Display apparatus
US-2019346939-A1 · Nov 14, 2019 · US
US2020116860A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020116860-A1 |
| Application number | US-201916363829-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 25, 2019 |
| Priority date | Oct 15, 2018 |
| Publication date | Apr 16, 2020 |
| Grant date | — |
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A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.
Opening claim text (preview).
What is claimed is: 1 . A proximity sensing device disposed under an OLED panel, comprising: an emitting module, being configured to emit an invisible light which has a peak wavelength not less than 1000 nm; and a receiving module, being disposed adjacent to the emitting module and configured to receive a reflected light of the invisible light. 2 . The proximity sensing device of claim 1 , wherein the peak wavelength of the invisible light emitted by the emitting module is not greater than 1580 nm. 3 . The proximity sensing device of claim 1 , wherein the emitting module comprises one or a plurality of emitting elements, and the receiving module comprises one or a plurality of sensing elements. 4 . The proximity sensing device of claim 3 , wherein the emitting element comprises a semiconductor chip, and the semiconductor chip is configured to emit the invisible light. 5 . The proximity sensing device of claim 3 , wherein the emitting element comprises: a semiconductor chip, being configured to emit a visible light; and a light converting structure, being disposed on the semiconductor chip and comprising an adhesive and a fluorescent material, wherein the fluorescent material is disposed in the adhesive to convert the visible light into the invisible light. 6 . The proximity sensing device of claim 5 , wherein the emitting element further comprises a light absorbing layer, and the light absorbing layer is disposed on the light converting structure to absorb the visible light. 7 . The proximity sensing device of claim 5 , wherein the light converting structure further comprises a light absorbing material, and the light absorbing material is disposed in the adhesive to absorb a part of the visible light. 8 . The proximity sensing device of claim 5 , wherein the emitting element further comprises a light filtering layer, and the light filtering layer is disposed on the light converting structure to block the visible light. 9 . The proximity sensing device of claim 5 , wherein the semiconductor chip is a blue light chip, blue light emitting diode, and blue laser diode. 10 . A display device, comprising: an OLED panel; and a proximity sensing device of claim 1 , being disposed under the OLED panel to be shielded by the OLED panel.
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