Wiring member

US2020105441A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020105441-A1
Application numberUS-201916572981-A
CountryUS
Kind codeA1
Filing dateSep 17, 2019
Priority dateSep 28, 2018
Publication dateApr 2, 2020
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An object of the present disclosure is to provide a technique with which it is possible to more favorably crimp a bracket to a bracket attachment portion. A wiring member includes wires, a resin molded portion that covers the wires, and a bracket attachment that is attached to the resin molded portion. The resin molded portion includes a bracket attachment portion that is formed with at least one flat surface portion. The bracket includes a first attachment portion that is configured to be attached to an attachment location, and a second attachment portion that is connected to the first attachment portion and is crimped to the bracket attachment portion while being in surface contact with at least one of the at least one flat surface portion.

First claim

Opening claim text (preview).

What is claimed is: 1 . A wiring member comprising: a wire; a resin molded portion that includes a bracket attachment portion formed with at least one flat surface portion, and covers a periphery of the wire; and a bracket that includes a first attachment portion configured to be attached to an attachment location, and a second attachment portion that is connected to the first attachment portion and is crimped to the bracket attachment portion while being in surface contact with at least one of the at least one flat surface portion. 2 . The wiring member according to claim 1 , wherein the bracket attachment portion is formed such that a cross section thereof exhibits a quadrate shape and includes four flat surface portions, and the second attachment portion of the bracket is in surface contact with a plurality of the four flat surface portions. 3 . The wiring member according to claim 1 , wherein the wiring member includes a plurality of the wire, and further comprises a sheath that covers the plurality of wires, and the bracket attachment portion is formed to cover a periphery of the sheath. 4 . The wiring member according to claim 3 , wherein the resin molded portion covers an end portion of the sheath and a base end portion of the plurality of wires that extend from the end portion of the sheath.

Assignees

Inventors

Classifications

  • Protecting, fastening and routing means therefor · CPC title

  • Component parts, details, or accessories of power brake systems not covered by groups B60T8/00, B60T13/00 or B60T15/00, or presenting other characteristic features (air compressors per se F04) · CPC title

  • B60T17/046Primary

    Devices for pipe guiding and fixing · CPC title

  • Systems characterised by their speed sensor arrangements · CPC title

  • Cables with built-in connecting points or with predetermined areas for making deviations · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2020105441A1 cover?
An object of the present disclosure is to provide a technique with which it is possible to more favorably crimp a bracket to a bracket attachment portion. A wiring member includes wires, a resin molded portion that covers the wires, and a bracket attachment that is attached to the resin molded portion. The resin molded portion includes a bracket attachment portion that is formed with at least o…
Who is the assignee on this patent?
Sumitomo Wiring Systems
What technology area does this patent fall under?
Primary CPC classification B60R16/0215. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Apr 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).