Liquid crystal display device
US-2016282666-A1 · Sep 29, 2016 · US
US2020124902A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020124902-A1 |
| Application number | US-201816164469-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 18, 2018 |
| Priority date | Oct 18, 2018 |
| Publication date | Apr 23, 2020 |
| Grant date | — |
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An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example display, the light absorbing material is black and/or has a light absorbing efficiency of at least fifty percent.
Opening claim text (preview).
We claim: 1 . A liquid crystal display device comprising: a circuit substrate; an array of conductive mirrors formed on said substrate; a light absorbing material disposed between said conductive mirrors; a transparent plate disposed over said array of conductive mirrors; and liquid crystal material disposed between said conductive mirrors and said transparent plate. 2 . The liquid crystal display device of claim 1 , wherein said light absorbing material is disposed around the peripheral region of said array of said conductive mirrors. 3 . The liquid crystal display device of claim 1 , wherein said light absorbing material is black. 4 . The liquid crystal display device of claim 1 , wherein said light absorbing material has a light absorbing efficiency of at least fifty percent. 5 . The liquid crystal display device of claim 1 , wherein said light absorbing material is formed on said circuit substrate by a lithographic process. 6 . The liquid crystal display device of claim 1 , wherein: said light absorbing material is formed directly on a surface said circuit substrate; said conductive mirrors are formed directly on said surface of said circuit substrate; and said light absorbing material and said array of said conductive mirrors are coplanar. 7 . The liquid crystal display device of claim 1 , further comprising a plurality of wire bond pads formed on said circuit substrate, said plurality of wire bond pads and said array of said conductive mirrors being coplanar and formed from the same material. 8 . The liquid crystal display device of claim 1 , wherein said liquid crystal display device is a Liquid Crystal on Silicon (LCOS) device. 9 . The liquid crystal display device of claim 1 , further comprising a first liquid crystal alignment layer formed over said conductive mirrors and over said light absorbing material. 10 . The liquid crystal display device of claim 1 , further comprising: a plurality of electrical bond pads; and wherein said light absorbing material covers the entire top surface of said circuit substrate, except for top surfaces of said pixel mirrors and said electrical bond pads. 11 . A method for manufacturing a liquid crystal display device, said method comprising: providing a reflective display backplane including an array of pixel mirrors formed thereon, said pixel mirrors of said array being spaced apart from one another and defining gaps between adjacent ones of said pixel mirrors; providing a light absorbing material; depositing said light absorbing material between said conductive mirrors; and incorporating said reflective display backplane with said light absorbing material deposited thereon into a liquid crystal display device. 12 . The method of claim 11 , further comprising depositing said light absorbing material around a perimeter of said array of said conductive pixel mirrors. 13 . The method of claim 11 , wherein said light absorbing material is black. 14 . The method of claim 11 , wherein said light absorbing material has a light absorbing efficiency of at least fifty percent. 15 . The method of claim 11 , wherein said step of depositing said light absorbing material between said conductive mirrors includes forming a layer of said light absorbing material on said circuit substrate using a lithographic process. 16 . The method of claim 15 , wherein said step of forming said layer of said light absorbing material includes forming said layer of said light absorbing material to be coplanar with top surfaces of said pixel mirrors. 17 . The method of claim 11 , wherein said step of depositing said light absorbing material between said pixel mirrors includes forming said light absorbing material directly on a surface of said reflective display backplane. 18 . The method of claim 11 , wherein said liquid crystal display device is a Liquid Crystal on Silicon (LCOS) device. 19 . The method of claim 11 , further comprising forming a first liquid crystal alignment layer over said pixel mirrors and said light absorbing material. 20 . The method of claim 11 , wherein: said reflective display backplane further includes a plurality of electrical bond pads; and said step of depositing said light absorbing material includes covering the entire top surface of said reflective display backplane with said light absorbing material, except for top surfaces of said pixel mirrors and said electrical bond pads.
formed on a semiconductor substrate, e.g. of silicon · CPC title
Support structures for LCD panels, e.g. frames or bezels · CPC title
Reflecting elements (associated to illuminating devices G02F1/133605) · CPC title
Physics · mapped topic
Physics · mapped topic
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