Bake system and method of fabricating display device using the same

Patent metadata

Field	Value
Publication number	US-2020152879-A1
Application number	US-201916656462-A
Country	US
Kind code	A1
Filing date	Oct 17, 2019
Priority date	Nov 9, 2018
Publication date	May 14, 2020
Grant date	—

Abstract

A bake system may include a chamber having an internal space, a stage disposed in the internal space of the chamber and on which a target substrate is disposed, a gas ejection structure providing a process gas in the chamber, an exhaust structure, an atmosphere analyzer monitoring moisture and oxygen in the chamber, and a gas supplier controlling a flow rate of the process gas based on information provided from the atmosphere analyzer. The exhaust structure may include a suction part disposed in the internal space, and an exhaust part connected to the suction part and is disposed outside the chamber.

First claim

What is claimed is:

1 . A bake system, comprising:
a chamber having an internal space; a stage disposed in the internal space of the chamber and on which a target substrate is disposed; a gas ejection structure providing a process gas in the chamber; an exhaust structure including a suction part disposed in the internal space, and an exhaust part connected to the suction part and is disposed outside the chamber; an atmosphere analyzer monitoring moisture and oxygen in the chamber; and a gas supplier controlling a flow rate of the process gas, based on information provided from the atmosphere analyzer.

2 . The bake system of claim 1 , further comprising a guide part disposed between the suction part and the gas ejection structure,
wherein the guide part includes one or more openings, and wherein the process gas is exhausted to the exhaust structure through the one or more openings of the guide part.

3 . The bake system of claim 2 , further comprising a cooling part disposed in the guide part and configured to decrease the temperature of the internal space of the chamber.

4 . The bake system of claim 1 , wherein the gas ejection structure comprises a first ejection structure and a second ejection structure that is spaced apart from the first ejection structure and configured to produce an airflow in a direction different from that produced by the first ejection structure.

5 . The bake system of claim 4 , wherein the first ejection structure comprises a first transfer pipe connected to the gas supplier, a first distribution pipe connected to the first transfer pipe, and a first ejection pipe connected to the first distribution pipe, and
wherein the first ejection pipe comprises a first ejection hole configured to eject the process gas.

6 . The bake system of claim 4 , wherein the first ejection pipe comprises a first ejection hole and a second ejection hole configured to eject the process gas in different directions.

7 . The bake system of claim 4 , wherein the second ejection structure comprises a second transfer pipe connected to the gas supplier, a second distribution pipe connected to the second transfer pipe, and a second ejection pipe connected to the second distribution pipe, and
wherein the second ejection pipe comprises a second ejection hole configured to eject the process gas.

8 . The bake system of claim 7 , wherein the gas ejection structure further comprises a dummy part disposed between the first ejection structure and the second ejection structure and extended along the second ejection pipe, and
wherein the process gas ejected through the second ejection pipe is deflected by the dummy part and is exhausted to the exhaust structure.

9 . The bake system of claim 1 , wherein the stage further comprises a heating part providing heat to the target substrate.

10 . The bake system of claim 1 , wherein the stage comprises a loading part configured to load the target substrate into the chamber, and a supporting part connected to the loading part, and
wherein a height of the loading part is controlled by the supporting part.

11 . The bake system of claim 1 , wherein the exhaust structure further comprises an exhaust control part connected to the exhaust part and configured to control an exhaust amount of the process gas.

12 . The bake system of claim 1 , wherein the target substrate comprises a base substrate, a transistor disposed on the base substrate, a first electrode connected to the transistor, a pixel definition layer including an opening exposing at least a portion of the first electrode, and a preliminary organic layer filling the opening.

13 . The bake system of claim 1 , wherein the chamber further comprises at least one cooling part disposed on an inner wall of the chamber and configured to remove an organic solution in the chamber.

14 . A bake system, comprising:
a first apparatus including a first chamber having a first internal space, a first stage disposed in the first internal space of the first chamber and configured to provide heat and to load a target substrate thereon, and a cooling part spaced apart from the first stage; a second apparatus including a second chamber defining a second internal space, a second stage disposed in the second internal space of the second chamber, a gas ejection structure providing a process gas into the second chamber, an atmosphere analyzer monitoring moisture and oxygen in the second chamber, and a gas supplier controlling a flow rate of the process gas, based on information provided from the atmosphere analyzer; and a connecting portion connected to each of the first apparatus and the second apparatus and configured to provide a passageway for loading or unloading the target substrate.

15 . The bake system of claim 14 , wherein the first apparatus comprises a pump connected to the first chamber and disposed outside the first chamber, and
wherein the pump is used to exhaust moisture and oxygen escaped from the target substrate.

16 . The bake system of claim 14 , wherein the second apparatus comprises an exhaust structure including a suction part that is disposed in the second chamber, and an exhaust part disposed outside the second chamber and connected to the suction part.

17 . The bake system of claim 16 , further comprising a guide part disposed between the suction part and the gas ejection structure,
wherein the guide part includes one or more openings, and wherein the process gas is exhausted to the exhaust structure through the one or more openings.

18 . The bake system of claim 14 , wherein the gas ejection structure comprises a first ejection structure and a second ejection structure that is spaced apart from the first ejection structure and configured to produce an airflow in a direction different from that produced by the first ejection structure.

19 . A method of fabricating a display device, comprising:
providing a target substrate including an organic solution on a stage of a chamber; providing a process gas into an internal space of the chamber; monitoring oxygen and moisture in the internal space of the chamber; and removing an organic solvent included in the organic solution by ejecting the process gas onto the target substrate thereby forming an organic layer on the target substrate, wherein a flow rate of the process gas is controlled based on amounts of the oxygen and the moisture monitored in the internal space of the chamber.

20 . The method of claim 19 , further comprising removing the moisture and the oxygen included in the target substrate.

21 . The method of claim 19 , further comprising removing the moisture and the oxygen from the internal space of the chamber, after the forming of the organic layer.

22 . The method of claim 19 , wherein the process gas includes a material capable of removing the moisture and the oxygen escaped from the chamber and the target substrate.

23 . The method of claim 19 , wherein a concentration of the moisture in the chamber is lower than 0.03 ppm.

24 . The method of claim 19 , wherein the chamber further comprises a cooling part disposed in the internal space of the chamber.

25 . The method of claim 24 , further comprising removing the organic solution evaporating from the target substrate, using the cooling part.

Assignees

• Samsung Display Co Ltd

Inventors

• Kishimoto Katsushi

Classifications

• H01L51/56

  Electricity · mapped topic

• H01L51/0026 Primary

  Electricity · mapped topic

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title