Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Patent metadata

Field	Value
Publication number	US-2020107437-A1
Application number	US-201816499448-A
Country	US
Kind code	A1
Filing date	Mar 28, 2018
Priority date	Mar 29, 2017
Publication date	Apr 2, 2020
Grant date	—

Abstract

The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.

First claim

1 . A prepreg for a coreless substrate, comprising a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups.

2 . The prepreg for a coreless substrate according to claim 1 , wherein the content of (meth)acrylic elastomer (a) is 1 to 60 parts by mass with respect to 100 parts by mass of a solid content of the resin component in the thermosetting resin composition.

3 . The prepreg for a coreless substrate according to claim 1 , wherein the (meth)acrylic elastomer (a) has one or more reactive functional groups selected from the group consisting of an epoxy group, a hydroxy group, a carboxy group, an amino group, and an amide group.

4 . The prepreg for a coreless substrate according to claim 1 , wherein the thermosetting resin composition further contains (d) a thermosetting resin.

5 . The prepreg for a coreless substrate according to claim 1 , wherein the thermosetting resin composition further contains (e) a curing accelerator.

6 . The prepreg for a coreless substrate according to claim 1 , wherein the thermosetting resin composition further contains (f) an inorganic filler.

7 . A coreless substrate comprising an insulating layer formed using the prepreg for a coreless substrate according to claim 1 .

8 . A semiconductor package comprising a semiconductor element mounted on the coreless substrate according to claim 7 .

9 . A method of manufacturing a coreless substrate in which a build-up layer is formed on a support and then the build-up layer is separated from the support,
wherein the build-up layer is formed by alternately stacking insulating layers and conductive layers, and at least one layer of the insulating layers is formed using the prepreg for a coreless substrate according to claim 1 .

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Sakamoto Norihiko
• Yokota Hiroshi
• Hashimoto Shintaro
• Nawate Katsuhiko
• Tsuchikawa Shinji
• Takanezawa Shin

Classifications

• C08J2483/08

  containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen · CPC title

• C08J2333/14

  of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen · CPC title

• C08J2463/04

  Epoxynovolacs · CPC title

• C08J2463/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08J2433/14

  of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen · CPC title