Multi-layer ceramic electronic device

Patent metadata

Field	Value
Publication number	US-2020161051-A1
Application number	US-201916668044-A
Country	US
Kind code	A1
Filing date	Oct 30, 2019
Priority date	Oct 30, 2018
Publication date	May 21, 2020
Grant date	—

Abstract

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

First claim

What is claimed is:

1 . A multi-layer ceramic electronic device comprising:
an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; and terminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, wherein the terminal electrodes include:
a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and
a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,
wherein external surfaces of the end electrode parts are covered with end cover layers, and wherein the terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the third axis.

2 . A multi-layer ceramic electronic device comprising:
an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; and terminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, wherein the terminal electrodes include:
a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and
a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,
wherein external surfaces of the end electrode parts are covered with end cover layers, and wherein a lower surface of the element body located opposite to the upper surface of the element body in the third axis is entirely exposed outside.

3 . A multi-layer ceramic electronic device comprising:
an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; and terminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, wherein the terminal electrodes include:
a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and
a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,
wherein conductive metal films are formed in interfaces between the element body and the terminal electrodes, and wherein the terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the third axis.

4 . A multi-layer ceramic electronic device comprising:
an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; and terminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, wherein the terminal electrodes include:
a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and
a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,
wherein conductive metal films are formed in interfaces between the element body and the terminal electrodes, and wherein a lower surface of the element body located opposite to the upper surface of the element body in the third axis is entirely exposed outside.

5 . The multi-layer ceramic electronic device according to claim 3 , wherein the conductive metal films contain at least any one of Pt, Rh, Ru, Re, Ir, and Pd.

6 . The multi-layer ceramic electronic device according to claim 4 , wherein the conductive metal films contain at least any one of Pt, Rh, Ru, Re, Ir, and Pd.

7 . The multi-layer ceramic electronic device according to claim 3 , wherein a coverage area ratio of uneven surfaces formed on a surface of the element body and covered by the conductive metal films is 20 to 70%.

8 . The multi-layer ceramic electronic device according to claim 4 , wherein a coverage area ratio of uneven surfaces formed on a surface of the element body and covered by the conductive metal films is 20 to 70%.

9 . The multi-layer ceramic electronic device according to claim 1 , wherein an upper-surface cover layer covering the upper surface of the element body located between the pair of upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts.

10 . The multi-layer ceramic electronic device according to claim 2 , wherein an upper-surface cover layer covering the upper surface of the element body located between the pair of upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts.

11 . The multi-layer ceramic electronic device according to claim 3 , wherein an upper-surface cover layer covering the upper surface of the element body located between the pair of upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts.

12 . The multi-layer ceramic electronic device according to claim 4 , wherein an upper-surface cover layer covering the upper surface of the element body located between the pair of upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts.

13 . The multi-layer ceramic electronic device according to claim 1 , wherein
the element body includes a reinforcement layer, the reinforcement layer covers at least one of a pair of lateral surfaces facing each other in the first axis, the upper surface, and the lower surface of the element body, the reinforcement layer contains a filler and a substrate, the filler is made of glass or alumina, and the filler has a needle-like shape, a column-like shape, or a plate-like shape.

14 . The multi-layer ceramic electronic device according to claim 2 , wherein
the element body includes a reinforcement layer, the reinforcement layer covers at least one of a pair of lateral surfaces facing each other in the first axis, the upper surface, and the lower surface of the element body, the reinforcement layer contains a filler and a substrate, the filler is made of glass or alumina, and the filler has a needle-like shape, a column-like shape, or a plate-like shape.

Assignees

• Tdk Corp

Inventors

• Tanaka Hirobumi
• Sakurai Toshio
• Okai Keisuke
• Iwanaga Daisuke
• Nakata Hisashi
• Shibasaki Tomoya

Classifications

• H01G4/005

  Electrodes · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title