Data analyzer, semiconductor manufacturing system, data analysis method, and semiconductor manufacturing method

Patent metadata

Field	Value
Publication number	US-2020133249-A1
Application number	US-201916729990-A
Country	US
Kind code	A1
Filing date	Dec 30, 2019
Priority date	Aug 29, 2017
Publication date	Apr 30, 2020
Grant date	—

Abstract

A data analyzer includes a data collector that acquires data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus that exposes a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus that inspects the exposed wafer, an image generator that visualizes the data on each of the parameters collected by the data collector from the apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generates a plurality of mapped images for each of the parameters of the apparatuses, and a correlation computing section that performs pattern matching on arbitrary ones of the mapped images generated from the wafer to determine a correlation value between arbitrary ones of the parameters of the apparatuses.

First claim

What is claimed is:

1 . A data analyzer comprising:
a data collector configured to acquire data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus; an image generator configured to visualize the data on each of the plurality of parameters collected by the data collector from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generate a plurality of mapped images for each of the parameters of the plurality of apparatuses; and a correlation computing section configured to perform pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses.

2 . The data analyzer according to claim 1 ,
wherein the correlation computing section outputs at least information on a set of parameters from which a largest correlation value has been derived.

3 . The data analyzer according to claim 2 ,
wherein the correlation computing section outputs information on a plurality of sets of parameters in a descending order of the correlation value.

4 . The data analyzer according to claim 2 ,
further comprising a display configured to display information on the parameters outputted from the correlation computing section.

5 . The data analyzer according to claim 4 ,
wherein the display displays the correlation value between the parameters and the mapped images.

6 . The data analyzer according to claim 1 ,
further comprising a filtering section configured to perform digital image filtering on the mapped images generated by the image generator.

7 . The data analyzer according to claim 1 ,
wherein the exposure apparatus performs scanning exposure, and the predetermined area is an area where the exposure apparatus performs a single action of the scanning exposure.

8 . The data analyzer according to claim 1 ,
further comprising a controller configured to change a parameter relating to control of at least one apparatus out of the plurality of apparatuses based on the correlation value between the parameters.

9 . The data analyzer according to claim 8 ,
wherein the controller changes a parameter relating to control of the at least one apparatus based on a result of inspection of the wafer performed by the wafer inspection apparatus.

10 . The data analyzer according to claim 1 ,
wherein the correlation computing section determines a correlation value between parameters of different apparatuses out of the plurality of apparatuses.

11 . The data analyzer according to claim 1 ,
wherein the correlation computing section determines a correlation value between parameters in a single apparatus out of the plurality of apparatuses.

12 . The data analyzer according to claim 1 ,
wherein the image generator is configured to generate a mapped image in which differences in data are expressed in grayscales.

13 . The data analyzer according to claim 12 ,
wherein the image generator sets a target value of each of the parameters to be a median of the grayscales.

14 . The data analyzer according to claim 1 ,
wherein the light source apparatus is a laser apparatus.

15 . The data analyzer according to claim 14 ,
wherein the data that the data collector acquires from the laser apparatus includes data on a beam characteristic of the pulsed light, data on pulse energy of the pulsed light, and data on a spectrum of the pulsed light.

16 . The data analyzer according to claim 1 ,
wherein the data that the data collector acquires from the exposure apparatus includes data on an exposure condition.

17 . The data analyzer according to claim 1 ,
wherein the data that the data collector acquires from the wafer inspection apparatus includes data on a shape of the wafer, and data on a defect of the wafer.

18 . A semiconductor manufacturing system comprising:
a plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus; a data collector configured to acquire data on each analysis target parameter of each of the plurality of apparatuses from the apparatus; an image generator configured to visualize the data on each of the plurality of parameters collected by the data collector from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generate a plurality of mapped images for each of the parameters of the plurality of apparatuses; a correlation computing section configured to perform pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses; and a controller configured to change a parameter relating to control of at least one apparatus out of the plurality of apparatuses based on the correlation value between the parameters.

19 . A data analysis method comprising:
acquiring data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus; visualizing the data on each of the plurality of parameters acquired from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generating a plurality of mapped images for each of the parameters of the plurality of apparatuses; and performing pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses.

20 . A semiconductor manufacturing method comprising:
acquiring data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus configured to expose a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus configured to inspect the wafer exposed by the exposure apparatus; visualizing the data on each of the plurality of parameters acquired from the plurality of apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generating a plurality of mapped images for each of the parameters of the plurality of apparatuses; performing pattern matching on arbitrary mapped images out of the plurality of mapped images generated from the wafer to determine a correlation value between arbitrary parameters out of the plurality of parameters of the plurality of apparatuses; and changing a para

Assignees

• Gigaphoton Inc

Inventors

• Igarashi Yutaka
• Minegishi Yuji
• Wakabayashi Osamu

Classifications

• G03F7/70508 Primary

  Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus · CPC title

• G05B2219/31308

  Capture image asynchronously with processing of analysis, identification · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G05B2219/45031

  Manufacturing semiconductor wafers · CPC title

• G05B19/41875 Primary

  characterised by quality surveillance of production · CPC title