Polyoxazoline based thermal latent curing agents for thermoset resins
US-2024270940-A1 · Aug 15, 2024 · US
US2020165378A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020165378-A1 |
| Application number | US-201816611351-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 5, 2018 |
| Priority date | May 10, 2017 |
| Publication date | May 28, 2020 |
| Grant date | — |
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Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20≤ b/a ≤0.60; and (i) 0.002≤ c/a ≤0.014; (ii) wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).
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1 . An epoxy resin composition comprising constituents [A], [B], and [C] below, and satisfying conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20≤ b/a≤ 0.60; and (i) 0.002≤ c/a≤ 0.014; (ii) wherein a (mol) denotes a number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes a number of active hydrogens contained in the constituent [B], and c (mol) denotes a number of imidazole rings contained in the constituent [C]). 2 . The epoxy resin composition according to claim 1 , wherein the constituent [A] is contained in an amount of 60 to 100 parts by mass in 100 parts by mass of all epoxy resins. 3 . The epoxy resin composition according to claim 1 , wherein [A1] a tetrakis(hydroxyphenyl)ethane epoxy resin is contained as the constituent [A]. 4 . The epoxy resin composition according to claim 3 , wherein the constituent [A1] is contained in an amount of 10 to 50 parts by mass in 100 parts by mass of all epoxy resins. 5 . The epoxy resin composition according to claim 1 , wherein [C1] a reaction product of an imidazole compound and a bisphenol epoxy resin is contained as the constituent [C]. 6 . The epoxy resin composition according to claim 1 , wherein a glass transition temperature of a cured resin produced by subjecting the epoxy resin composition to primary curing at 180° C. for 30 minutes and then to secondary curing at 240° C. for 30 minutes is 220° C. or more. 7 . A prepreg comprising the epoxy resin composition according to claim 1 and a reinforced fiber. 8 . A fiber-reinforced composite material comprising the prepreg according to claim 7 in cured form. 9 . A method for producing a fiber-reinforced composite material, comprising subjecting the prepreg according to claim 7 to primary curing at 130° C. to 200° C. and then to secondary curing at 210° C. to 270° C. for 10 minutes or more.
having two nitrogen atoms in the ring · CPC title
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
Carbocyclic compounds · CPC title
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
aromatic · CPC title
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