Plating systems having reduced air entrainment

Patent metadata

Field	Value
Publication number	US-2020152467-A1
Application number	US-202016739569-A
Country	US
Kind code	A1
Filing date	Jan 10, 2020
Priority date	Jul 10, 2017
Publication date	May 14, 2020
Grant date	—

Abstract

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

First claim

What is claimed is:

1 . An electroplating processing system comprising:
a recirculating tank containing a first volume of processing fluid, wherein the recirculating tank is fluidly coupled with a delivery pump; a vessel configured to receive the processing fluid from the pump, wherein the vessel comprises an inner chamber and an outer chamber, wherein the inner chamber is sized to hold a second volume of processing fluid less than the first volume of processing fluid, and wherein a liquid level sensor is associated with the vessel to provide a liquid level indication in the outer chamber; a return line positioned between an outlet of the vessel and an inlet of the recirculating tank; and a return pump fluidly coupled with the return line, wherein the return pump is electrically coupled with the liquid level sensor.

2 . The electroplating processing system of claim 1 , wherein the return line comprises a restriction sized to maintain a gravity-assisted fluid flow rate less than a steady-state delivery rate of the delivery pump.

3 . The electroplating processing system of claim 1 , wherein the return pump is configured to disengage when the liquid level sensor indicates a fluid level in the outer chamber of the vessel at or below a predetermined minimum.

4 . The electroplating processing system of claim 1 , wherein the return pump comprises an integral-level control algorithm to determine pump speed based on readings from the liquid level sensor.

5 . The electroplating processing system of claim 1 , wherein the return pump is chemically compatible with at least one of methanesulfonic acid, potassium hydroxide, and boric acid.

6 . The electroplating processing system of claim 1 , wherein the return pump is rated at less than or about 100 Watts.

7 . The electroplating processing system of claim 1 , wherein the vessel when containing the second volume of fluid is positioned within the system at a fluid height differential from the recirculating tank of less than 24 inches.

8 . An electroplating processing system comprising:
a recirculating tank; a vessel configured to receive a processing fluid from the recirculating tank, wherein the vessel comprises an inner chamber and an outer chamber; a return line positioned between an outlet of the vessel and an inlet of the recirculating tank; and a container fluidly coupled with the return line, wherein the container is configured to receive processing fluid exiting the vessel, and wherein the container comprises a media configured to extract entrained bubbles within the processing fluid.

9 . The electroplating processing system of claim 8 , wherein the media is configured to extract bubbles characterized by a diameter of 1 μm or greater.

10 . The electroplating processing system of claim 8 , wherein the media is chemically compatible with at least one of methanesulfonic acid, potassium hydroxide, and boric acid.

11 . The electroplating processing system of claim 8 , wherein the media comprises a polymeric material.

12 . The electroplating processing system of claim 11 , wherein the polymeric material comprises a mesh disposed within the container.

13 . An electroplating processing system comprising:
a recirculating tank; a processing vessel configured to receive a processing fluid from the recirculating tank, wherein the vessel comprises an inner chamber and an outer chamber; a return line positioned between an outlet of the vessel and an inlet of the recirculating tank; and a buffer vessel fluidly coupled between the processing vessel and the recirculating tank, wherein the buffer vessel comprises a first exit port from the buffer vessel, wherein the buffer vessel comprises a standpipe coupled with a base of the buffer vessel, wherein the standpipe is characterized by a sloped surface of an interior edge at a top of the standpipe, wherein the standpipe is characterized by a port proximate the base of the buffer vessel, and wherein the standpipe provides access to a second exit port from the buffer vessel.

14 . The electroplating processing system of claim 13 , wherein the buffer vessel comprises a channel positioned within the buffer vessel and configured to deliver processing fluid down into the buffer vessel.

15 . The electroplating processing system of claim 13 , wherein a media configured to extract entrained bubbles within the processing fluid is positioned within the standpipe or within the return line.

Assignees

• Applied Materials Inc

Inventors

• Law Cameron
• Durado Daniel
• Oberlitner Thomas
• Plavidal Richard W

Classifications

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• H01L21/288 Primary

  Electricity · mapped topic

• C25D7/12 Primary

  Semiconductors · CPC title

• H01L21/6723

  Electricity · mapped topic