Multilayer Stack with Enhanced Conductivity and Stability

Patent metadata

Field	Value
Publication number	US-2020105436-A1
Application number	US-201916700291-A
Country	US
Kind code	A1
Filing date	Dec 2, 2019
Priority date	Dec 21, 2017
Publication date	Apr 2, 2020
Grant date	—

Abstract

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

First claim

What is claimed is:

1 . A method comprising:
depositing an insulating layer on a substrate; forming a conductive polymer layer on the insulating layer; repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers, wherein the respective conductive polymer layers are configured to be electrically-connected in parallel to a power source; forming (i) a first electrical contact disposed on a first edge of each respective conductive polymer layer, and (ii) a second electrical contact on a second edge of the conductive polymer layer; and making electrical connections between respective first electrical contacts and respective second electrical contacts of at least a subset of the respective conductive polymer layers and respective switches configured to connect the respective first electrical contacts and the respective second electrical contacts to the power source, such that changing a number of switches that are activated changes a resultant electrical resistance of the multilayer stack.

2 . The method of claim 1 , wherein repeating the deposition of the respective insulating layer and the formation of the respective conductive layer comprises:
repeating the deposition of the respective insulating layer and the formation of the respective conductive layer until the resultant electrical resistance is substantially equal to a predetermined electrical resistance.

3 . The method of claim 1 , wherein repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form the multilayer stack comprises forming the multilayer stack to include each respective conductive polymer layer interfacing with two insulating layers, one insulating layer on each side of the respective conductive polymer layer.

4 . The method of claim 1 , further comprising:
treating the respective conductive polymer layers with a conductivity enhancer to enhance electrical conductivity of the respective conductive polymer layers.

5 . The method of claim 4 , wherein treating the respective conductive polymer layers with the conductivity enhancer comprises treating with a morphology enhancer or band modifier.

6 . The method of claim 1 , wherein forming the conductive polymer layer comprises forming the conductive polymer layer to include an intrinsic or extrinsic conductive polymer.

7 . The method of claim 1 , wherein depositing the insulating layer comprises depositing a resin layer including polyurethane, epoxy, thermoplastic, phenolic, or silicone material.

8 . The method of claim 1 , wherein forming the conductive polymer layer comprises forming a layer of Polyaniline-Dinonylnaphthalene sulfonic acid (PANI-DNNSA), poly(ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT-PSS), Polyaniline-dodecylbenzene sulfonic acid (PANI-DBSA), polypyrrole, graphene paint, carbon nanotubes paint, carbon black, conductive oxide, or metallic particles.

9 . The method of claim 1 , further comprising:
curing the insulating layer prior to forming the conductive polymer layer.

10 . The method of claim 1 , wherein repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form the multilayer stack comprises forming the multilayer stack to modify electrical resistivity over the substrate, such that a first location over the multilayer stack has an electrical resistivity that is different from a respective electrical resistivity at a second location over the multilayer stack.

11 . The method of claim 10 , wherein forming the multilayer stack to modify the electrical resistivity over the substrate comprises depositing a number of conductive polymer layers at the first location that is different from a respective number of conductive polymer layers at the second location in a longitudinal direction over the substrate.

12 . The method of claim 10 , wherein forming the multilayer stack to modify the electrical resistivity over the substrate comprises depositing conductive polymer layers having a type of conductive polymer at the first location that is different from a respective type of conductive polymer at the second location.

13 . The method of claim 10 , wherein forming the multilayer stack to modify the electrical resistivity over the substrate comprises depositing conductive polymer layers having a thickness at the first location that is different from a respective thickness of conductive polymer layers at the second location.

14 . A device comprising:
a substrate; a multilayer stack disposed on the substrate, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein the plurality of conductive polymer layers are configured to be electrically-connected in parallel to a power source, wherein each conductive polymer layer comprises: (i) a first electrical contact disposed on a first edge of the conductive polymer layer, and (ii) a second electrical contact on a second edge of the conductive polymer layer; and a plurality of switches that, when activated, are configured to electrically-connect respective first electrical contacts and second electrical contacts of at least a subset of conductive polymer layers of the plurality of conductive polymer layers to the power source, such that changing a number of switches that are activated changes a resultant electrical resistance of the multilayer stack.

15 . The device of claim 14 , wherein the conductive polymer layers are treated with a conductivity enhancer to enhance electrical conductivity of the conductive polymer layers.

16 . The device of claim 15 , wherein the conductivity enhancer comprises a morphology enhancer or band modifier.

17 . A component of an aircraft, the component comprising:
a multilayer stack disposed on or proximate to a surface of the component, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein each conductive polymer layer comprises: (i) a first electrical contact disposed on a first edge of the conductive polymer layer, and (ii) a second electrical contact on a second edge of the conductive polymer layer; and a plurality of switches that are independently actuatable and configured to electrically connect respective first electrical contacts and second electrical contacts of at least a subset of conductive polymer layers to a power source, such that changing a number of switches that are activated changes a resultant electrical resistance of, and an amount of heat generated by, the multilayer stack.

18 . The component of claim 17 , wherein a number of conductive polymer layers of the plurality of conductive polymer layers is selected such that when the conductive polymer layers are connected in parallel to the power source, the resultant electrical resistance of the conductive polymer layers is substantially equal to a predetermined electrical resistance.

19 . The component of claim 17 , wherein a number of the conductive polymer layers of the multilayer stack at a first location of the component is different from a number of the conductive polymer layers at a second location of the component so as to generate a different amount of heat at the first location compared to the second location w

Assignees

• Boeing Co

Inventors

• Kinlen Patrick J
• Flack Matthew A
• Bruton Eric A

Classifications

• H01C7/005

  Polymer thick films · CPC title

• H05B3/146

  Conductive polymers, e.g. polyethylene, thermoplastics · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• B64D15/12

  by electric heating (heating arrangements specially adapted for transparent or reflecting areas H05B3/84) · CPC title

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title