Method for producing laminated body, laminated body and method for producing flexible printed circuit board

Patent metadata

Field	Value
Publication number	US-2020113048-A1
Application number	US-201916710064-A
Country	US
Kind code	A1
Filing date	Dec 11, 2019
Priority date	Jul 7, 2017
Publication date	Apr 9, 2020
Grant date	—

Abstract

To provide a laminated body in which wrinkles and delamination are suppressed, a method for its production, and a method for producing a flexible printed circuit board in which occurrence of wrinkles and delamination is suppressed. A method for producing a laminated body comprises disposing, on one side or both sides of a first substrate composed of either one or both of a heat-resistant substrate layer and a metal foil layer, a second substrate containing a fluororesin and having a first surface of which the wetting tension is from 30 to 60 mN/m and a second surface of which the wetting tension is smaller by at least 2 mN/m than the wetting tension of the first surface, so that the first surface faces the first substrate side; and while transporting the first substrate and the second substrate, pressing them in the thickness direction at a temperature T1 of from 0 to 100° C. for lamination, to obtain a laminated body I in which the first substrate and the second substrate are directly laminated.

First claim

What is claimed is:

1 . A method for producing a laminated body, which comprises disposing, on one side or both sides of a first substrate composed of either one or both of a heat-resistant substrate layer and a metal foil layer, a second substrate containing a fluororesin and having a first surface of which the wetting tension as measured in accordance with JIS K6768:1999 is from 30 to 60 mN/m and a second surface of which said wetting tension is smaller by at least 2 mN/m than the wetting tension of the first surface, so that said first surface faces said first substrate side, and, while transporting the first substrate and the second substrate, pressing them in the thickness direction at a temperature T 1 of from 0 to 100° C. for lamination, to obtain a laminated body I wherein the first substrate and the second substrate are directly laminated.

2 . The method for producing a laminated body according to claim 1 , which comprises disposing, on the second substrate of the laminated body I, a third substrate composed of either one or both of a heat-resistant substrate layer and a metal foil layer, and, while transporting the laminated body I and the third substrate, pressing them in the thickness direction at a temperature T 2 of at least the melting point of the fluororesin for lamination, to obtain a laminated body II wherein the laminated body I and the third substrate are directly laminated.

3 . The method for producing a laminated body according to claim 1 , wherein the control of the wetting tension of the second substrate of the laminated body I is carried out by surface treatment, and the method for the surface treatment is by corona discharge treatment or vacuum plasma treatment.

4 . The method for producing a laminated body according to claim 1 , wherein at the time of transporting the first substrate and the second substrate, the elongation obtainable by the following formula 1, of each of the first substrate and the second substrate, is made to be from 0.05 to 1.0%, and the difference in the elongation between the first substrate and the second substrate is made to be at most 0.3%:
elongation (%)={tension ( N ) applied to the substrate during transportation/cross-sectional area (mm 2 ) of the substrate in a direction perpendicular to the transporting direction}/elastic modulus ( N /mm 2 ) of the substrate at a temperature T 1 ×100   Formula 1:

5 . The method for producing a laminated body according to claim 1 , wherein the pressing force at the time of laminating the first substrate and the second substrate is from 3 to 100 kN/m.

6 . The method for producing a laminated body according to claim 1 , wherein at either one or both of a terminal group of the main chain and a pendant group of the main chain of the fluororesin, at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group and an isocyanate group is present.

7 . The method for producing a laminated body according to claim 1 , wherein the first substrate is a heat-resistant resin film, and the water contact angle of its surface as measured by the sessile drop method described in JIS R6769:1999, is from 5° to 60°.

8 . The method for producing a laminated body according to claim 7 , wherein the heat-resistant resin film is a film which is surface-treated by corona discharge treatment, atmospheric pressure plasma treatment or vacuum plasma treatment.

9 . The method for producing a laminated body according to claim 7 , wherein the water absorption of the heat-resistant resin film is at most 1.5%.

10 . A laminated body in which, on one side or both sides of a first substrate composed of either one or both of a heat-resistant substrate layer and a metal foil layer, a second substrate containing a fluororesin and having a first surface of which the wetting tension as measured in accordance with JIS K6768:1999 is from 30 to 60 mN/m and a second surface of which said wetting tension is smaller by at least 2 mN/m than the wetting tension of the first surface, is laminated directly, so that the first surface faces the first substrate side.

11 . A method for producing a flexible printed circuit board, which comprises obtaining the laminated body II of which at least one of the outermost layers is a metal foil layer, by the method for producing a laminated body as defined in claim 2 , and removing a portion of the metal foil layer of the outermost layers by etching to form a patterned circuit.

Assignees

• Agc Inc

Inventors

• Kasai Wataru
• Kotera Seigo

Classifications

• B32B37/144

  using layers with different mechanical or chemical conditions or properties, e.g. layers with different thermal shrinkage, layers under tension during bonding (constructional features for tensioning B32B38/1825) · CPC title

• B32B2311/00

  Metals, their alloys or their compounds · CPC title

• B32B37/203 Primary

  One or more of the layers being plastic · CPC title

• B32B38/0008

  Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation (heat treatment B32B38/0036) · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title