High frequency based beamforming antenna and communication method therefor

Patent metadata

Field	Value
Publication number	US-2020169291-A1
Application number	US-201916548615-A
Country	US
Kind code	A1
Filing date	Aug 22, 2019
Priority date	Nov 27, 2018
Publication date	May 28, 2020
Grant date	—

Abstract

A method for transmitting signals using a high frequency based integrated circuit beamforming antenna is disclosed. The method may comprise transferring an output signal of a radio frequency (RF) module to an RF transceiving unit; transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and transferring a wave signal from the signal converting unit to a traveling wave antenna unit, and the feeding pillar may convert the output signal of the RF transceiving unit to the wave signal.

First claim

What is claimed is:

1 . A method for transmitting signals using a high frequency based integrated circuit beamforming antenna, the method comprising:
transferring an output signal of a radio frequency (RF) module to an RF transceiving unit; transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and transferring a wave signal from the signal converting unit to a traveling wave antenna unit, wherein the feeding pillar converts the output signal of the RF transceiving unit to the wave signal.

2 . The method according to claim 1 , wherein the RF transceiving unit includes at least one of an input/output signal line and a ground (GND) part.

3 . The method according to claim 1 , wherein the travelling wave antenna unit includes at least one of a semiconductor substrate, an upper waveguide metal, and a lower waveguide metal.

4 . The method according to claim 3 , wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

5 . The method according to claim 1 , wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

6 . The method according to claim 1 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

7 . A method for receiving signals using a high frequency based integrated circuit beamforming antenna, the method comprising:
transferring a signal received using a traveling wave antenna unit to a signal converting unit in form of a wave signal; and transferring the wave signal to a radio frequency (RF) transceiving unit through a feeding pillar included in the signal converting unit, wherein the feeding pillar converts the output signal of the RF transceiver to the wave signal.

8 . The method according to claim 7 , further comprising transferring an RF signal output from the RF transceiving unit to an RF module.

9 . The method according to claim 7 , wherein the RF transceiving unit includes at least one of an input/output signal line and a ground (GND) part.

10 . The method according to claim 7 , wherein the travelling wave antenna unit includes at least one of a semiconductor substrate, an upper waveguide metal, and a lower waveguide metal.

11 . The method according to claim 10 , wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

12 . The method according to claim 7 , wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

13 . The method according to claim 7 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

14 . A high frequency based integrated circuit beamforming antenna comprising:
a radio frequency (RF) transceiving unit including at least one of an input/output signal line and a ground (GND) part; a signal converting unit including a feeding pillar; and a travelling wave antenna unit including a semiconductor substrate, wherein the feeding pillar converts the output signal of the RF transceiver to the wave signal.

15 . The high frequency based integrated circuit beamforming antenna according to claim 14 , wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

16 . The high frequency based integrated circuit beamforming antenna according to claim 14 , wherein waveguide metal layers are deposited on both an upper surface and a lower surface of the semiconductor substrate.

17 . The high frequency based integrated circuit beamforming antenna according to claim 16 , wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

18 . The high frequency based integrated circuit beamforming antenna according to claim 17 , wherein the at least one semiconductor reflector is a diode reflector.

19 . The high frequency based integrated circuit beamforming antenna according to claim 17 , wherein a metal of a power source of the semiconductor reflector is different from a metal of the metal waveguide layers.

20 . The high frequency based integrated circuit beamforming antenna according to claim 14 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Cho Young Kyun
• Lee Jung Nam

Classifications

• H01P3/16

  Dielectric waveguides, i.e. without a longitudinal conductor · CPC title

• H04B7/0617

  for beam forming · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q3/36

  with variable phase-shifters · CPC title

• H01Q21/0037

  linear waveguide fed arrays · CPC title