Coil component and electronic device

Patent metadata

Field	Value
Publication number	US-2020105451-A1
Application number	US-201916572288-A
Country	US
Kind code	A1
Filing date	Sep 16, 2019
Priority date	Sep 28, 2018
Publication date	Apr 2, 2020
Grant date	—

Abstract

A coil component includes: a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and a filler, for bonding the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film; and electrodes connected electrically to the coil; wherein the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive is higher than the average grain size of the filler.

First claim

We/I claim:

1 . A coil component, comprising:
a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and filler particles, which bonds the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film, provided in either the first or second substrate body; and electrodes connected electrically to the coil; wherein a representative surface roughness, as maximum height roughness Rz, of a face of the first substrate body bonded to the second substrate body via the adhesive is higher than an average or representative particle size of the filler particles.

2 . The coil component according to claim 1 , wherein a surface roughness of a face of the second substrate body bonded to the first substrate body via the adhesive is lower than the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive.

3 . The coil component according to claim 1 , wherein the first substrate body and the second substrate body are making direct contact without intervening adhesive at parts of their faces having the adhesive in between.

4 . The coil component according to claim 1 , wherein:
the first substrate body is a drum core having a shaft part around which the conductive wire is wound, and flange parts provided at both ends of the shaft part; the second substrate body is a plate-shaped planar core bonded to the two flange parts provided at both ends of the shaft part; and the adhesive bonds the flange parts and the planar core.

5 . The coil component according to claim 4 , wherein a length of the planar core in a direction of a coil axis of the coil is longer than a length of the drum core in the direction of the coil axis.

6 . The coil component according to claim 5 , wherein:
a rounded shape is formed at each ridge part of the flange part on a face bonded to the planar core via the adhesive; and a difference between the length of the planar core and the length of the drum core in the direction of the coil axis is greater than a radius of curvature R of the rounded shape of the flange part.

7 . The coil component according to claim 4 , wherein a fill ratio of the magnetic material for the planar core and the shaft part is higher than a fill ratio of the magnetic material for the flange part.

8 . The coil component according to claim 4 , wherein the length of the planar core in the direction of the coil axis of the coil is 3.2 mm or less.

9 . An electronic device, comprising:
the coil component according to claim 1 ; and a circuit board on which the coil component has been mounted.

Assignees

• Taiyo Yuden Kk

Inventors

• Horie Katsuyuki

Classifications

• H01F27/263 Primary

  Fastening parts of the core together · CPC title

• H01F2017/0093

  Common mode choke coil · CPC title

• H01F3/10

  Composite arrangements of magnetic circuits · CPC title

• H01F17/045 Primary

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F2003/106

  Magnetic circuits using combinations of different magnetic materials · CPC title