inorganic barrier layer on a side of the organic barrier layer away from the base substrate, the second inorganic barrier layer covering a side surface of the organic barrier layer adjacent to and facing the partition member.

15 . The manufacturing method according to claim 14 , wherein the self-luminescent layer is formed by an evaporation process, and the first inorganic barrier layer and the second inorganic barrier layer are formed by a chemical vapor deposition process.

16 . The manufacturing method according to claim 9 , wherein before forming a partition member on a side of the base substrate, the method further comprises: forming a thin film transistor structure layer on a side of the base substrate, wherein the partition member is formed on a side of the thin film transistor structure layer away from the base substrate.

17 . A display device comprising the display substrate according to claim 8 .

18 . The display substrate according to claim 1 , further comprising:
a thin film transistor structure layer disposed between the base substrate and the self-luminescent layer, wherein the gap penetrates through the thin film transistor structure layer to expose a surface of the base substrate, and separates the thin film transistor structure layer into at least two parts with a first part corresponding to the to-be-perfor

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Tao
• Sun Tao
• Zhang Song

Classifications

• H01L51/0018

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H01L51/5253 Primary

  Electricity · mapped topic

• H01L2251/566

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic