Pid-free encapsulant for photovoltaic module, photovoltaic module including same, and method of manufacturing same

Patent metadata

Field	Value
Publication number	US-2020168753-A1
Application number	US-202016747532-A
Country	US
Kind code	A1
Filing date	Jan 21, 2020
Priority date	Nov 26, 2018
Publication date	May 28, 2020
Grant date	—

Abstract

The present invention relates to an encapsulant capable of reducing potential-induced degradation (PID). The encapsulant is used to seal a solar cell to form a photovoltaic module, in which silica gel is dispersed in the encapsulant as a sodium ion adsorbent. Since the silica gel that is highly transparent is used as the sodium ion adsorbent, it is possible to prevent PID attributable to sodium ions and to prevent deterioration in photovoltaic efficiency of the photovoltaic module. Since the silica gel has a high specific surface area, it is possible to adsorb sodium ions with a small amount of the silica gel.

First claim

What is claimed is:

1 . An encapsulant for a photovoltaic module for preventing potential-induced degradation (PID), the encapsulant being used to seal a solar cell in the photovoltaic module, wherein silica gel is dispersed in the encapsulant as a sodium ion adsorbent.

2 . The encapsulant according to claim 1 , wherein the surface area of the silica gel dispersed in the encapsulant is in a range of 500 m 2 /g to 800 m 2 /g, and the amount of the silica gel dispersed in the encapsulant is 0.01 to 1 part by weight based on 100 parts by weight of the encapsulant.

3 . The encapsulant according to claim 1 , wherein the encapsulant is made of EVA.

4 . A photovoltaic module for preventing potential-induced degradation (PID) comprising:
one or more solar cells; an encapsulant surrounding the one or more solar cells; a protective glass plate positioned on an upper surface of the encapsulant; a back sheet positioned on a lower surface of the encapsulant; and a frame, wherein silica gel as a sodium ion adsorbent is dispersed in the encapsulant.

5 . The photovoltaic module according to claim 4 , wherein the surface area of the silica gel dispersed in the encapsulant is in a range of 500 m 2 /g to 800 m 2 /g, and the amount of the silica gel dispersed in the encapsulant is 0.01 to 1 part by weight based on 100 parts by weight of the encapsulant.

6 . The photovoltaic module according to claim 4 , wherein the silica gel is dispersed only in the encapsulant positioned on an upper surface of the solar cell.

7 . The photovoltaic module according to claim 4 , wherein the encapsulant is made of EVA.

8 . A method of manufacturing an encapsulant sheet used to seal a solar cell in a photovoltaic module for preventing potential-induced degradation (PID), the method comprising:
preparing a composition of an encapsulant; and molding the composition of the encapsulation to form the encapsulant sheet, wherein in the preparing of the composition of the encapsulant, silica gel is added as a sodium ion adsorbent to the composition of the encapsulant.

9 . The method according to claim 8 , wherein the surface area of the silica gel is in a range of 500 m 2 /g to 800 m 2 /g, and the amount of the silica gel is 0.01 to 1 part by weight based on 100 parts by weight of the encapsulant.

10 . The method according to claim 8 , wherein the encapsulant is made of EVA.

11 . The method according to claim 8 , wherein the composition of the encapsulant includes water-based silica sol serving as a dispersant.

12 . The method according to claim 8 , wherein the composition of the encapsulant includes organic matter-based silica sol serving as a dispersant.

Assignees

• Korea Inst Energy Res

Inventors

• Eo Young-Joo
• Gwak Jihye
• Ahn Se-Jin
• Cho Ara
• Yoo Jin-Su
• Cho Jun-Sik
• Ahn Seung-Kyu
• Park Joo-Hyung
• Kim Kihwan
• Shin Donghyeop
• Song Soo Min
• Jeong Inyoung
• Lee Sang Min

Classifications

• C08K2201/006

  Additives being defined by their surface area · CPC title

• C09K2200/0622

  Polyvinylalcohols, polyvinylacetates · CPC title

• C08F210/02

  Ethene · CPC title

• C09K3/10 Primary

  {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34) · CPC title

• C08F216/06

  Polyvinyl alcohol {; Vinyl alcohol} · CPC title